JPS59201433A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS59201433A
JPS59201433A JP58076537A JP7653783A JPS59201433A JP S59201433 A JPS59201433 A JP S59201433A JP 58076537 A JP58076537 A JP 58076537A JP 7653783 A JP7653783 A JP 7653783A JP S59201433 A JPS59201433 A JP S59201433A
Authority
JP
Japan
Prior art keywords
semiconductor element
recession
bonding agent
stage
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58076537A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0226377B2 (enExample
Inventor
Eiji Yokota
横田　栄二
Masao Takehiro
武広　正雄
Toyoshige Kawashima
川島　豊茂
Akihiro Kubota
昭弘 窪田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58076537A priority Critical patent/JPS59201433A/ja
Publication of JPS59201433A publication Critical patent/JPS59201433A/ja
Publication of JPH0226377B2 publication Critical patent/JPH0226377B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/417—Bonding materials between chips and die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
JP58076537A 1983-04-30 1983-04-30 半導体装置の製造方法 Granted JPS59201433A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58076537A JPS59201433A (ja) 1983-04-30 1983-04-30 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58076537A JPS59201433A (ja) 1983-04-30 1983-04-30 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS59201433A true JPS59201433A (ja) 1984-11-15
JPH0226377B2 JPH0226377B2 (enExample) 1990-06-08

Family

ID=13608014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58076537A Granted JPS59201433A (ja) 1983-04-30 1983-04-30 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS59201433A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014013848A1 (ja) * 2012-07-19 2014-01-23 日産自動車株式会社 半導体装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0511740U (ja) * 1991-07-23 1993-02-12 東洋電機製造株式会社 電圧抑制回路

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51121461U (enExample) * 1975-03-22 1976-10-01
JPS5684356U (enExample) * 1979-11-29 1981-07-07
JPS5844858U (ja) * 1981-09-21 1983-03-25 日本電気株式会社 リ−ドフレ−ム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51121461U (enExample) * 1975-03-22 1976-10-01
JPS5684356U (enExample) * 1979-11-29 1981-07-07
JPS5844858U (ja) * 1981-09-21 1983-03-25 日本電気株式会社 リ−ドフレ−ム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014013848A1 (ja) * 2012-07-19 2014-01-23 日産自動車株式会社 半導体装置

Also Published As

Publication number Publication date
JPH0226377B2 (enExample) 1990-06-08

Similar Documents

Publication Publication Date Title
JP6041053B2 (ja) 半導体装置及びその製造方法
WO1997031393A1 (en) Method of making an air tight cavity in an assembly package
TW582078B (en) Packaging process for improving effective die-bonding area
CN107464873A (zh) 一种避免倒装芯片固晶漏电的方法
US4029628A (en) Bonding material for planar electronic device
JPS59201433A (ja) 半導体装置の製造方法
JPH1070230A (ja) Ｌｏｃ用リードフレーム
JPS58182837A (ja) 樹脂封止半導体装置の製造方法
GB2179001A (en) Method of bonding using paste or non-dry film adhesives
JPH0410447A (ja) Ｉｃチップ搭載基板
JP2002203866A (ja) 半導体装置製造方法
JP3022910B2 (ja) 半導体装置の製造方法
CN108231987B (zh) 一种改进的led封装系统及工艺
JPH0689914A (ja) 半導体装置の封止方法
JPS629728Y2 (enExample)
JPS6047430A (ja) Ｌｓｉの樹脂封止方式
JPS6142859B2 (enExample)
JPH0315337B2 (enExample)
CN103763857B (zh) 板上芯片印刷电路板
TW432653B (en) Flip chip package structure and process with increased encapsulation efficiency and reliability
JPH01272125A (ja) 半導体装置の製造方法
JP2006295186A (ja) 無テープのダイアタッチ方式による集積回路パッケージプロセス
JPH01264230A (ja) 半導体装置
JPS6167970A (ja) 部品の取り付け構造
JPH027411A (ja) 圧電部品の製造方法