JPS59232845A - 金属箔張り金属基板の製法 - Google Patents
金属箔張り金属基板の製法Info
- Publication number
- JPS59232845A JPS59232845A JP10740383A JP10740383A JPS59232845A JP S59232845 A JPS59232845 A JP S59232845A JP 10740383 A JP10740383 A JP 10740383A JP 10740383 A JP10740383 A JP 10740383A JP S59232845 A JPS59232845 A JP S59232845A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- foil
- substrate
- covered
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims description 48
- 239000011888 foil Substances 0.000 title claims description 24
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 50
- 239000002184 metal Substances 0.000 claims description 50
- 238000000034 method Methods 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 description 33
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 33
- 239000010410 layer Substances 0.000 description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 239000011889 copper foil Substances 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 229910000831 Steel Inorganic materials 0.000 description 7
- 239000010959 steel Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000007654 immersion Methods 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000011417 postcuring Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- RCJVRSBWZCNNQT-UHFFFAOYSA-N dichloridooxygen Chemical compound ClOCl RCJVRSBWZCNNQT-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 102100035954 Choline transporter-like protein 2 Human genes 0.000 description 1
- 101000948115 Homo sapiens Choline transporter-like protein 2 Proteins 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000007603 infrared drying Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10740383A JPS59232845A (ja) | 1983-06-15 | 1983-06-15 | 金属箔張り金属基板の製法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10740383A JPS59232845A (ja) | 1983-06-15 | 1983-06-15 | 金属箔張り金属基板の製法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59232845A true JPS59232845A (ja) | 1984-12-27 |
| JPH0216696B2 JPH0216696B2 (enrdf_load_stackoverflow) | 1990-04-18 |
Family
ID=14458258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10740383A Granted JPS59232845A (ja) | 1983-06-15 | 1983-06-15 | 金属箔張り金属基板の製法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59232845A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1088072A (ja) * | 1996-09-11 | 1998-04-07 | Toyo Seimitsu Kogyo Kk | 自動化供給を容易にする金属薄片の仮止めシート及び その製造方法。 |
| JP2017515699A (ja) * | 2014-03-24 | 2017-06-15 | エムジーアイ デジタル テクノロジー | 金メッキするための方法およびシステム |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59167248A (ja) * | 1983-03-14 | 1984-09-20 | 松下電器産業株式会社 | 金属積層体の形成方法 |
-
1983
- 1983-06-15 JP JP10740383A patent/JPS59232845A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59167248A (ja) * | 1983-03-14 | 1984-09-20 | 松下電器産業株式会社 | 金属積層体の形成方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1088072A (ja) * | 1996-09-11 | 1998-04-07 | Toyo Seimitsu Kogyo Kk | 自動化供給を容易にする金属薄片の仮止めシート及び その製造方法。 |
| JP2017515699A (ja) * | 2014-03-24 | 2017-06-15 | エムジーアイ デジタル テクノロジー | 金メッキするための方法およびシステム |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0216696B2 (enrdf_load_stackoverflow) | 1990-04-18 |
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