JPS5922351A - 混成集積回路の製造方法 - Google Patents
混成集積回路の製造方法Info
- Publication number
- JPS5922351A JPS5922351A JP57131561A JP13156182A JPS5922351A JP S5922351 A JPS5922351 A JP S5922351A JP 57131561 A JP57131561 A JP 57131561A JP 13156182 A JP13156182 A JP 13156182A JP S5922351 A JPS5922351 A JP S5922351A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- piece
- alloy
- metallic
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W90/00—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57131561A JPS5922351A (ja) | 1982-07-28 | 1982-07-28 | 混成集積回路の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57131561A JPS5922351A (ja) | 1982-07-28 | 1982-07-28 | 混成集積回路の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5922351A true JPS5922351A (ja) | 1984-02-04 |
| JPH0456461B2 JPH0456461B2 (cg-RX-API-DMAC10.html) | 1992-09-08 |
Family
ID=15060939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57131561A Granted JPS5922351A (ja) | 1982-07-28 | 1982-07-28 | 混成集積回路の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5922351A (cg-RX-API-DMAC10.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61202839U (cg-RX-API-DMAC10.html) * | 1985-06-10 | 1986-12-19 | ||
| JPS6256310U (cg-RX-API-DMAC10.html) * | 1985-09-28 | 1987-04-08 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6259461A (ja) * | 1985-09-10 | 1987-03-16 | Matsushita Electric Ind Co Ltd | バイポ−ラ型イメ−ジセンサ集積回路 |
-
1982
- 1982-07-28 JP JP57131561A patent/JPS5922351A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6259461A (ja) * | 1985-09-10 | 1987-03-16 | Matsushita Electric Ind Co Ltd | バイポ−ラ型イメ−ジセンサ集積回路 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61202839U (cg-RX-API-DMAC10.html) * | 1985-06-10 | 1986-12-19 | ||
| JPS6256310U (cg-RX-API-DMAC10.html) * | 1985-09-28 | 1987-04-08 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0456461B2 (cg-RX-API-DMAC10.html) | 1992-09-08 |
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