JPS59218292A - レ−ザ加工装置 - Google Patents

レ−ザ加工装置

Info

Publication number
JPS59218292A
JPS59218292A JP58091865A JP9186583A JPS59218292A JP S59218292 A JPS59218292 A JP S59218292A JP 58091865 A JP58091865 A JP 58091865A JP 9186583 A JP9186583 A JP 9186583A JP S59218292 A JPS59218292 A JP S59218292A
Authority
JP
Japan
Prior art keywords
total reflection
beams
laser beam
parallel
reflected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58091865A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6258832B2 (en, 2012
Inventor
Toru Takahama
高浜　亨
Takaharu Ueda
植田　隆治
Susumu Hoshinouchi
星之内　進
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP58091865A priority Critical patent/JPS59218292A/ja
Publication of JPS59218292A publication Critical patent/JPS59218292A/ja
Publication of JPS6258832B2 publication Critical patent/JPS6258832B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP58091865A 1983-05-25 1983-05-25 レ−ザ加工装置 Granted JPS59218292A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58091865A JPS59218292A (ja) 1983-05-25 1983-05-25 レ−ザ加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58091865A JPS59218292A (ja) 1983-05-25 1983-05-25 レ−ザ加工装置

Publications (2)

Publication Number Publication Date
JPS59218292A true JPS59218292A (ja) 1984-12-08
JPS6258832B2 JPS6258832B2 (en, 2012) 1987-12-08

Family

ID=14038445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58091865A Granted JPS59218292A (ja) 1983-05-25 1983-05-25 レ−ザ加工装置

Country Status (1)

Country Link
JP (1) JPS59218292A (en, 2012)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6417487B2 (en) * 1998-06-08 2002-07-09 Mitsubishi Heavy Industries, Ltd. Laser beam machining head
WO2006135237A3 (en) * 2005-06-02 2007-03-29 Fico Bv Device and method for processing electronic components with a double cutting flow
WO2008049389A1 (de) * 2006-10-25 2008-05-02 Lpkf Laser & Electronics Ag Vorrichtung zur bearbeitung eines werkstücks mittels laserstrahlung
DE102007056254A1 (de) * 2007-11-21 2009-05-28 Lpkf Laser & Electronics Ag Vorrichtung zur Bearbeitung eines Werkstücks mittels paralleler Laserstrahlen
DE102009016385A1 (de) 2008-05-29 2009-08-27 Lpkf Laser & Electronics Ag Vorrichtung zur Bearbeitung eines Werkstücks mittels Laserstrahlen
DE102008053507A1 (de) 2008-10-28 2010-07-08 Lpkf Laser & Electronics Ag Vorrichtung zur Bearbeitung eines Werkstücks mittels Laserstrahlen
JP2011121104A (ja) * 2009-12-14 2011-06-23 Kawasaki Heavy Ind Ltd レーザ加工ヘッド、及びそれを備えるレーザ加工装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6417487B2 (en) * 1998-06-08 2002-07-09 Mitsubishi Heavy Industries, Ltd. Laser beam machining head
WO2006135237A3 (en) * 2005-06-02 2007-03-29 Fico Bv Device and method for processing electronic components with a double cutting flow
WO2008049389A1 (de) * 2006-10-25 2008-05-02 Lpkf Laser & Electronics Ag Vorrichtung zur bearbeitung eines werkstücks mittels laserstrahlung
DE102007056254A1 (de) * 2007-11-21 2009-05-28 Lpkf Laser & Electronics Ag Vorrichtung zur Bearbeitung eines Werkstücks mittels paralleler Laserstrahlen
DE102007056254B4 (de) * 2007-11-21 2009-10-29 Lpkf Laser & Electronics Ag Vorrichtung zur Bearbeitung eines Werkstücks mittels paralleler Laserstrahlen
JP2011505253A (ja) * 2007-11-21 2011-02-24 エル・ピー・ケー・エフ・レーザー・ウント・エレクトロニクス・アクチエンゲゼルシヤフト 平行なレーザー光を用いて加工片を加工するための装置
US8314362B2 (en) 2007-11-21 2012-11-20 Lpkf Laser & Electronics Ag Device for machining a workpiece by means of parallel laser beams
DE102009016385A1 (de) 2008-05-29 2009-08-27 Lpkf Laser & Electronics Ag Vorrichtung zur Bearbeitung eines Werkstücks mittels Laserstrahlen
DE102008053507A1 (de) 2008-10-28 2010-07-08 Lpkf Laser & Electronics Ag Vorrichtung zur Bearbeitung eines Werkstücks mittels Laserstrahlen
JP2011121104A (ja) * 2009-12-14 2011-06-23 Kawasaki Heavy Ind Ltd レーザ加工ヘッド、及びそれを備えるレーザ加工装置

Also Published As

Publication number Publication date
JPS6258832B2 (en, 2012) 1987-12-08

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