JPS59198723A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS59198723A
JPS59198723A JP59071024A JP7102484A JPS59198723A JP S59198723 A JPS59198723 A JP S59198723A JP 59071024 A JP59071024 A JP 59071024A JP 7102484 A JP7102484 A JP 7102484A JP S59198723 A JPS59198723 A JP S59198723A
Authority
JP
Japan
Prior art keywords
silicon nitride
semiconductor device
manufacturing
nitride layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59071024A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0412615B2 (OSRAM
Inventor
アルフレツド・ヘンドリク・フアン・オメン
ヘンリカス・ゴデフリダス・ラフエ−ル・マ−ス
ヨハネス・ア−ノルダス・アペルス
ビルヘルムス・ヤコブス・マリア・ヨセフ・ジヨスクイン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of JPS59198723A publication Critical patent/JPS59198723A/ja
Publication of JPH0412615B2 publication Critical patent/JPH0412615B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P30/40—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/3115—Doping the insulating layers
    • H01L21/31155—Doping the insulating layers by ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching
    • H10P50/283—

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Drying Of Semiconductors (AREA)
  • Weting (AREA)
  • Element Separation (AREA)
JP59071024A 1983-04-11 1984-04-11 半導体装置の製造方法 Granted JPS59198723A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8301262 1983-04-11
NL8301262A NL8301262A (nl) 1983-04-11 1983-04-11 Werkwijze voor het vervaardigen van een halfgeleiderinrichting, waarbij met behulp van ionenimplantatie patronen worden aangebracht in een laag siliciumnitride.

Publications (2)

Publication Number Publication Date
JPS59198723A true JPS59198723A (ja) 1984-11-10
JPH0412615B2 JPH0412615B2 (OSRAM) 1992-03-05

Family

ID=19841683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59071024A Granted JPS59198723A (ja) 1983-04-11 1984-04-11 半導体装置の製造方法

Country Status (5)

Country Link
US (1) US4514251A (OSRAM)
EP (1) EP0122662B1 (OSRAM)
JP (1) JPS59198723A (OSRAM)
DE (1) DE3466133D1 (OSRAM)
NL (1) NL8301262A (OSRAM)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001514448A (ja) * 1997-08-25 2001-09-11 アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド Ｐｅｃｖｄ窒化／酸窒化膜へのリン注入による不揮発性メモリセルの電荷損失の低減
JP2004192935A (ja) * 2002-12-11 2004-07-08 Hitachi Displays Ltd 有機ｅｌ表示装置
JP2014103272A (ja) * 2012-11-20 2014-06-05 Fujitsu Semiconductor Ltd 半導体装置の製造方法

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4717449A (en) * 1984-04-25 1988-01-05 Honeywell Inc. Dielectric barrier material
NL8402859A (nl) * 1984-09-18 1986-04-16 Philips Nv Werkwijze voor het vervaardigen van submicrongroeven in bijvoorbeeld halfgeleidermateriaal en met deze werkwijze verkregen inrichtingen.
FR2573919B1 (fr) * 1984-11-06 1987-07-17 Thomson Csf Procede de fabrication de grilles pour circuit integre
US4653173A (en) * 1985-03-04 1987-03-31 Signetics Corporation Method of manufacturing an insulated gate field effect device
GB2172427A (en) * 1985-03-13 1986-09-17 Philips Electronic Associated Semiconductor device manufacture using a deflected ion beam
EP0218039B1 (de) * 1985-09-30 1990-11-07 Siemens Aktiengesellschaft Verfahren zur Übertragung feinster Fotolackstrukturen
US4774197A (en) * 1986-06-17 1988-09-27 Advanced Micro Devices, Inc. Method of improving silicon dioxide
US4772539A (en) * 1987-03-23 1988-09-20 International Business Machines Corporation High resolution E-beam lithographic technique
US5186788A (en) * 1987-07-23 1993-02-16 Matsushita Electric Industrial Co., Ltd. Fine pattern forming method
US4978418A (en) * 1988-08-18 1990-12-18 The United States Of America As Represented By The United States Department Of Energy Controlled ion implant damage profile for etching
US4956314A (en) * 1989-05-30 1990-09-11 Motorola, Inc. Differential etching of silicon nitride
US5092957A (en) * 1989-11-24 1992-03-03 The United States Of America As Represented By The United States Department Of Energy Carrier-lifetime-controlled selective etching process for semiconductors using photochemical etching
US5236547A (en) * 1990-09-25 1993-08-17 Kabushiki Kaisha Toshiba Method of forming a pattern in semiconductor device manufacturing process
US5240875A (en) * 1992-08-12 1993-08-31 North American Philips Corporation Selective oxidation of silicon trench sidewall
JP2664866B2 (ja) * 1993-04-09 1997-10-22 インターナショナル・ビジネス・マシーンズ・コーポレイション 窒化ホウ素をエッチングする方法
US5413953A (en) * 1994-09-30 1995-05-09 United Microelectronics Corporation Method for planarizing an insulator on a semiconductor substrate using ion implantation
US6309975B1 (en) 1997-03-14 2001-10-30 Micron Technology, Inc. Methods of making implanted structures
US5994210A (en) * 1997-08-12 1999-11-30 National Semiconductor Corporation Method of improving silicide sheet resistance by implanting fluorine
JP2000040691A (ja) * 1998-07-21 2000-02-08 Oki Electric Ind Co Ltd 半導体装置製造方法
DE10103524A1 (de) * 2001-01-26 2002-08-22 Infineon Technologies Ag Verfahren und Halbleiteranordnung zur Ätzung einer Schicht eines Halbleitersubstrats mittels einer siliziumhaltigen Ätzmaske
US6806197B2 (en) * 2001-08-07 2004-10-19 Micron Technology, Inc. Method of forming integrated circuitry, and method of forming a contact opening
US7737049B2 (en) * 2007-07-31 2010-06-15 Qimonda Ag Method for forming a structure on a substrate and device
KR20100035777A (ko) * 2008-09-29 2010-04-07 삼성전자주식회사 반도체 소자 및 그 제조 방법
US8889562B2 (en) 2012-07-23 2014-11-18 International Business Machines Corporation Double patterning method
US9054041B2 (en) * 2013-07-18 2015-06-09 GlobalFoundries, Inc. Methods for etching dielectric materials in the fabrication of integrated circuits
CN105097537B (zh) * 2014-05-12 2019-09-27 中芯国际集成电路制造(上海)有限公司 鳍式场效应管的形成方法
US9881834B1 (en) 2016-11-29 2018-01-30 Taiwan Semiconductor Manufacturing Company, Ltd. Contact openings and methods forming same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52128066A (en) * 1976-04-20 1977-10-27 Matsushita Electronics Corp Manufacture of semiconductor device
DE2748401A1 (de) * 1977-10-28 1979-05-03 Licentia Gmbh Halbleiteranordnung

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001514448A (ja) * 1997-08-25 2001-09-11 アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド Ｐｅｃｖｄ窒化／酸窒化膜へのリン注入による不揮発性メモリセルの電荷損失の低減
JP2004192935A (ja) * 2002-12-11 2004-07-08 Hitachi Displays Ltd 有機ｅｌ表示装置
JP2014103272A (ja) * 2012-11-20 2014-06-05 Fujitsu Semiconductor Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
NL8301262A (nl) 1984-11-01
US4514251A (en) 1985-04-30
DE3466133D1 (en) 1987-10-15
EP0122662B1 (en) 1987-09-09
EP0122662A1 (en) 1984-10-24
JPH0412615B2 (OSRAM) 1992-03-05

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