JPS59220933A - 半導体素子用モ−ルド樹脂の予熱装置 - Google Patents
半導体素子用モ−ルド樹脂の予熱装置Info
- Publication number
- JPS59220933A JPS59220933A JP9602783A JP9602783A JPS59220933A JP S59220933 A JPS59220933 A JP S59220933A JP 9602783 A JP9602783 A JP 9602783A JP 9602783 A JP9602783 A JP 9602783A JP S59220933 A JPS59220933 A JP S59220933A
- Authority
- JP
- Japan
- Prior art keywords
- waveguide
- tablet
- mold
- resin
- microwave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 43
- 239000011347 resin Substances 0.000 title claims abstract description 43
- 238000000465 moulding Methods 0.000 title claims abstract description 18
- 239000004065 semiconductor Substances 0.000 title claims description 18
- 238000007789 sealing Methods 0.000 claims description 9
- GXCLVBGFBYZDAG-UHFFFAOYSA-N N-[2-(1H-indol-3-yl)ethyl]-N-methylprop-2-en-1-amine Chemical compound CN(CCC1=CNC2=C1C=CC=C2)CC=C GXCLVBGFBYZDAG-UHFFFAOYSA-N 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 8
- 238000009826 distribution Methods 0.000 abstract description 6
- 230000005684 electric field Effects 0.000 abstract description 5
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- 238000001723 curing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000005281 excited state Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- XGFJCRNRWOXGQM-UHFFFAOYSA-N hot-2 Chemical compound CCSC1=CC(OC)=C(CCNO)C=C1OC XGFJCRNRWOXGQM-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/462—Injection of preformed charges of material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9602783A JPS59220933A (ja) | 1983-05-31 | 1983-05-31 | 半導体素子用モ−ルド樹脂の予熱装置 |
| DE19843420280 DE3420280A1 (de) | 1983-05-31 | 1984-05-30 | Vorrichtung zum vorwaermen von pressharz fuer eine halbleitervorrichtung |
| GB08413715A GB2141909B (en) | 1983-05-31 | 1984-05-30 | Apparatus for preheating mold resin for a semiconductor device |
| US06/615,463 US4577078A (en) | 1983-05-31 | 1984-05-30 | Apparatus for preheating mold resin for a semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9602783A JPS59220933A (ja) | 1983-05-31 | 1983-05-31 | 半導体素子用モ−ルド樹脂の予熱装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59220933A true JPS59220933A (ja) | 1984-12-12 |
| JPS6355862B2 JPS6355862B2 (enrdf_load_stackoverflow) | 1988-11-04 |
Family
ID=14153889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9602783A Granted JPS59220933A (ja) | 1983-05-31 | 1983-05-31 | 半導体素子用モ−ルド樹脂の予熱装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59220933A (enrdf_load_stackoverflow) |
-
1983
- 1983-05-31 JP JP9602783A patent/JPS59220933A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6355862B2 (enrdf_load_stackoverflow) | 1988-11-04 |
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