JPS59207636A - Resin sealing device for semiconductor - Google Patents
Resin sealing device for semiconductorInfo
- Publication number
- JPS59207636A JPS59207636A JP8223083A JP8223083A JPS59207636A JP S59207636 A JPS59207636 A JP S59207636A JP 8223083 A JP8223083 A JP 8223083A JP 8223083 A JP8223083 A JP 8223083A JP S59207636 A JPS59207636 A JP S59207636A
- Authority
- JP
- Japan
- Prior art keywords
- cylinder
- resin sealing
- resin
- regulator
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/70—Means for plasticising or homogenising the moulding material or forcing it into the mould, combined with mould opening, closing or clamping devices
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は、半導体樹脂封止用射出成形機（以下、モー
ルド成形機という）に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an injection molding machine for encapsulating semiconductor resin (hereinafter referred to as a molding machine).
従来、半導体装置の樹脂封止に使用されるモールド成形
機は、第１図に示すように成形機本体７に上下のモール
ド金型４，５をクランプする型締めシリンダー６、該金
型４，５に樹脂を射出する射出シリンダー１、射出圧力
平衡用シリンダー３、成形済製品を金型から離形させる
エジェクトシリンダー２が備え付けてあり、これら各樹
脂封止用シリンダーとして油圧式シリンダーが用い、ら
れていた。また、８は成形機のポストである。したがっ
て、各モールド成形機毎に、油圧駆動用モータ９、油圧
制御部１０、油圧駆動用ポンプ１１、オイルタンク１２
からなる油圧駆動部を設置する必要があるため、その重
量及び外寸が非常に大きく、また発生する騒音も大きな
ものであった。又、油圧回路はその保守点検に多大な時
間を必要とすると共に作動油を使用するため、半導体装
置の組み立てのように高い清浄度を要求される分野には
不向きであった。Conventionally, a molding machine used for resin encapsulation of semiconductor devices has a mold clamping cylinder 6 for clamping upper and lower mold molds 4 and 5 to a molding machine main body 7, as shown in FIG. 5 is equipped with an injection cylinder 1 for injecting resin, a cylinder 3 for injection pressure balancing, and an eject cylinder 2 for releasing the molded product from the mold.A hydraulic cylinder is used as each resin sealing cylinder. was. Further, 8 is a post of the molding machine. Therefore, each molding machine has a hydraulic drive motor 9, a hydraulic control section 10, a hydraulic drive pump 11, and an oil tank 12.
Since it is necessary to install a hydraulic drive unit consisting of a hydraulic drive unit, its weight and external size are extremely large, and the noise generated is also large. Further, since hydraulic circuits require a large amount of time for maintenance and inspection and use hydraulic fluid, they are not suitable for fields that require high cleanliness, such as the assembly of semiconductor devices.
この発明の目的は、モールド成形機の主要な駆動部を空
圧式とすることにより、装置本体の重量、外寸並びに騒
音の低減、保守性の向上、清浄度の確保を図るようにし
た装置を提供することにある。The purpose of this invention is to provide a molding machine in which the main driving part of the molding machine is pneumatic, thereby reducing the weight, external dimensions and noise of the machine body, improving maintainability, and ensuring cleanliness. It is about providing.
すなわち、本発明装置はモールド金型をクランプするシ
リンダー、該金型に樹脂を射出するシリンダー、射出圧
力平衡用シリンダー、成形済製品を金型から離形させる
シリンダー等の樹脂封止用シリンダーを備えた半導体の
樹脂封止装置において、前記樹脂封止用シリンダーとし
て空圧式シリンダーを用い、高圧空気源と該空気源より
の高圧空気の圧力設定を行なうレギュレータとを有し、
該レギュレータに各樹脂封止用シリンダーを接続したこ
とを特徴とするものである。That is, the apparatus of the present invention includes a resin sealing cylinder such as a cylinder for clamping a mold, a cylinder for injecting resin into the mold, a cylinder for balancing injection pressure, and a cylinder for releasing a molded product from the mold. A semiconductor resin encapsulation device uses a pneumatic cylinder as the resin encapsulation cylinder, and includes a high-pressure air source and a regulator for setting the pressure of the high-pressure air from the air source,
The regulator is characterized in that each resin-sealing cylinder is connected to the regulator.
以下、本発明の一実施例を図により説明する。Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第２図に示すように本発明は、モールド金型４゜５をク
ランプする型締シリンダー２４として空圧・油圧併用式
シリンダーを、該金型４，５に樹脂を射出するシリンダ
ー２１及び射出圧力平衡用シリンダー２３並びに成形済
製品を金型４，５より離形させるシリンダー２２として
空圧式シリンダーをそれぞれ用い、高圧空気源５１と、
該空気源５１より高圧空気を導入し、水分とごみを除去
し、圧力設定を行なう大型フィルター付レギュレータ２
５とを備えている。尚、モールド成形機の全駆動を空圧
にて行なうだめ、瞬間最大流量は５００１／ｍｉｎ以上
となる。各樹脂封止用シリンダー２１．２２，２３．２
４は電磁弁２６を介してレギュレータ２５に接続され、
該電磁弁２６の開閉操作により空圧で駆動動作される。As shown in FIG. 2, the present invention uses a pneumatic/hydraulic combined cylinder as the mold clamping cylinder 24 for clamping the mold 4.5, a cylinder 21 for injecting resin into the molds 4 and 5, and an injection pressure Pneumatic cylinders are used as the balancing cylinder 23 and the cylinder 22 for releasing the molded product from the molds 4 and 5, and a high-pressure air source 51,
A regulator 2 with a large filter introduces high-pressure air from the air source 51, removes moisture and dirt, and sets the pressure.
5. Incidentally, if the entire molding machine is driven by pneumatic pressure, the instantaneous maximum flow rate will be 5001/min or more. Each cylinder for resin sealing 21.22, 23.2
4 is connected to the regulator 25 via a solenoid valve 26,
It is driven by pneumatic pressure by opening and closing the solenoid valve 26.
各シリンダーを順を追って説明する。Each cylinder will be explained step by step.
シリンダー２１は射出用空圧シリンダーで、金型へ樹脂
を圧入し、樹脂成形時は圧力保持を行なう。The cylinder 21 is a pneumatic cylinder for injection, which presses the resin into the mold and maintains the pressure during resin molding.
シリンダー２２は製品離形用空圧シリンダーであり、金
型表面よりの成形済み製品の離形を行なう。シリンダー
２３は射出圧力平衡用空圧シリンダーであり、複数の射
出シリンダーによる射出圧力のバランスをとるものであ
る。シリンダー２４は型締め用空圧油圧併用式シリンダ
ーであり、モールド金型のクランプを行なう。図中矢印
は金型４，５の移動方向を示す。尚、必要とされるシリ
ンダー２４の型締め力は２０〜４０ ＴＯＮ程度である
。このように本発明において、各樹脂封止用シリンダー
は全て空圧により駆動され、樹脂封止が行なわれる。The cylinder 22 is a pneumatic cylinder for releasing the product, and releases the molded product from the mold surface. The cylinder 23 is an injection pressure balancing pneumatic cylinder that balances the injection pressures of a plurality of injection cylinders. The cylinder 24 is a pneumatic-hydraulic type cylinder for mold clamping, and clamps the mold die. Arrows in the figure indicate the moving direction of the molds 4 and 5. The required clamping force of the cylinder 24 is approximately 20 to 40 TON. In this manner, in the present invention, all resin sealing cylinders are driven by pneumatic pressure to perform resin sealing.
以上説明したように本発明によれば、駆動源が高圧空気
源であるため、装置より離して設けるととが可能であり
、又、各種駆動関連機器が空圧式であるため、比較的小
形、軽量であり、したがって、装置の重量、外寸、騒音
を従来に比して大幅に低減できる。まだ駆動エネルギー
を伝送する回路は空圧回路であるため、その保守は比較
的容易であり、保守性、作業性を大幅に向上でき、しか
も清浄度を高く維持でき、半導体装置を樹脂封止する装
置として最適のものである。As explained above, according to the present invention, since the drive source is a high-pressure air source, it can be installed at a distance from the device, and since various drive-related devices are pneumatic, it is relatively small and It is lightweight, and therefore the weight, external size, and noise of the device can be significantly reduced compared to conventional devices. Since the circuit that transmits drive energy is still a pneumatic circuit, its maintenance is relatively easy, and maintainability and workability can be greatly improved. Moreover, a high level of cleanliness can be maintained, and semiconductor devices can be sealed with resin. This is the most suitable device.
第１図は従来の油圧式モールド成形機を示す構成図、第
２図は本発明の一実施例を示す構成図である・
４・・・モールド金型、５・・・モールド金型、２１・
・・射出シリンダー、２２・・・製品離形用シリンダー
、２３・・・射出圧力平衡用シリンダー、２４・・・型
締シリンダー、２５・・・フィルター付レギュレータ、
２６・・・電磁弁特許出願人 九州日本電気株式会社FIG. 1 is a block diagram showing a conventional hydraulic molding machine, and FIG. 2 is a block diagram showing an embodiment of the present invention. 4... Mold die, 5... Mold die, 21・
... Injection cylinder, 22 ... Cylinder for product release, 23 ... Cylinder for injection pressure balance, 24 ... Mold clamping cylinder, 25 ... Regulator with filter,
26...Solenoid valve patent applicant Kyushu NEC Co., Ltd.
Claims (1)
に樹脂を射出するシリンダー、射出圧力平衡用シリンダ
ー、成形済製品を金型がら離形させるシリンダー等の樹
脂封止用シリンダーを備えた半導体の樹脂封止装置にお
いて、前記樹脂封止用シリンダーとして空圧式シリンダ
ーを用い、高圧空気源と該空気源よりの高圧空気の圧力
設定を行なうレギュレータとを有し、該レギュレータに
各樹脂封止用シリンダーを接続したことを特徴とする半
導体樹脂封止装置。(1) A semiconductor device equipped with resin sealing cylinders such as a cylinder for clamping a mold, a cylinder for injecting resin into the mold, a cylinder for balancing injection pressure, and a cylinder for releasing a molded product from the mold. In the resin sealing apparatus, a pneumatic cylinder is used as the resin sealing cylinder, and includes a high pressure air source and a regulator for setting the pressure of the high pressure air from the air source, and each resin sealing cylinder is connected to the regulator. A semiconductor resin encapsulation device characterized by connecting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8223083A JPS59207636A (en) | 1983-05-11 | 1983-05-11 | Resin sealing device for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8223083A JPS59207636A (en) | 1983-05-11 | 1983-05-11 | Resin sealing device for semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59207636A true JPS59207636A (en) | 1984-11-24 |
| JPH0131294B2 JPH0131294B2 (en) | 1989-06-26 |
Family
ID=13768600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8223083A Granted JPS59207636A (en) | 1983-05-11 | 1983-05-11 | Resin sealing device for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59207636A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6279633A (en) * | 1985-10-03 | 1987-04-13 | Mitsubishi Electric Corp | Resin sealing device |
| JPS62154914U (en) * | 1986-03-24 | 1987-10-01 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0368996U (en) * | 1989-11-01 | 1991-07-08 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5229957A (en) * | 1975-09-03 | 1977-03-07 | Hitachi Ltd | Oil immersed electric apparatus |
| JPS5229857A (en) * | 1975-09-03 | 1977-03-07 | Hitachi Ltd | Method of filling resin and apparatus |
| JPS5630841A (en) * | 1979-08-24 | 1981-03-28 | Towa Seimitsu Kogyo Kk | Plastic molding method and metallic mold therefor |
| JPS5649207A (en) * | 1979-09-28 | 1981-05-02 | Hitachi Ltd | Molding die |
| JPS5775435A (en) * | 1980-10-29 | 1982-05-12 | Mitsubishi Electric Corp | Liquid transfer molding |
| JPS6431294A (en) * | 1987-07-27 | 1989-02-01 | Hino Motors Ltd | Vehicle abnormality sensing informing device |
-
1983
- 1983-05-11 JP JP8223083A patent/JPS59207636A/en active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5229957A (en) * | 1975-09-03 | 1977-03-07 | Hitachi Ltd | Oil immersed electric apparatus |
| JPS5229857A (en) * | 1975-09-03 | 1977-03-07 | Hitachi Ltd | Method of filling resin and apparatus |
| JPS5630841A (en) * | 1979-08-24 | 1981-03-28 | Towa Seimitsu Kogyo Kk | Plastic molding method and metallic mold therefor |
| JPS5649207A (en) * | 1979-09-28 | 1981-05-02 | Hitachi Ltd | Molding die |
| JPS5775435A (en) * | 1980-10-29 | 1982-05-12 | Mitsubishi Electric Corp | Liquid transfer molding |
| JPS6431294A (en) * | 1987-07-27 | 1989-02-01 | Hino Motors Ltd | Vehicle abnormality sensing informing device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6279633A (en) * | 1985-10-03 | 1987-04-13 | Mitsubishi Electric Corp | Resin sealing device |
| JPS62154914U (en) * | 1986-03-24 | 1987-10-01 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0131294B2 (en) | 1989-06-26 |
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