JPS5922333A - Ｉｃの樹脂封止方法 - Google Patents
Ｉｃの樹脂封止方法Info
- Publication number
- JPS5922333A JPS5922333A JP13184482A JP13184482A JPS5922333A JP S5922333 A JPS5922333 A JP S5922333A JP 13184482 A JP13184482 A JP 13184482A JP 13184482 A JP13184482 A JP 13184482A JP S5922333 A JPS5922333 A JP S5922333A
- Authority
- JP
- Japan
- Prior art keywords
- film carrier
- sealing
- resin
- reel
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000007789 sealing Methods 0.000 title claims abstract description 32
- 229920005989 resin Polymers 0.000 title claims abstract description 22
- 239000011347 resin Substances 0.000 title claims abstract description 22
- 230000014759 maintenance of location Effects 0.000 claims description 5
- 238000005096 rolling process Methods 0.000 abstract 1
- 238000012216 screening Methods 0.000 abstract 1
- 238000007650 screen-printing Methods 0.000 description 5
- 238000004804 winding Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 230000000452 restraining effect Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13184482A JPS5922333A (ja) | 1982-07-28 | 1982-07-28 | Ｉｃの樹脂封止方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13184482A JPS5922333A (ja) | 1982-07-28 | 1982-07-28 | Ｉｃの樹脂封止方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5922333A true JPS5922333A (ja) | 1984-02-04 |
| JPH0313750B2 JPH0313750B2 (enrdf_load_stackoverflow) | 1991-02-25 |
Family
ID=15067418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13184482A Granted JPS5922333A (ja) | 1982-07-28 | 1982-07-28 | Ｉｃの樹脂封止方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5922333A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2774810A1 (fr) * | 1998-02-10 | 1999-08-13 | St Microelectronics Sa | Boitier semi-conducteur blinde et procede pour sa fabrication |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5365062A (en) * | 1976-11-24 | 1978-06-10 | Hitachi Ltd | Production of semiconductor and apparatus for the same |
| JPS5365052A (en) * | 1976-11-22 | 1978-06-10 | Nec Corp | High speed logic circuit |
-
1982
- 1982-07-28 JP JP13184482A patent/JPS5922333A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5365052A (en) * | 1976-11-22 | 1978-06-10 | Nec Corp | High speed logic circuit |
| JPS5365062A (en) * | 1976-11-24 | 1978-06-10 | Hitachi Ltd | Production of semiconductor and apparatus for the same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2774810A1 (fr) * | 1998-02-10 | 1999-08-13 | St Microelectronics Sa | Boitier semi-conducteur blinde et procede pour sa fabrication |
| US6312975B1 (en) | 1998-02-10 | 2001-11-06 | Stmicroelectronics S.A. | Semiconductor package and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0313750B2 (enrdf_load_stackoverflow) | 1991-02-25 |
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