JPS59207636A - 半導体樹脂封止装置 - Google Patents

半導体樹脂封止装置

Info

Publication number
JPS59207636A
JPS59207636A JP8223083A JP8223083A JPS59207636A JP S59207636 A JPS59207636 A JP S59207636A JP 8223083 A JP8223083 A JP 8223083A JP 8223083 A JP8223083 A JP 8223083A JP S59207636 A JPS59207636 A JP S59207636A
Authority
JP
Japan
Prior art keywords
cylinder
resin sealing
resin
regulator
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8223083A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0131294B2 (enrdf_load_stackoverflow
Inventor
Yoshinari Fukumoto
福本 好成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP8223083A priority Critical patent/JPS59207636A/ja
Publication of JPS59207636A publication Critical patent/JPS59207636A/ja
Publication of JPH0131294B2 publication Critical patent/JPH0131294B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/70Means for plasticising or homogenising the moulding material or forcing it into the mould, combined with mould opening, closing or clamping devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP8223083A 1983-05-11 1983-05-11 半導体樹脂封止装置 Granted JPS59207636A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8223083A JPS59207636A (ja) 1983-05-11 1983-05-11 半導体樹脂封止装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8223083A JPS59207636A (ja) 1983-05-11 1983-05-11 半導体樹脂封止装置

Publications (2)

Publication Number Publication Date
JPS59207636A true JPS59207636A (ja) 1984-11-24
JPH0131294B2 JPH0131294B2 (enrdf_load_stackoverflow) 1989-06-26

Family

ID=13768600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8223083A Granted JPS59207636A (ja) 1983-05-11 1983-05-11 半導体樹脂封止装置

Country Status (1)

Country Link
JP (1) JPS59207636A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6279633A (ja) * 1985-10-03 1987-04-13 Mitsubishi Electric Corp 樹脂封止装置
JPS62154914U (enrdf_load_stackoverflow) * 1986-03-24 1987-10-01

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0368996U (enrdf_load_stackoverflow) * 1989-11-01 1991-07-08

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5229957A (en) * 1975-09-03 1977-03-07 Hitachi Ltd Oil immersed electric apparatus
JPS5229857A (en) * 1975-09-03 1977-03-07 Hitachi Ltd Method of filling resin and apparatus
JPS5630841A (en) * 1979-08-24 1981-03-28 Towa Seimitsu Kogyo Kk Plastic molding method and metallic mold therefor
JPS5649207A (en) * 1979-09-28 1981-05-02 Hitachi Ltd Molding die
JPS5775435A (en) * 1980-10-29 1982-05-12 Mitsubishi Electric Corp Liquid transfer molding
JPS6431294A (en) * 1987-07-27 1989-02-01 Hino Motors Ltd Vehicle abnormality sensing informing device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5229957A (en) * 1975-09-03 1977-03-07 Hitachi Ltd Oil immersed electric apparatus
JPS5229857A (en) * 1975-09-03 1977-03-07 Hitachi Ltd Method of filling resin and apparatus
JPS5630841A (en) * 1979-08-24 1981-03-28 Towa Seimitsu Kogyo Kk Plastic molding method and metallic mold therefor
JPS5649207A (en) * 1979-09-28 1981-05-02 Hitachi Ltd Molding die
JPS5775435A (en) * 1980-10-29 1982-05-12 Mitsubishi Electric Corp Liquid transfer molding
JPS6431294A (en) * 1987-07-27 1989-02-01 Hino Motors Ltd Vehicle abnormality sensing informing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6279633A (ja) * 1985-10-03 1987-04-13 Mitsubishi Electric Corp 樹脂封止装置
JPS62154914U (enrdf_load_stackoverflow) * 1986-03-24 1987-10-01

Also Published As

Publication number Publication date
JPH0131294B2 (enrdf_load_stackoverflow) 1989-06-26

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