JPS59197143A - Mounting device for parts - Google Patents

Abstract

PURPOSE:To suck chips having different size positively by constituting a sucking tool mounting a chip part by an evacuating sucking tool and a vertically movable plunger positioned at the hollow section of the evacuating sucking tool, sucking a part having small size by the ventilating hole of the plunger when the part having small size is sucked and pushing up the plunger, opening the sucking hole of the tool and sucking a part having large size by two holes when the part having large size is sucked. CONSTITUTION:A hollow shaft 6 is inserted to the upper side of the hollow section of a tool 7 for suction as an outer cylinder, and vacuum pressure 5 is applied to the hollow shaft while a vacuum valve 12 is mounted between vacuum pressure and the hollow shaft. A plunger 8 with a head section 14 expanded through a spring 9 and a ventilating hole 15 penetrating the whole is inserted under the hollow shaft 6 in a vertically slidable manner, the head section 14 is brought into contact with the upper surface of the internal stepped section of the tool 7, and a vertical groove 18 formed to the inner wall of the tool 7 and a circumferential groove 20 are interrupted previously. According to such constitution, a part to be sucked 10 is sucked only by the plunger 8 when the part 10 is small, and the plunger 8 is pushed up, the grooves 18 and 20 are communicated with vacuum pressure 5 and the part is sucked by two parts when the part 10 is large.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a component suction tool in a component mounting device.

In the assembly process of semiconductor devices, there is work to transfer and mount various semiconductor elements called chip parts, integrated circuit elements, and various passive parts from a supply tray onto a package such as a board. Do this using The chip components to be mounted are generally square and one side is 0. There are various types from II vm to l dew level,
It is required to sequentially mount a large number of various types of chips on the same cage. In such cases, a cylindrical suction tool with a flat tip is often used.

As a conventional suction tool, there is one shown in FIG. 1, for example.

FIG. 1 is a longitudinal cross-sectional view, in which a tubular suction tool l fitted into a tool holder is fixed to the tool holder by a set screw, and a tube 3 connected to the rear end of the suction tool l creates a vacuum (not shown). It is designed to be suctioned by vacuum pressure S from the source. Although not shown in the drawings, the tool holder t has a suction tool l that descends onto a chip supply tray for chip components (not shown in FIG. Move it to a predetermined position according to the coordinates above, lower the chip component held by the suction tool onto the package, mount the chip component on the package with a solvent that has been applied on the package in advance, and eliminate the vacuum pressure 9. It is attached to the apparatus so that the suction tool 1 is raised to pick up a chip component to be bonded onto the next chip component onto the chip supply tray.

However, with such conventional suction tools, the dimensions of the chip components vary widely, and the height of the descending point of the suction tool during suction and mounting is constant. When handling many types of chip components with a vacuum tool, vacuum leaks may occur due to insufficient suction power or a gap forming between the suction tool and the chip components. In order to attract a large chip component to a suction tool with strong vacuum pressure at one point, it becomes necessary to apply a large pressure per unit area to the chip component. Furthermore, even if a small suction tool is used to pick up a large chip part, the problem arises that the chip part easily separates from the suction tool when some kind of moment is applied.

An object of the present invention is to provide a component mounting device that ensures the suction of components of various sizes.

The present invention provides a suction tool consisting of two cylindrical parts, an inner and an outer part.
It has a layered structure so that the suction area is divided into two types, large and small, and the inner suction tool is slightly protruded from the outer suction tool on the bottom surface so that the inner suction tool can go in and out of the outer suction tool. This solves the above problems.

The present invention will be explained below based on the drawings.

FIG. 2 and FIG. 3 are diagrams showing an embodiment of the present invention.

As shown in FIG. 2, a suction tool 7 is fitted into the lower part of the hollow shaft B, which is sucked at a vacuum pressure S from a vacuum source via a vacuum valve 1.2, and is fixed with a set screw Y. The barrel hole 22 of the suction tool 7 has a plunger hole provided with a head/gun sliding therein. A pressure hole is inserted into the upper end of the head/+ of the sylanger g in the chamber between it and the hollow shaft 6, and the plunger g has a vent hole/j for air suction.
,, -1 suction ports 16 are opened through the (4) holes.

There is still a protrusion 17 at the lower end of the planter for sucking small-sized chip components IO. Further, the outer periphery of the silan gloss g is dusted with vertical grooves /g, the vertical grooves /g and the ventilation holes /S are connected by radial communication holes 19, and the inside of the suction tool 7 is provided with a circumferential groove 20. As shown in FIG. 3, it communicates with the suction port -/ of the suction tool 7 when suctioning large-sized chip components.

The suction tool picks up the chip parts/θ on the chip supply tray.
, //, the device descends to a predetermined height, picks up the chip components /θ, //, and then ? The chip component 10. is lowered onto the cage to a height predetermined by the device. Mount //.

The suction ON-OFF is performed by controlling the vacuum pulp/2 in accordance with the timing of the vertical movement of the suction tool 7. When the small-sized chip component 10 is sucked here, since it is sucked at a vacuum pressure of 3 through the suction port /A, the ventilation hole 15, the spring 9 chamber, and the hollow shaft 6, the suction force is the same as that of the suction port /A of the plunger g. It is determined by the plane iB of A and the vacuum pressure 3. When picking up a large-sized chip component 11, the end of the suction tool 7 descends when the large-sized chip component 1/ comes into contact with it, so the plunger g hits the large-sized chip component // and moves into the suction tool 7 against the panel. pushed into. And the suction port a of the suction tool 7
/, Circumferential groove of suction tool - ○, Vertical groove iF of plunger
r, air is sucked by the vacuum pressure S through the plunger's communication hole 19, the ventilation hole /j, the spring chamber, and the hollow shaft 6, and is also sucked from the plunger's suction port 16. The suction force is calculated by the difference C between the area of the barrel hole 2- of the suction tool 7 and the outer diameter of the protrusion 17 at the tip of the plunger. However, since the resistance generated between the suction tool 7 and the plunger 3 is affected by the pressure constant of the panel, the amount of compression, and the vacuum pressure, the following relationship must be established.

The area of the barrel hole of the suction tool 7 is A1, the amount of compression of the spring 9 when suctioning the small-sized chip component 10 shown in FIG. 2 is Δl, and the suction area determined by the suction port 16 is B. When the large-sized chip component shown in FIG. 3 is sucked, the amount of compression of the panel increases by Δ12, and the suction area also increases by C.

Sliding resistance F between suction tool 7 and plunger 3 Granja G weight W Vacuum pressure V.

Assuming that the spring constant of the panel is K, in order to prevent the plunger from being drawn in by vacuum pressure when picking up a small-sized chip component 10, the plunger must be In order to prevent the chip parts/l adsorbed by S from falling off, (B+C)-Vo)K-(Δ11+Δ), )-(A
B -C) -vo+w -F ■Therefore, the formula is K・Δノ+W+F)A・■G 00 formula is (B〇)-Vo+(A-B-C)・Vo)K1(Δ)
1+Δ)+W-F A-V,)K-(Δ11+Δ, d,)+W-F■ From equations 0 and 0, K・Δノ,+W+F)K・(Δ11+Δ12)+W-F ,', K (=・F/Δ), (2) indicates that the force with which the plunger t is pushed in at the end must be less than twice the sliding resistance between the sylanger g and the suction tool 7. Therefore, according to the condition of equation 0, the spring constant K of the spring 9 must be kept small.

FIG. 7 shows another embodiment. In this embodiment, when picking up large-sized chip parts, the vacuum valve l knee 1. /2
-2 in series, the vacuum knob /2-2 is set to three-way switching, the vacuum circuit is switched, and the vacuum pressure is set to (Vl>VO) (Vl>VO) to increase the adsorption force. By doing this, the condition of the first equation is relaxed, and Panede's spring constant K
can be made larger, and large-sized chip parts//
It is also possible to further increase the adsorption force to the surface.

FIG. 5 is a longitudinal sectional view of still another embodiment of the present invention. The syranja g, which is the inner cylinder, does not have a protrusion /7,
The suction tool 7 is provided with a suction loco/ having a diameter larger than the barrel hole 22, and the circumferential groove on the outer periphery of the plunger, 2. The circumferential groove lI and the circumferential groove UT provided in the nodal hole λ of the suction tool 7 are made to partially overlap when the syringe g is pushed into the suction tool 7, and when the plunger g protrudes, the circumferential groove UT For example, a vent hole 6 is provided in the circumferential groove 2S so as to communicate with the vacuum pressure 5 so that the grooves 217 and 2 do not overlap.

As can be understood from the above descriptions, the present invention includes an inner cylinder with a small suction port and an outer cylinder with a large suction port, and when the inner cylinder protrudes, the inner cylinder blocks the large suction port and the vacuum source. The structure is such that when the inner cylinder is pushed into the outer cylinder, the large suction port communicates with the vacuum source.

As explained above, according to the present invention, the structure is a double structure consisting of the suction tool 7 and the sylanger g, and the inner cylinder is inserted into the outer cylinder so that it can be moved in and out, and the small suction hole at the end of the inner cylinder By suctioning small-sized chip components, the inner cylinder closes the air passage of the outer cylinder, and the inner cylinder is pushed in to communicate the suction hole at the end of the outer cylinder with a vacuum source to suction large-sized chip components. Even if the dimensions of the chip components to be suctioned are greatly different, the suction force becomes weak and suction errors due to vacuum leaks can be prevented.

[Brief explanation of the drawing]

FIG. 7 is a vertical cross-sectional view of a conventional tip-mounted cargo suction tool, and FIGS. 1 and 3 are vertical cross-sectional views of an embodiment of the suction tool of the present invention. FIG. 7 is a piping diagram for changing the vacuum pressure when picking up large-sized chip components, and FIG. 5 is a longitudinal sectional view of another embodiment. /... Suction tool, K... Set screw, 3... Tube, L... Tool holder, 3... Vacuum pressure, T...
...Hollow shaft, 7.Adsorption tool, g.Silanger, Ri...Spring, 10. //...Chip parts, 1.
2. l: L-1, l knee 2 --- vacuum valve, /4'
...Head, /Left...Vent hole, /B...Suction port, /7
...Protrusion, 7g...Vertical groove, /R...Communication hole, 2
0: Circumferential groove 1.2: Suction port, here: Barrel hole, cog, 25: Circumferential groove, 2: Ventilation hole. Patent Applicant: Tokyo Kenkyuhan Co., Ltd. Hitachi, Ltd. Agent: Arai Section Figure 2 and (1)

Claims (1)

[Claims] l In a device that sequentially transfers and mounts various parts of different sizes onto a package using a suction tool, the suction tool has an inner and outer double cylindrical shape, each with a suction port connected to a vacuum source at the tip, and an inner cylinder with a suction port connected to a vacuum source. A component mounting device that protrudes elastically from the outer cylinder and the tip surface in a limited manner and slides into the outer cylinder, and at the protruding position of the inner cylinder, the suction port of the outer cylinder and the vacuum source are blocked by the inner cylinder.