JPS59197143A - Mounting device for parts - Google Patents
Mounting device for partsInfo
- Publication number
- JPS59197143A JPS59197143A JP7174983A JP7174983A JPS59197143A JP S59197143 A JPS59197143 A JP S59197143A JP 7174983 A JP7174983 A JP 7174983A JP 7174983 A JP7174983 A JP 7174983A JP S59197143 A JPS59197143 A JP S59197143A
- Authority
- JP
- Japan
- Prior art keywords
- tool
- plunger
- suction
- sucked
- sucking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は、部品マウント装置における部品の吸着用ツ
ールに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a component suction tool in a component mounting device.
半導体装置の組立作票において、チップ部品と言われる
各種半導体素子、集積回路素子、各種受動部品を供給ト
レイから基板等のパッケージ上へ移送しマウントする作
業があり、通常チップマウント装置と言われる装置を用
いて行なう。マウントされるチップ部品は一般に角形で
一辺が0. II vmからlり露程度まで種々あり、
同一ノクツケージ上に多種類のチップを多数個順次マウ
ントすることが要求される。この様な場合吸着用ツール
は先端がフラットな円筒型のツールを用いることが多い
。In the assembly process of semiconductor devices, there is work to transfer and mount various semiconductor elements called chip parts, integrated circuit elements, and various passive parts from a supply tray onto a package such as a board. Do this using The chip components to be mounted are generally square and one side is 0. There are various types from II vm to l dew level,
It is required to sequentially mount a large number of various types of chips on the same cage. In such cases, a cylindrical suction tool with a flat tip is often used.
従来の吸着用ツールとしては例えば第1図に示すような
ものがある。As a conventional suction tool, there is one shown in FIG. 1, for example.
第1図は縦断面図で示されるもので、ツールホルダダに
嵌入している管状の吸着用ツールlは止めネジコにより
ツールホルダグに固定され、吸着用ツールlの後端に連
結したチューブ3により図示されない真空源から真空圧
Sにより吸引されるようになっている。図示されないが
ツールホルダtはチップ部品(第1図に図示せず)のチ
ップ供給トレイ上に吸着用ツールlが降下してチップ部
品を吸着用ツールlの先端にて吸着してから持上げ、パ
ッケージ上の座標に従って所定位置に移動させ、パッケ
ージ上に吸着用ツールノが保持しているチップ部品を降
下してパッケージ上に予め塗布しである溶剤によりチッ
プ部品をパッケージにマウントし、真空圧9をなくして
吸着用ツールlを上昇させチップ供給トレイ上に次のチ
ップ部品上に接着すべきチップ部品を取りに行くように
装置に取付けられている。FIG. 1 is a longitudinal cross-sectional view, in which a tubular suction tool l fitted into a tool holder is fixed to the tool holder by a set screw, and a tube 3 connected to the rear end of the suction tool l creates a vacuum (not shown). It is designed to be suctioned by vacuum pressure S from the source. Although not shown in the drawings, the tool holder t has a suction tool l that descends onto a chip supply tray for chip components (not shown in FIG. Move it to a predetermined position according to the coordinates above, lower the chip component held by the suction tool onto the package, mount the chip component on the package with a solvent that has been applied on the package in advance, and eliminate the vacuum pressure 9. It is attached to the apparatus so that the suction tool 1 is raised to pick up a chip component to be bonded onto the next chip component onto the chip supply tray.
しかしながら、このような従来の吸着用ツール/にあっ
ては、チップ部品の寸法が多岐にわたり、又吸着及びマ
ウント時の吸着用ツール/の下降点の高さが一定となっ
ていたため、同一の吸着用ツール/で多種類のチップ部
品を扱う場合、吸着力が不足したり、吸着時だ吸着用ツ
ール/とチップ部品の間に隙間ができる等で真空漏れが
発生する。そして大きなチップ部品の一点で強い真空圧
で吸着用ツール/に引付けることはチップ部品に大きな
単位面枦当りの圧力を加えるととになる。又、小さな吸
着用ツールで吸着しても大きなチップ部品では何等かの
モーメントが加わると容易にチップ部品が吸着用ツール
/から離れてしまうという問題点がちつた。However, with such conventional suction tools, the dimensions of the chip components vary widely, and the height of the descending point of the suction tool during suction and mounting is constant. When handling many types of chip components with a vacuum tool, vacuum leaks may occur due to insufficient suction power or a gap forming between the suction tool and the chip components. In order to attract a large chip component to a suction tool with strong vacuum pressure at one point, it becomes necessary to apply a large pressure per unit area to the chip component. Furthermore, even if a small suction tool is used to pick up a large chip part, the problem arises that the chip part easily separates from the suction tool when some kind of moment is applied.
この発明の目的は種々の寸法の部品の吸着を確実にする
部品マウント装置を提供することにある。An object of the present invention is to provide a component mounting device that ensures the suction of components of various sizes.
本発明は吸着用ツールを内外2つの円筒部品からなる2
重構造にし、吸着面積が大小2種となるよう【すると共
に下面で内側の吸着用ツールを外側の吸着用ツールより
若干突出させ内側の吸着用ツールを外側の吸着用ツール
に出入り可能とすることにより、上記問題点を解決する
。The present invention provides a suction tool consisting of two cylindrical parts, an inner and an outer part.
It has a layered structure so that the suction area is divided into two types, large and small, and the inner suction tool is slightly protruded from the outer suction tool on the bottom surface so that the inner suction tool can go in and out of the outer suction tool. This solves the above problems.
以下、この発明を図面に基づいて説明する。The present invention will be explained below based on the drawings.
第2図、第3図は、この発明の一実施例を示す図である
。FIG. 2 and FIG. 3 are diagrams showing an embodiment of the present invention.
第2図に示すように真空源から真空バルブ1.2を介し
て真空圧Sにて吸引される中空軸乙の下部には吸着用ツ
ール7が嵌入し、止めねじユで固定されている。吸着用
ツール7のバレル孔、22ては頭部/グを設けたプラン
ジャざが滑入している。シランジャgの頭部/+の上端
には中空軸6との間の室に圧mノぐネデを間挿し、かつ
プランジャgには↓′η空吸着するだめの通気孔/ j
、、−1吸着口16がヱ4通してあけられている。As shown in FIG. 2, a suction tool 7 is fitted into the lower part of the hollow shaft B, which is sucked at a vacuum pressure S from a vacuum source via a vacuum valve 1.2, and is fixed with a set screw Y. The barrel hole 22 of the suction tool 7 has a plunger hole provided with a head/gun sliding therein. A pressure hole is inserted into the upper end of the head/+ of the sylanger g in the chamber between it and the hollow shaft 6, and the plunger g has a vent hole/j for air suction.
,, -1 suction ports 16 are opened through the (4) holes.
まだプランツヤどの下端には小寸法チップ部品IOを吸
着するための突出部17がある。さらにシランツヤgの
外周には縦溝/gがちり、縦溝/gと通気孔/Sとは半
径方向の連通孔19でつながり、吸着用ツール7の内側
には、円周溝20が設けてあり、第3図のように大寸法
チップ部品吸着時に吸着用ツール7の吸着口−/に通じ
るようになっている。There is still a protrusion 17 at the lower end of the planter for sucking small-sized chip components IO. Further, the outer periphery of the silan gloss g is dusted with vertical grooves /g, the vertical grooves /g and the ventilation holes /S are connected by radial communication holes 19, and the inside of the suction tool 7 is provided with a circumferential groove 20. As shown in FIG. 3, it communicates with the suction port -/ of the suction tool 7 when suctioning large-sized chip components.
吸着用ツールクはチップ供給トレイ上のチップ部品/θ
、//を吸着するだめ、あらかじめ装置1貞によって決
められた高さまで下降し、チップ部品/θ、//を吸着
し、次にノ?ツケージ上であらかじめ装置によって決め
られた高さまで下降し、チップ部品10.//をマウン
トする。The suction tool picks up the chip parts/θ on the chip supply tray.
, //, the device descends to a predetermined height, picks up the chip components /θ, //, and then ? The chip component 10. is lowered onto the cage to a height predetermined by the device. Mount //.
吸着の0N−OFFは吸着用ツール7の上下動のタイミ
ングに合わせ真空パルプ/2を制御して行なう。ここで
小寸法チップ部品10を吸着する場合、吸着口/A、通
気孔15、バネ9室、中空軸6を通じて真空圧3にて吸
引されているため、その吸着力はプランジャgの吸着口
/Aの面iBと真空圧3によって決まる。大寸法チップ
部品llを吸着する場合、吸着用ツール7端は大寸法チ
ップ部品l/は接する雀で降下するのでプランジャgは
大寸法チップ部品//に当りパネヂに抗して吸着用ツー
ル7中に押込まれる。そして吸着用ツール7の吸着口a
/、吸着用ツールの円周溝−〇、プランジャの縦溝iF
r、プランジャの連通孔19、通気孔/j、バネ室、中
空軸6を通じて真空圧Sより空気が吸引されると共にプ
ランジャの吸着口16からも吸引される。吸着力は吸着
用ツール7のバレル孔、2−の面積とプランジャざ先端
の突出部17の外径にて計算した面積の差Cの分が加わ
る。但しパネタの−ぐネ定数、圧縮量及び真空圧によっ
て吸着用ツール7、プランジャ3間に生じる抵抗等が影
響するので、次の様な関係が成立つことが必要である。The suction ON-OFF is performed by controlling the vacuum pulp/2 in accordance with the timing of the vertical movement of the suction tool 7. When the small-sized chip component 10 is sucked here, since it is sucked at a vacuum pressure of 3 through the suction port /A, the ventilation hole 15, the spring 9 chamber, and the hollow shaft 6, the suction force is the same as that of the suction port /A of the plunger g. It is determined by the plane iB of A and the vacuum pressure 3. When picking up a large-sized chip component 11, the end of the suction tool 7 descends when the large-sized chip component 1/ comes into contact with it, so the plunger g hits the large-sized chip component // and moves into the suction tool 7 against the panel. pushed into. And the suction port a of the suction tool 7
/, Circumferential groove of suction tool - ○, Vertical groove iF of plunger
r, air is sucked by the vacuum pressure S through the plunger's communication hole 19, the ventilation hole /j, the spring chamber, and the hollow shaft 6, and is also sucked from the plunger's suction port 16. The suction force is calculated by the difference C between the area of the barrel hole 2- of the suction tool 7 and the outer diameter of the protrusion 17 at the tip of the plunger. However, since the resistance generated between the suction tool 7 and the plunger 3 is affected by the pressure constant of the panel, the amount of compression, and the vacuum pressure, the following relationship must be established.
吸着用ツール7のバレル孔ココの面積をA1第2図の小
寸法チップ部品10を吸着している時のバネ9の圧縮量
をΔl工、吸着口16により定まる吸着面積をBとする
。第3図の大寸法チップ部品//を吸着した時のパネタ
の圧縮量はさらにΔ12だけ増加し、吸着面積もCだけ
増加する。The area of the barrel hole of the suction tool 7 is A1, the amount of compression of the spring 9 when suctioning the small-sized chip component 10 shown in FIG. 2 is Δl, and the suction area determined by the suction port 16 is B. When the large-sized chip component shown in FIG. 3 is sucked, the amount of compression of the panel increases by Δ12, and the suction area also increases by C.
吸着用ツール7とプランジャ3間の摺動抵抗F グランジャgの重量 W 真空圧 V。Sliding resistance F between suction tool 7 and plunger 3 Granja G weight W Vacuum pressure V.
パネタのバネ定数 K
とすると小寸法チップ部品10を吸着した時プランジャ
ざが真空圧によって引き込まれないためには
A−Vo−F(K−Δ41+wの
大寸法チップ部品/lを吸着しだ時プランジャSによっ
て吸着しているチップ部品/lを脱落させないためには
(B+C)−Vo)K−(Δ11+Δ)、)−(A
B −C) −vo+w −F ■従っての式
は
K・Δノよ+W+F)A・■G 00式は
(B十〇)−Vo+(A−B−C)・Vo)K1(Δ)
1+Δも)+W−F
A−V、)K−(Δ11+Δ、d、)+W−F■
0式と0式より
K・Δノ、+W+F)K・(Δ11+Δ12)+W−F
、’、 K (=・F/Δ)、 ■とな
り、プランシャtを最後に押込む力がシランジャgと吸
着用ツール7間の摺動抵抗の二倍以下でなければならな
いことを示している。従ってとの0式の条件によればバ
ネ9のバネ定数Kを小さくしておかねばならない。Assuming that the spring constant of the panel is K, in order to prevent the plunger from being drawn in by vacuum pressure when picking up a small-sized chip component 10, the plunger must be In order to prevent the chip parts/l adsorbed by S from falling off, (B+C)-Vo)K-(Δ11+Δ), )-(A
B -C) -vo+w -F ■Therefore, the formula is K・Δノ+W+F)A・■G 00 formula is (B〇)-Vo+(A-B-C)・Vo)K1(Δ)
1+Δ)+W-F A-V,)K-(Δ11+Δ, d,)+W-F■ From equations 0 and 0, K・Δノ,+W+F)K・(Δ11+Δ12)+W-F ,', K (=・F/Δ), (2) indicates that the force with which the plunger t is pushed in at the end must be less than twice the sliding resistance between the sylanger g and the suction tool 7. Therefore, according to the condition of equation 0, the spring constant K of the spring 9 must be kept small.
第7図は他の実施例を示す。この実施例は、大寸法チッ
プ部品//を吸着する場合、真空バルブlニー1./2
−2を直列に配して真空ノ々ルブ/2−2を三方切換と
し真空回路を切換え、真空圧な■1にすることによって
(Vl>VO)吸着力を大きくしてもよい。かくするこ
とにより第の式の条件は緩和され、パネデのバネ常数K
を大きくすることができるし、又大寸法チップ部品//
に対する吸着力を更に大きくすることも可能である。FIG. 7 shows another embodiment. In this embodiment, when picking up large-sized chip parts, the vacuum valve l knee 1. /2
-2 in series, the vacuum knob /2-2 is set to three-way switching, the vacuum circuit is switched, and the vacuum pressure is set to (Vl>VO) (Vl>VO) to increase the adsorption force. By doing this, the condition of the first equation is relaxed, and Panede's spring constant K
can be made larger, and large-sized chip parts//
It is also possible to further increase the adsorption force to the surface.
第5図は本発明の更に他の実施例の縦断面図である。内
筒となっているシランジャgには突出部/7を備えず、
バレル孔二二よりも大径の吸〃〒ロコ/を吸着用ツール
7に設け、プランジャどの外周の円周溝、2.lIと吸
着用ツール7のノ々レル孔コλに設けた円周溝ユタとが
シランジャgを吸着用ツール7に押込んだときに一部重
なるようにし、プランジャgが突出したときには該円周
溝217,2夕が重ならないようにして、例えば円周溝
2Sへ真空圧5へ通ずるように通気孔ユ6を設けたもの
である。FIG. 5 is a longitudinal sectional view of still another embodiment of the present invention. The syranja g, which is the inner cylinder, does not have a protrusion /7,
The suction tool 7 is provided with a suction loco/ having a diameter larger than the barrel hole 22, and the circumferential groove on the outer periphery of the plunger, 2. The circumferential groove lI and the circumferential groove UT provided in the nodal hole λ of the suction tool 7 are made to partially overlap when the syringe g is pushed into the suction tool 7, and when the plunger g protrudes, the circumferential groove UT For example, a vent hole 6 is provided in the circumferential groove 2S so as to communicate with the vacuum pressure 5 so that the grooves 217 and 2 do not overlap.
以上各説明で理解されるように本発明は小さい吸着口の
内筒と大きい吸着口の外筒を備え、内筒が突出している
ときには内筒により大きい吸着口と真空源との間が遮断
され、内筒が外筒に押込まれると大きい吸着口と真空源
が連通ずるように構成されているのである。As can be understood from the above descriptions, the present invention includes an inner cylinder with a small suction port and an outer cylinder with a large suction port, and when the inner cylinder protrudes, the inner cylinder blocks the large suction port and the vacuum source. The structure is such that when the inner cylinder is pushed into the outer cylinder, the large suction port communicates with the vacuum source.
以上説明してきたように、この発明によれば、その構成
を吸着用ツール7とシランジャgからなる二重構造とし
て出入り可能に外筒に内筒を嵌入し、内筒端の小吸着孔
にて小寸法チップ部品を吸着して内筒にて外筒の空気通
路を閉止し、内筒を押し込んで外筒端の吸着孔を真空源
に連通させて大寸法チップ部品を吸着するようにしたた
め、吸着するチップ部品の寸法が大きく異っても、吸着
力が弱くなったり、真空漏れによる吸着ミスを防ぐこと
ができるという効果が得られる。As explained above, according to the present invention, the structure is a double structure consisting of the suction tool 7 and the sylanger g, and the inner cylinder is inserted into the outer cylinder so that it can be moved in and out, and the small suction hole at the end of the inner cylinder By suctioning small-sized chip components, the inner cylinder closes the air passage of the outer cylinder, and the inner cylinder is pushed in to communicate the suction hole at the end of the outer cylinder with a vacuum source to suction large-sized chip components. Even if the dimensions of the chip components to be suctioned are greatly different, the suction force becomes weak and suction errors due to vacuum leaks can be prevented.
第7図は、従来方式のチップマワント装貨の吸着用ツー
ルの縦断面図、第一図、第3図は夫夫が本発明の吸着用
ツールの実施例の縦断面図である。第7図は大寸法チッ
プ部品吸着時において真空圧を変更する配管図、第5図
は他の実施例の縦断面図である。
/・・・吸着用ツール、コ・・・止めネジ、3・・・チ
ューブ、l・・・ツールホルダ、3・・・真空圧、t・
・・中空軸、7・・・吸着用ツール、g・・・シランジ
ャ、り・・・バネ、10.//・・・チップ部品、1.
2.l:L−1,lニー2・−・真空バルブ、/4’・
・・頭部、/左・・・通気孔、/乙・・・吸着口、/7
・・・突出部、7g・・・縦溝、/り・・・連通孔、2
0・・・円周溝1.2ノ・・・吸着口、ココ・・・バレ
ル孔、コグ、25・・・円周溝、2乙・・・通気孔。
特許出願人 東京測範株式会社
株式会社日立製作所
代理人 新井一部
第2図
と(
1FIG. 7 is a vertical cross-sectional view of a conventional tip-mounted cargo suction tool, and FIGS. 1 and 3 are vertical cross-sectional views of an embodiment of the suction tool of the present invention. FIG. 7 is a piping diagram for changing the vacuum pressure when picking up large-sized chip components, and FIG. 5 is a longitudinal sectional view of another embodiment. /... Suction tool, K... Set screw, 3... Tube, L... Tool holder, 3... Vacuum pressure, T...
...Hollow shaft, 7.Adsorption tool, g.Silanger, Ri...Spring, 10. //...Chip parts, 1.
2. l: L-1, l knee 2 --- vacuum valve, /4'
...Head, /Left...Vent hole, /B...Suction port, /7
...Protrusion, 7g...Vertical groove, /R...Communication hole, 2
0: Circumferential groove 1.2: Suction port, here: Barrel hole, cog, 25: Circumferential groove, 2: Ventilation hole. Patent Applicant: Tokyo Kenkyuhan Co., Ltd. Hitachi, Ltd. Agent: Arai Section Figure 2 and (1)
Claims (1)
ケージ上へ移送してマウントする装置において、吸着用
ツールは内外二重円筒状として夫々先端に真空源に通ず
る吸着口を備えて、内筒は外筒と先端面から制限的に弾
撥突出し外筒に滑入すると共に内筒の突出位置では外筒
の吸着口と真空源間は内筒により遮断されている部品マ
ウント装置。l In a device that sequentially transfers and mounts various parts of different sizes onto a package using a suction tool, the suction tool has an inner and outer double cylindrical shape, each with a suction port connected to a vacuum source at the tip, and an inner cylinder with a suction port connected to a vacuum source. A component mounting device that protrudes elastically from the outer cylinder and the tip surface in a limited manner and slides into the outer cylinder, and at the protruding position of the inner cylinder, the suction port of the outer cylinder and the vacuum source are blocked by the inner cylinder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7174983A JPS59197143A (en) | 1983-04-22 | 1983-04-22 | Mounting device for parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7174983A JPS59197143A (en) | 1983-04-22 | 1983-04-22 | Mounting device for parts |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59197143A true JPS59197143A (en) | 1984-11-08 |
JPH0342504B2 JPH0342504B2 (en) | 1991-06-27 |
Family
ID=13469486
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7174983A Granted JPS59197143A (en) | 1983-04-22 | 1983-04-22 | Mounting device for parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59197143A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62192646U (en) * | 1986-05-29 | 1987-12-08 | ||
EP0792097A1 (en) * | 1995-09-13 | 1997-08-27 | Matsushita Electric Industrial Co., Ltd. | Suction head of electronic part mounting machine |
KR100420778B1 (en) * | 2000-03-17 | 2004-03-02 | 가부시키가이샤 어드밴티스트 | Apparatus for supporting electronic components |
JP2007311465A (en) * | 2006-05-17 | 2007-11-29 | Shinkawa Ltd | Multiple-stage pressure collet |
WO2009056468A1 (en) * | 2007-10-31 | 2009-05-07 | Oerlikon Assembly Equipment Ag, Steinhausen | Pick-up tool and method for grasping and mounting small dies |
KR101071247B1 (en) | 2008-12-30 | 2011-10-10 | 엘아이지에이디피 주식회사 | Lift pin module and apparatus for bonding substrates with the lift pin module |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4428387Y1 (en) * | 1966-10-19 | 1969-11-25 | ||
JPS492868U (en) * | 1972-04-17 | 1974-01-11 |
-
1983
- 1983-04-22 JP JP7174983A patent/JPS59197143A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4428387Y1 (en) * | 1966-10-19 | 1969-11-25 | ||
JPS492868U (en) * | 1972-04-17 | 1974-01-11 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62192646U (en) * | 1986-05-29 | 1987-12-08 | ||
EP0792097A1 (en) * | 1995-09-13 | 1997-08-27 | Matsushita Electric Industrial Co., Ltd. | Suction head of electronic part mounting machine |
EP0792097A4 (en) * | 1995-09-13 | 1999-11-03 | Matsushita Electric Ind Co Ltd | Suction head of electronic part mounting machine |
KR100420778B1 (en) * | 2000-03-17 | 2004-03-02 | 가부시키가이샤 어드밴티스트 | Apparatus for supporting electronic components |
JP2007311465A (en) * | 2006-05-17 | 2007-11-29 | Shinkawa Ltd | Multiple-stage pressure collet |
JP4616793B2 (en) * | 2006-05-17 | 2011-01-19 | 株式会社新川 | Multi-stage pressure collet |
WO2009056468A1 (en) * | 2007-10-31 | 2009-05-07 | Oerlikon Assembly Equipment Ag, Steinhausen | Pick-up tool and method for grasping and mounting small dies |
KR101071247B1 (en) | 2008-12-30 | 2011-10-10 | 엘아이지에이디피 주식회사 | Lift pin module and apparatus for bonding substrates with the lift pin module |
Also Published As
Publication number | Publication date |
---|---|
JPH0342504B2 (en) | 1991-06-27 |
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