JPS6350854Y2 - - Google Patents

Description

[Detailed Description of the Invention] (a) Technical Field of the Invention The present invention relates to a heat dissipation structure for a semiconductor chip, and particularly to a heat dissipation structure for a high power hybrid integrated circuit device.

(b) Background of the technology Since conventional hybrid integrated circuit devices have been widely used in fields with relatively low power levels, no special consideration has been given to the heat dissipation of the semiconductor chips on which they are mounted. However, as hybrid integrated circuit elements are increasingly used in high-power fields such as power supply circuits, control circuits for various motors, and power amplifier circuits, their heat dissipation structure has become a problem, making them unsuitable for high-density packaging. There is a growing demand for the development of heat dissipation structures.

(c) Prior art and problems Figure 1 shows the heat dissipation structure of a conventional semiconductor chip. A semiconductor chip 2 is mounted on a block 1 made of a metal with low thermal resistance and large heat capacity, such as copper or aluminum, and this is fixed to a substrate 3 to radiate heat through the substrate 3. Terminals of the semiconductor chip 2 and circuits on a substrate 3 (not shown) are connected by bonding wires 4. However, when multiple high-power semiconductor chips are mounted on the same substrate 3, unless the area occupied by each semiconductor chip is sufficiently large, thermal interference will occur between the semiconductor chips through the substrate 3, causing damage to each semiconductor. Conventional heat dissipation structures have not been able to mount high-power semiconductor chips in high density due to problems such as an increase in chip temperature. That is, deficiencies in the heat dissipation structure are one of the factors that impede high-density packaging of high-power semiconductor chips.

(d) Purpose of the invention The purpose of the invention is to provide a heat dissipation structure that enables high-density packaging of high-power semiconductor chips by reducing the thermal resistance of the heat sink and improving heat dissipation.

(e) Structure of the invention The purpose of this heat sink is to integrate a metal block and heat dissipation fins by connecting them with a heat pipe.The lower surface of the block is fixed to a substrate, and the upper surface of the block is attached with an electrically insulating plate interposed therebetween. This is achieved by mounting a semiconductor chip on the board and connecting the semiconductor chip and the circuit on the board with bonding wires.

(f) Example of the idea A heat pipe is a metal pipe in which a porous material called wick is pasted inside the pipe, and after the inside of the pipe is once evacuated, a small amount of liquid is filled in, just enough to completely wet the wick. It is sealed. When one end of the heat pipe is heated to warm the liquid contained in the pipe, since the inside of the heat pipe is at saturated vapor pressure, the heated filled liquid immediately evaporates and absorbs a large amount of heat. Move to the other end of the heat pipe. When the other end of the heat pipe is cooled, the vaporized liquid immediately returns to its original state and is absorbed into the wick. Its characteristics include rapid heat transfer and a large amount of heat transport. Therefore, on the heat absorption side, thermal resistance is low and the surrounding area is uniformly cooled. This invention was created by focusing on the characteristics of heat pipes.
Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 2 shows an embodiment of the present invention, and the same objects as in FIG. 1 are denoted by the same symbols.

In the figure, the heat sink 5 is a block 6 made of a metal with low thermal resistance, such as copper or aluminum.
Consists of a heat pipe 7 and a heat radiation fin 8,
The heat absorption side of the heat pipe 7 is connected to the hole 9 of the block 6.
Furthermore, the heat dissipation agent of the heat pipe 7 is fitted into the hole 10 of the heat dissipation fin 8 and integrated. The lower surface of the block 6 is fixed to the substrate 3, and one or more semiconductor chips 2 are mounted on the upper surface via a plate 11 having low thermal resistance and high electrical insulation, such as a thin ceramic plate. Further, a relay terminal plate 12 is provided on the upper surface of the block 6, and a relay terminal plate 12 is provided on the upper surface of the block 6.
A bonding wire (not shown) is used to connect between the terminal and the relay terminal plate 12, and between the relay terminal plate 12 and the circuit on the substrate 3 (not shown). It is also possible to omit the relay terminal plate 12 and directly connect the terminals of the semiconductor chip 2 to a circuit on the substrate 3 (not shown).

(g) Effects of the invention As described above, the invention enables the reduction of the thermal resistance of the heat sink, the transport of a large amount of heat, and the radiation of a large amount of heat, making it possible to implement high-density packaging of high-power semiconductors and to reduce the temperature. Through uniformity, it is possible to provide a heat dissipation structure that enables high output and stabilization of the circuit.

[Brief explanation of the drawing]

Figure 1 shows the heat dissipation structure of a conventional semiconductor chip;
The figure shows one embodiment of the present invention. In the figure, 2 is a semiconductor chip, 3 is a substrate, 5 is a heat sink, 6 is a block, 7 is a heat pipe, 8 is a radiation fin, 11 is an insulating plate, and 12 is a relay terminal board.

Claims (1)

[Scope of utility model registration request] A heat sink is made by combining a metal block and a heat dissipation fin with a heat pipe, and the lower surface of the block is fixed to a substrate, and a semiconductor chip is mounted on the upper surface of the block via an electrically insulating plate. A heat dissipation structure for a semiconductor chip, characterized in that it is configured to be connected to a circuit on the substrate using a bonding wire.