JPS60937U - 半導体チップの放熱構造 - Google Patents

半導体チップの放熱構造

Info

Publication number
JPS60937U
JPS60937U JP1983091509U JP9150983U JPS60937U JP S60937 U JPS60937 U JP S60937U JP 1983091509 U JP1983091509 U JP 1983091509U JP 9150983 U JP9150983 U JP 9150983U JP S60937 U JPS60937 U JP S60937U
Authority
JP
Japan
Prior art keywords
heat dissipation
dissipation structure
semiconductor chip
chip heat
thermal resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983091509U
Other languages
English (en)
Other versions
JPS6350854Y2 (ja
Inventor
一郎 宗像
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP1983091509U priority Critical patent/JPS60937U/ja
Publication of JPS60937U publication Critical patent/JPS60937U/ja
Application granted granted Critical
Publication of JPS6350854Y2 publication Critical patent/JPS6350854Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の高電力半導体の放熱構造、第２図は本考
案の一実施例である。図において２は半導体チップ、３
は基板、５はヒートシンク、６はブロック、７はヒート
パイプ、８は放熱フィン、１１は絶縁板、１２は中継端
子板を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 熱抵抗の低い金属で形成したブロック、ヒートパイプお
    よび放熱フィンを一体化して構成したヒートシンクに、
    熱抵抗が低く電気的絶縁性の高い板を介して半導体チッ
    プを搭載することを特徴とする高電力半導体の放熱構造
    。
JP1983091509U 1983-06-15 1983-06-15 半導体チップの放熱構造 Granted JPS60937U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983091509U JPS60937U (ja) 1983-06-15 1983-06-15 半導体チップの放熱構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983091509U JPS60937U (ja) 1983-06-15 1983-06-15 半導体チップの放熱構造

Publications (2)

Publication Number Publication Date
JPS60937U true JPS60937U (ja) 1985-01-07
JPS6350854Y2 JPS6350854Y2 (ja) 1988-12-27

Family

ID=30221504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983091509U Granted JPS60937U (ja) 1983-06-15 1983-06-15 半導体チップの放熱構造

Country Status (1)

Country Link
JP (1) JPS60937U (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5561049A (en) * 1978-10-31 1980-05-08 Furukawa Electric Co Ltd:The Radiator for semiconductor
JPS57157551A (en) * 1981-03-25 1982-09-29 Hitachi Ltd Heat sink device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5561049A (en) * 1978-10-31 1980-05-08 Furukawa Electric Co Ltd:The Radiator for semiconductor
JPS57157551A (en) * 1981-03-25 1982-09-29 Hitachi Ltd Heat sink device

Also Published As

Publication number Publication date
JPS6350854Y2 (ja) 1988-12-27

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