JPS59207636A - 半導体樹脂封止装置 - Google Patents
半導体樹脂封止装置Info
- Publication number
- JPS59207636A JPS59207636A JP8223083A JP8223083A JPS59207636A JP S59207636 A JPS59207636 A JP S59207636A JP 8223083 A JP8223083 A JP 8223083A JP 8223083 A JP8223083 A JP 8223083A JP S59207636 A JPS59207636 A JP S59207636A
- Authority
- JP
- Japan
- Prior art keywords
- cylinder
- resin sealing
- resin
- regulator
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title claims abstract description 25
- 229920005989 resin Polymers 0.000 title claims abstract description 25
- 238000007789 sealing Methods 0.000 title claims abstract description 13
- 239000004065 semiconductor Substances 0.000 title claims abstract description 9
- 238000002347 injection Methods 0.000 claims description 11
- 239000007924 injection Substances 0.000 claims description 11
- 238000005538 encapsulation Methods 0.000 claims description 4
- 230000003749 cleanliness Effects 0.000 abstract description 4
- 239000000428 dust Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/70—Means for plasticising or homogenising the moulding material or forcing it into the mould, combined with mould opening, closing or clamping devices
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8223083A JPS59207636A (ja) | 1983-05-11 | 1983-05-11 | 半導体樹脂封止装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8223083A JPS59207636A (ja) | 1983-05-11 | 1983-05-11 | 半導体樹脂封止装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59207636A true JPS59207636A (ja) | 1984-11-24 |
| JPH0131294B2 JPH0131294B2 (enrdf_load_stackoverflow) | 1989-06-26 |
Family
ID=13768600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8223083A Granted JPS59207636A (ja) | 1983-05-11 | 1983-05-11 | 半導体樹脂封止装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59207636A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6279633A (ja) * | 1985-10-03 | 1987-04-13 | Mitsubishi Electric Corp | 樹脂封止装置 |
| JPS62154914U (enrdf_load_stackoverflow) * | 1986-03-24 | 1987-10-01 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0368996U (enrdf_load_stackoverflow) * | 1989-11-01 | 1991-07-08 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5229957A (en) * | 1975-09-03 | 1977-03-07 | Hitachi Ltd | Oil immersed electric apparatus |
| JPS5229857A (en) * | 1975-09-03 | 1977-03-07 | Hitachi Ltd | Method of filling resin and apparatus |
| JPS5630841A (en) * | 1979-08-24 | 1981-03-28 | Towa Seimitsu Kogyo Kk | Plastic molding method and metallic mold therefor |
| JPS5649207A (en) * | 1979-09-28 | 1981-05-02 | Hitachi Ltd | Molding die |
| JPS5775435A (en) * | 1980-10-29 | 1982-05-12 | Mitsubishi Electric Corp | Liquid transfer molding |
| JPS6431294A (en) * | 1987-07-27 | 1989-02-01 | Hino Motors Ltd | Vehicle abnormality sensing informing device |
-
1983
- 1983-05-11 JP JP8223083A patent/JPS59207636A/ja active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5229957A (en) * | 1975-09-03 | 1977-03-07 | Hitachi Ltd | Oil immersed electric apparatus |
| JPS5229857A (en) * | 1975-09-03 | 1977-03-07 | Hitachi Ltd | Method of filling resin and apparatus |
| JPS5630841A (en) * | 1979-08-24 | 1981-03-28 | Towa Seimitsu Kogyo Kk | Plastic molding method and metallic mold therefor |
| JPS5649207A (en) * | 1979-09-28 | 1981-05-02 | Hitachi Ltd | Molding die |
| JPS5775435A (en) * | 1980-10-29 | 1982-05-12 | Mitsubishi Electric Corp | Liquid transfer molding |
| JPS6431294A (en) * | 1987-07-27 | 1989-02-01 | Hino Motors Ltd | Vehicle abnormality sensing informing device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6279633A (ja) * | 1985-10-03 | 1987-04-13 | Mitsubishi Electric Corp | 樹脂封止装置 |
| JPS62154914U (enrdf_load_stackoverflow) * | 1986-03-24 | 1987-10-01 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0131294B2 (enrdf_load_stackoverflow) | 1989-06-26 |
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