JPH0416038B2 - - Google Patents
Info
- Publication number
- JPH0416038B2 JPH0416038B2 JP60015400A JP1540085A JPH0416038B2 JP H0416038 B2 JPH0416038 B2 JP H0416038B2 JP 60015400 A JP60015400 A JP 60015400A JP 1540085 A JP1540085 A JP 1540085A JP H0416038 B2 JPH0416038 B2 JP H0416038B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- temperature
- pressure
- adhesive layer
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 43
- 239000002184 metal Substances 0.000 claims description 43
- 239000000853 adhesive Substances 0.000 claims description 28
- 230000001070 adhesive effect Effects 0.000 claims description 28
- 239000012790 adhesive layer Substances 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 25
- 239000011888 foil Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 17
- 238000001879 gelation Methods 0.000 claims description 16
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 14
- 238000003825 pressing Methods 0.000 claims description 14
- 238000011282 treatment Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052742 iron Inorganic materials 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 24
- 238000010438 heat treatment Methods 0.000 description 13
- 238000010292 electrical insulation Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 4
- 239000004744 fabric Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60015400A JPS61176195A (ja) | 1985-01-31 | 1985-01-31 | 放熱性電気絶縁基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60015400A JPS61176195A (ja) | 1985-01-31 | 1985-01-31 | 放熱性電気絶縁基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61176195A JPS61176195A (ja) | 1986-08-07 |
| JPH0416038B2 true JPH0416038B2 (enrdf_load_stackoverflow) | 1992-03-19 |
Family
ID=11887679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60015400A Granted JPS61176195A (ja) | 1985-01-31 | 1985-01-31 | 放熱性電気絶縁基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61176195A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0687513B2 (ja) * | 1990-04-11 | 1994-11-02 | 新日本製鐵株式会社 | プリント配線板用銅張り積層板の製造方法 |
| JP2008296495A (ja) * | 2007-06-01 | 2008-12-11 | Denki Kagaku Kogyo Kk | 金属ベース基板の製造方法 |
-
1985
- 1985-01-31 JP JP60015400A patent/JPS61176195A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61176195A (ja) | 1986-08-07 |
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