JPS5936938A - 集積回路実装装置 - Google Patents

集積回路実装装置

Info

Publication number
JPS5936938A
JPS5936938A JP14832082A JP14832082A JPS5936938A JP S5936938 A JPS5936938 A JP S5936938A JP 14832082 A JP14832082 A JP 14832082A JP 14832082 A JP14832082 A JP 14832082A JP S5936938 A JPS5936938 A JP S5936938A
Authority
JP
Japan
Prior art keywords
lead frame
shell
loading mechanism
mold
cylinder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14832082A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6229906B2 (enrdf_load_stackoverflow
Inventor
Nobumoto Ikehara
池原　総司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SEIEI KOSAN KK
Original Assignee
SEIEI KOSAN KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SEIEI KOSAN KK filed Critical SEIEI KOSAN KK
Priority to JP14832082A priority Critical patent/JPS5936938A/ja
Publication of JPS5936938A publication Critical patent/JPS5936938A/ja
Publication of JPS6229906B2 publication Critical patent/JPS6229906B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/008—Handling preformed parts, e.g. inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP14832082A 1982-08-25 1982-08-25 集積回路実装装置 Granted JPS5936938A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14832082A JPS5936938A (ja) 1982-08-25 1982-08-25 集積回路実装装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14832082A JPS5936938A (ja) 1982-08-25 1982-08-25 集積回路実装装置

Publications (2)

Publication Number Publication Date
JPS5936938A true JPS5936938A (ja) 1984-02-29
JPS6229906B2 JPS6229906B2 (enrdf_load_stackoverflow) 1987-06-29

Family

ID=15450144

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14832082A Granted JPS5936938A (ja) 1982-08-25 1982-08-25 集積回路実装装置

Country Status (1)

Country Link
JP (1) JPS5936938A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02284933A (ja) * 1989-04-27 1990-11-22 Sekisui Plastics Co Ltd スチレン系樹脂板状発泡体の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02284933A (ja) * 1989-04-27 1990-11-22 Sekisui Plastics Co Ltd スチレン系樹脂板状発泡体の製造方法

Also Published As

Publication number Publication date
JPS6229906B2 (enrdf_load_stackoverflow) 1987-06-29

Similar Documents

Publication Publication Date Title
US4146419A (en) Welding device for welding plastic strips
CN110509529A (zh) 热压成型机
CN115394509B (zh) 电位器自动组装机
JPH0794332B2 (ja) ガラス板を所望輪郭に成形する装置並びに方法
CN100579768C (zh) 门板多点同步热铆合机
JPS5936938A (ja) 集積回路実装装置
CN106271619B (zh) 光伏组件焊接加工一体设备
JP2004255742A (ja) スパウト挿入シール装置及び該装置を使用した製袋包装機
CN112077431B (zh) Vc散热器的铜网焊接工艺及其自动焊接机
CN210705991U (zh) 热压成型机
CN209077396U (zh) 一种3d玻璃真空热压治具翻转及平移装置
TWI304797B (enrdf_load_stackoverflow)
JP2004140047A (ja) 樹脂封止装置
CN115673209A (zh) 一种节能型的钢铁锻造装置
CN210116520U (zh) 一种组装式耐火材料用保温装置
CN110384310B (zh) 一种鞋头鞋踵冷热定型一体机
CN115071150A (zh) 一种变压器骨架注塑成型装置
CN219960862U (zh) 一种曲面基板加热装置
CN115338575B (zh) 一种hdmi数据线焊接机
JP3661137B2 (ja) プラスチック製中空体の製造装置
JP2022069793A (ja) 樹脂封止装置及びワーク搬送方法
CN220838398U (zh) 一种立式脉冲热压机
CN205929423U (zh) 具有翻模装置的直上直下开阖式双缸全自动橡胶油压机
CN222495410U (zh) 一种全自动晶圆覆膜机
CN214446389U (zh) 一种便于对燃热水箱焊丝进行夹取放置的机械手