JPS62154914U - - Google Patents

Info

Publication number
JPS62154914U
JPS62154914U JP4362386U JP4362386U JPS62154914U JP S62154914 U JPS62154914 U JP S62154914U JP 4362386 U JP4362386 U JP 4362386U JP 4362386 U JP4362386 U JP 4362386U JP S62154914 U JPS62154914 U JP S62154914U
Authority
JP
Japan
Prior art keywords
mold
resin sealing
press device
slide table
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4362386U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4362386U priority Critical patent/JPS62154914U/ja
Publication of JPS62154914U publication Critical patent/JPS62154914U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の一実施例によるプレス装置
を示す断面図、第２図は従来のプレス装置を示す
断面図である。 図中、１は下型、２は上型、３はスライドテー
ブル、４は下型クランパ、５は上板、６は上型ク
ランパ、７はベース、８は型締めシリンダ、９は
ガイドポスト、１０ａ〜１０ｄはナツト、１１は
ベアリングである。尚、図中同一符号は同一又は
相当部分を示す。 FIG. 1 is a sectional view showing a press device according to an embodiment of this invention, and FIG. 2 is a sectional view showing a conventional press device. In the figure, 1 is a lower die, 2 is an upper die, 3 is a slide table, 4 is a lower die clamper, 5 is an upper plate, 6 is an upper die clamper, 7 is a base, 8 is a mold clamping cylinder, 9 is a guide post, 10a to 10d are nuts, and 11 is a bearing. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】 (1) 樹脂封止用金型を型締めするプレス装置に
おいて、スライドテーブルと、このスライドテー
ブルの下部に固定された樹脂封止用金型の上金型
部分と、上記スライドテーブルの上部に位置し、
樹脂封止用金型を型締めする型締めシリンダとを
備えたことを特徴とする樹脂封止用プレス装置。 (2) 樹脂封止用金型の下型部分を固定側に設け
たこと特徴とする実用新案登録請求の範囲第１項
記載の樹脂封止用プレス装置。[Scope of Claim for Utility Model Registration] (1) In a press device for clamping a mold for resin sealing, a slide table, an upper mold portion of the mold for resin seal fixed to the lower part of the slide table, and , located at the top of the sliding table above,
A press device for resin sealing, comprising a mold clamping cylinder that clamps a mold for resin sealing. (2) The press device for resin sealing according to claim 1, characterized in that the lower mold part of the resin sealing mold is provided on the stationary side.
JP4362386U 1986-03-24 1986-03-24 Pending JPS62154914U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4362386U JPS62154914U (en) 1986-03-24 1986-03-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4362386U JPS62154914U (en) 1986-03-24 1986-03-24

Publications (1)

Publication Number Publication Date
JPS62154914U true JPS62154914U (en) 1987-10-01

Family

ID=30860654

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4362386U Pending JPS62154914U (en) 1986-03-24 1986-03-24

Country Status (1)

Country Link
JP (1) JPS62154914U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5144983A (en) * 1974-10-15 1976-04-16 Shimadzu Corp
JPS599538B2 (en) * 1978-02-06 1984-03-03 フイルメニツヒ ソシエテ アノニム Aliphatic polyunsaturated esters, perfume or flavor compositions containing the esters
JPS59207636A (en) * 1983-05-11 1984-11-24 Nec Kyushu Ltd Resin sealing device for semiconductor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5144983A (en) * 1974-10-15 1976-04-16 Shimadzu Corp
JPS599538B2 (en) * 1978-02-06 1984-03-03 フイルメニツヒ ソシエテ アノニム Aliphatic polyunsaturated esters, perfume or flavor compositions containing the esters
JPS59207636A (en) * 1983-05-11 1984-11-24 Nec Kyushu Ltd Resin sealing device for semiconductor

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