JPS593550U - 大電力半導体用ステム - Google Patents

大電力半導体用ステム

Info

Publication number
JPS593550U
JPS593550U JP9907982U JP9907982U JPS593550U JP S593550 U JPS593550 U JP S593550U JP 9907982 U JP9907982 U JP 9907982U JP 9907982 U JP9907982 U JP 9907982U JP S593550 U JPS593550 U JP S593550U
Authority
JP
Japan
Prior art keywords
stem
high power
power semiconductors
glass
lead wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9907982U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6233327Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
薄永　行泰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP9907982U priority Critical patent/JPS593550U/ja
Publication of JPS593550U publication Critical patent/JPS593550U/ja
Application granted granted Critical
Publication of JPS6233327Y2 publication Critical patent/JPS6233327Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP9907982U 1982-06-30 1982-06-30 大電力半導体用ステム Granted JPS593550U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9907982U JPS593550U (ja) 1982-06-30 1982-06-30 大電力半導体用ステム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9907982U JPS593550U (ja) 1982-06-30 1982-06-30 大電力半導体用ステム

Publications (2)

Publication Number Publication Date
JPS593550U true JPS593550U (ja) 1984-01-11
JPS6233327Y2 JPS6233327Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-08-26

Family

ID=30234955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9907982U Granted JPS593550U (ja) 1982-06-30 1982-06-30 大電力半導体用ステム

Country Status (1)

Country Link
JP (1) JPS593550U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6332035A (ja) * 1986-07-26 1988-02-10 株式会社マブチ 組立型構造物に使用されるフロア・パネル

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6332035A (ja) * 1986-07-26 1988-02-10 株式会社マブチ 組立型構造物に使用されるフロア・パネル

Also Published As

Publication number Publication date
JPS6233327Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-08-26

Similar Documents

Publication Publication Date Title
JPS593550U (ja) 大電力半導体用ステム
JPS5822746U (ja) 半導体装置
JPS6042742U (ja) 半導体装置
JPS60937U (ja) 半導体チップの放熱構造
JPS593551U (ja) 半導体用ステム
JPS6064272U (ja) 半導体試験治具
JPS60163738U (ja) 半導体装置
JPS602841U (ja) 半導体取付基板
JPS592150U (ja) 電力用絶縁型半導体装置
JPS59101391U (ja) パネルヒ−タ
JPS5944052U (ja) 半導体装置
JPS59115660U (ja) 半導体素子の高耐圧絶縁構造
JPS60174244U (ja) 混成集積回路
JPS58166043U (ja) 大電力半導体用ステム
JPS59117165U (ja) 電気回路の放熱構造
JPS6022843U (ja) 半導体装置
JPS60163740U (ja) 半導体装置
JPS6066055U (ja) 半導体発光素子用パツケ−ジ
JPS6079752U (ja) 電力用半導体スタツク
JPS6146705U (ja) ヒユ−ズ抵抗器
JPS5895655U (ja) 半導体装置
JPS6130252U (ja) 半導体装置
JPS58434U (ja) 半導体装置
JPS5851449U (ja) 半導体装置用放熱板
JPS6113940U (ja) 半導体装置