JPS59197143A - 部品マウント装置 - Google Patents

部品マウント装置

Info

Publication number
JPS59197143A
JPS59197143A JP7174983A JP7174983A JPS59197143A JP S59197143 A JPS59197143 A JP S59197143A JP 7174983 A JP7174983 A JP 7174983A JP 7174983 A JP7174983 A JP 7174983A JP S59197143 A JPS59197143 A JP S59197143A
Authority
JP
Japan
Prior art keywords
tool
plunger
suction
sucked
sucking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7174983A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0342504B2 (enrdf_load_stackoverflow
Inventor
Akio Nakamura
昭夫 中村
Tetsuo Miyoshi
三好　徹夫
Masakatsu Ishida
石田　正勝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Tokyo Sokuhan Co Ltd
Original Assignee
Hitachi Ltd
Tokyo Sokuhan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Tokyo Sokuhan Co Ltd filed Critical Hitachi Ltd
Priority to JP7174983A priority Critical patent/JPS59197143A/ja
Publication of JPS59197143A publication Critical patent/JPS59197143A/ja
Publication of JPH0342504B2 publication Critical patent/JPH0342504B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
JP7174983A 1983-04-22 1983-04-22 部品マウント装置 Granted JPS59197143A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7174983A JPS59197143A (ja) 1983-04-22 1983-04-22 部品マウント装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7174983A JPS59197143A (ja) 1983-04-22 1983-04-22 部品マウント装置

Publications (2)

Publication Number Publication Date
JPS59197143A true JPS59197143A (ja) 1984-11-08
JPH0342504B2 JPH0342504B2 (enrdf_load_stackoverflow) 1991-06-27

Family

ID=13469486

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7174983A Granted JPS59197143A (ja) 1983-04-22 1983-04-22 部品マウント装置

Country Status (1)

Country Link
JP (1) JPS59197143A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62192646U (enrdf_load_stackoverflow) * 1986-05-29 1987-12-08
EP0792097A4 (en) * 1995-09-13 1999-11-03 Matsushita Electric Ind Co Ltd SUCTION HEAD FOR MOUNTING DEVICE FOR ELECTRONIC COMPONENTS
KR100420778B1 (ko) * 2000-03-17 2004-03-02 가부시키가이샤 어드밴티스트 부품 지지장치
JP2007311465A (ja) * 2006-05-17 2007-11-29 Shinkawa Ltd 多段加圧コレット
WO2009056468A1 (en) * 2007-10-31 2009-05-07 Oerlikon Assembly Equipment Ag, Steinhausen Pick-up tool and method for grasping and mounting small dies
KR101071247B1 (ko) 2008-12-30 2011-10-10 엘아이지에이디피 주식회사 리프트 핀 모듈 및 이를 구비하는 기판 합착기

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4428387Y1 (enrdf_load_stackoverflow) * 1966-10-19 1969-11-25
JPS492868U (enrdf_load_stackoverflow) * 1972-04-17 1974-01-11

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4428387Y1 (enrdf_load_stackoverflow) * 1966-10-19 1969-11-25
JPS492868U (enrdf_load_stackoverflow) * 1972-04-17 1974-01-11

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62192646U (enrdf_load_stackoverflow) * 1986-05-29 1987-12-08
EP0792097A4 (en) * 1995-09-13 1999-11-03 Matsushita Electric Ind Co Ltd SUCTION HEAD FOR MOUNTING DEVICE FOR ELECTRONIC COMPONENTS
KR100420778B1 (ko) * 2000-03-17 2004-03-02 가부시키가이샤 어드밴티스트 부품 지지장치
JP2007311465A (ja) * 2006-05-17 2007-11-29 Shinkawa Ltd 多段加圧コレット
WO2009056468A1 (en) * 2007-10-31 2009-05-07 Oerlikon Assembly Equipment Ag, Steinhausen Pick-up tool and method for grasping and mounting small dies
KR101071247B1 (ko) 2008-12-30 2011-10-10 엘아이지에이디피 주식회사 리프트 핀 모듈 및 이를 구비하는 기판 합착기

Also Published As

Publication number Publication date
JPH0342504B2 (enrdf_load_stackoverflow) 1991-06-27

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