JPS57157551A - Heat sink device - Google Patents

Heat sink device

Info

Publication number
JPS57157551A
JPS57157551A JP4243481A JP4243481A JPS57157551A JP S57157551 A JPS57157551 A JP S57157551A JP 4243481 A JP4243481 A JP 4243481A JP 4243481 A JP4243481 A JP 4243481A JP S57157551 A JPS57157551 A JP S57157551A
Authority
JP
Japan
Prior art keywords
heat sink
plates
heat
plate
walls
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4243481A
Other languages
Japanese (ja)
Inventor
Michio Yanatori
Aritaka Tatsumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Hitachi Ltd
Original Assignee
Hitachi Cable Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd, Hitachi Ltd filed Critical Hitachi Cable Ltd
Priority to JP4243481A priority Critical patent/JPS57157551A/en
Publication of JPS57157551A publication Critical patent/JPS57157551A/en
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain the titled device having high heat dissipating effect by providing many fins mounted at the end side of a heat transfer unit and a side wall formed vertically to a side plate. CONSTITUTION:An insulating plate 7 is secured onto a heat sink 6 with insulating collars 11 and screws 12, a semiconductor element 8 is mounted on the plate 7, and a heat pipe 1 in which porous substance 3 immersed with water, Freon or alcohol therein and made of metal gauze or glass wool is engaged through the heat sink 6. Then, fins 5 held by a plurality of side plates 4 are engaged via central holes opened at the plates 4 with the peripheral surface of the pipe 1 at the part projected from the heat sink 6, and one lower ends of the plates 4 are secured via screws 9, 9' to a housing wall 10. Thereafter, side walls 13 are bonded to both ends of the side plates, a heat sink device is formed in a chimney shape with the plates 4 and the walls 13, and air guide holes 14 are opened at the side walls 13 to enhance the chimney effect.
JP4243481A 1981-03-25 1981-03-25 Heat sink device Pending JPS57157551A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4243481A JPS57157551A (en) 1981-03-25 1981-03-25 Heat sink device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4243481A JPS57157551A (en) 1981-03-25 1981-03-25 Heat sink device

Publications (1)

Publication Number Publication Date
JPS57157551A true JPS57157551A (en) 1982-09-29

Family

ID=12635956

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4243481A Pending JPS57157551A (en) 1981-03-25 1981-03-25 Heat sink device

Country Status (1)

Country Link
JP (1) JPS57157551A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60937U (en) * 1983-06-15 1985-01-07 富士通株式会社 Semiconductor chip heat dissipation structure
JP2003209328A (en) * 2002-01-17 2003-07-25 Nec Toshiba Space System Kk Printed circuit board heat dissipation structure and card-type structure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60937U (en) * 1983-06-15 1985-01-07 富士通株式会社 Semiconductor chip heat dissipation structure
JPS6350854Y2 (en) * 1983-06-15 1988-12-27
JP2003209328A (en) * 2002-01-17 2003-07-25 Nec Toshiba Space System Kk Printed circuit board heat dissipation structure and card-type structure

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