CN108231987B - 一种改进的led封装系统及工艺 - Google Patents
一种改进的led封装系统及工艺 Download PDFInfo
- Publication number
- CN108231987B CN108231987B CN201711441661.8A CN201711441661A CN108231987B CN 108231987 B CN108231987 B CN 108231987B CN 201711441661 A CN201711441661 A CN 201711441661A CN 108231987 B CN108231987 B CN 108231987B
- Authority
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- Prior art keywords
- led
- glue
- feeding pipe
- machine body
- packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims description 9
- 239000003292 glue Substances 0.000 claims abstract description 95
- 239000011248 coating agent Substances 0.000 claims abstract description 22
- 238000000576 coating method Methods 0.000 claims abstract description 22
- 238000007723 die pressing method Methods 0.000 claims abstract description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 9
- 230000017525 heat dissipation Effects 0.000 claims abstract description 9
- 229910052709 silver Inorganic materials 0.000 claims abstract description 9
- 239000004332 silver Substances 0.000 claims abstract description 9
- 238000012858 packaging process Methods 0.000 claims abstract description 6
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 15
- 238000002347 injection Methods 0.000 claims description 13
- 239000007924 injection Substances 0.000 claims description 13
- 238000000465 moulding Methods 0.000 claims description 10
- 239000004973 liquid crystal related substance Substances 0.000 claims description 9
- 239000004831 Hot glue Substances 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 7
- 239000000428 dust Substances 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 239000012943 hotmelt Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 7
- 230000005611 electricity Effects 0.000 abstract description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000084 colloidal system Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000003031 feeding effect Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711441661.8A CN108231987B (zh) | 2017-12-27 | 2017-12-27 | 一种改进的led封装系统及工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711441661.8A CN108231987B (zh) | 2017-12-27 | 2017-12-27 | 一种改进的led封装系统及工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108231987A CN108231987A (zh) | 2018-06-29 |
CN108231987B true CN108231987B (zh) | 2020-09-22 |
Family
ID=62648908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711441661.8A Active CN108231987B (zh) | 2017-12-27 | 2017-12-27 | 一种改进的led封装系统及工艺 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108231987B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114242872B (zh) * | 2022-02-24 | 2022-05-03 | 柯依赛光电技术(深圳)有限公司 | 一种多色cob光源封装装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101369614A (zh) * | 2007-08-17 | 2009-02-18 | 刘胜 | 大功率白光发光二极管的封装结构和封装方法 |
KR20090115534A (ko) * | 2008-05-02 | 2009-11-05 | 주식회사 프로텍 | 형광물질 정량 토출장치 |
CN201644326U (zh) * | 2010-02-10 | 2010-11-24 | 佛山盟泰数控科技有限公司 | 一种自动施胶机 |
CN201880664U (zh) * | 2010-08-13 | 2011-06-29 | 霍丽梅 | 蠕动喷式点胶机 |
CN202316240U (zh) * | 2011-08-21 | 2012-07-11 | 袁顺达 | 恒温控制浓缩胶打胶机 |
CN103128041A (zh) * | 2013-02-07 | 2013-06-05 | 华南理工大学 | 一种全自动荧光粉涂覆工艺及设备 |
-
2017
- 2017-12-27 CN CN201711441661.8A patent/CN108231987B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101369614A (zh) * | 2007-08-17 | 2009-02-18 | 刘胜 | 大功率白光发光二极管的封装结构和封装方法 |
KR20090115534A (ko) * | 2008-05-02 | 2009-11-05 | 주식회사 프로텍 | 형광물질 정량 토출장치 |
CN201644326U (zh) * | 2010-02-10 | 2010-11-24 | 佛山盟泰数控科技有限公司 | 一种自动施胶机 |
CN201880664U (zh) * | 2010-08-13 | 2011-06-29 | 霍丽梅 | 蠕动喷式点胶机 |
CN202316240U (zh) * | 2011-08-21 | 2012-07-11 | 袁顺达 | 恒温控制浓缩胶打胶机 |
CN103128041A (zh) * | 2013-02-07 | 2013-06-05 | 华南理工大学 | 一种全自动荧光粉涂覆工艺及设备 |
Also Published As
Publication number | Publication date |
---|---|
CN108231987A (zh) | 2018-06-29 |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
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TA01 | Transfer of patent application right |
Effective date of registration: 20200820 Address after: Room 435, 4 / F, no.17-6, No.4 street, Baiyang street, Hangzhou Economic and Technological Development Zone, Hangzhou City, Zhejiang Province Applicant after: Zhejiang Ouxiang Technology Co., Ltd Address before: 310000 fifth, 2 building, 20 Longquan Road, Chu temple village, Yuhang District, Hangzhou, Zhejiang. Applicant before: HANGZHOU DACHEN DISPLAY TECHNOLOGY Co.,Ltd. |
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TA01 | Transfer of patent application right | ||
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TR01 | Transfer of patent right |
Effective date of registration: 20210819 Address after: 311100 room A107, building 1, 509 Hongfeng Road, Yuhang Economic Development Zone, Yuhang District, Hangzhou City, Zhejiang Province Patentee after: HANGZHOU UG PHOTOELECTRIC Co.,Ltd. Address before: Room 435, 4th floor, 17-6 Baiyang street, Hangzhou Economic and Technological Development Zone, Hangzhou, Zhejiang 310000 Patentee before: Zhejiang Ouxiang Technology Co., Ltd |
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TR01 | Transfer of patent right |