JPS5922351A - 混成集積回路の製造方法 - Google Patents

混成集積回路の製造方法

Info

Publication number
JPS5922351A
JPS5922351A JP13156182A JP13156182A JPS5922351A JP S5922351 A JPS5922351 A JP S5922351A JP 13156182 A JP13156182 A JP 13156182A JP 13156182 A JP13156182 A JP 13156182A JP S5922351 A JPS5922351 A JP S5922351A
Authority
JP
Japan
Prior art keywords
lead
hybrid integrated
leads
alloy
metal piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13156182A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0456461B2 (OSRAM
Inventor
Fumio Tanabe
田辺　文夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP13156182A priority Critical patent/JPS5922351A/ja
Publication of JPS5922351A publication Critical patent/JPS5922351A/ja
Publication of JPH0456461B2 publication Critical patent/JPH0456461B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP13156182A 1982-07-28 1982-07-28 混成集積回路の製造方法 Granted JPS5922351A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13156182A JPS5922351A (ja) 1982-07-28 1982-07-28 混成集積回路の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13156182A JPS5922351A (ja) 1982-07-28 1982-07-28 混成集積回路の製造方法

Publications (2)

Publication Number Publication Date
JPS5922351A true JPS5922351A (ja) 1984-02-04
JPH0456461B2 JPH0456461B2 (OSRAM) 1992-09-08

Family

ID=15060939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13156182A Granted JPS5922351A (ja) 1982-07-28 1982-07-28 混成集積回路の製造方法

Country Status (1)

Country Link
JP (1) JPS5922351A (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61202839U (OSRAM) * 1985-06-10 1986-12-19
JPS6256310U (OSRAM) * 1985-09-28 1987-04-08

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6259461A (ja) * 1985-09-10 1987-03-16 Matsushita Electric Ind Co Ltd バイポ−ラ型イメ−ジセンサ集積回路

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6259461A (ja) * 1985-09-10 1987-03-16 Matsushita Electric Ind Co Ltd バイポ−ラ型イメ−ジセンサ集積回路

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61202839U (OSRAM) * 1985-06-10 1986-12-19
JPS6256310U (OSRAM) * 1985-09-28 1987-04-08

Also Published As

Publication number Publication date
JPH0456461B2 (OSRAM) 1992-09-08

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