JPS59181609A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS59181609A JPS59181609A JP5601283A JP5601283A JPS59181609A JP S59181609 A JPS59181609 A JP S59181609A JP 5601283 A JP5601283 A JP 5601283A JP 5601283 A JP5601283 A JP 5601283A JP S59181609 A JPS59181609 A JP S59181609A
- Authority
- JP
- Japan
- Prior art keywords
- film
- single crystal
- silicon
- thermal oxide
- crystallinity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02694—Controlling the interface between substrate and epitaxial layer, e.g. by ion implantation followed by annealing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Recrystallisation Techniques (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5601283A JPS59181609A (ja) | 1983-03-31 | 1983-03-31 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5601283A JPS59181609A (ja) | 1983-03-31 | 1983-03-31 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59181609A true JPS59181609A (ja) | 1984-10-16 |
| JPH0136971B2 JPH0136971B2 (enExample) | 1989-08-03 |
Family
ID=13015139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5601283A Granted JPS59181609A (ja) | 1983-03-31 | 1983-03-31 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59181609A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63137412A (ja) * | 1986-11-29 | 1988-06-09 | Sharp Corp | 半導体用基板の製造方法 |
| WO2002004935A1 (fr) * | 2000-07-06 | 2002-01-17 | Asahi Kasei Kabushiki Kaisha | Détecteur de molécules |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54161268A (en) * | 1978-06-09 | 1979-12-20 | Hewlett Packard Yokogawa | Method of manufacturing semiconductor device growing silicon layer on sapphire substrate |
| JPS56103425A (en) * | 1980-01-21 | 1981-08-18 | Nippon Telegr & Teleph Corp <Ntt> | Improving method for semiconductor substrate |
-
1983
- 1983-03-31 JP JP5601283A patent/JPS59181609A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54161268A (en) * | 1978-06-09 | 1979-12-20 | Hewlett Packard Yokogawa | Method of manufacturing semiconductor device growing silicon layer on sapphire substrate |
| JPS56103425A (en) * | 1980-01-21 | 1981-08-18 | Nippon Telegr & Teleph Corp <Ntt> | Improving method for semiconductor substrate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63137412A (ja) * | 1986-11-29 | 1988-06-09 | Sharp Corp | 半導体用基板の製造方法 |
| WO2002004935A1 (fr) * | 2000-07-06 | 2002-01-17 | Asahi Kasei Kabushiki Kaisha | Détecteur de molécules |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0136971B2 (enExample) | 1989-08-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7442657B2 (en) | Producing stress-relaxed crystalline layer on a substrate | |
| US6703293B2 (en) | Implantation at elevated temperatures for amorphization re-crystallization of Si1-xGex films on silicon substrates | |
| JP5065676B2 (ja) | 基板上に歪層を製造する方法及び層構造 | |
| JP2004014856A (ja) | 半導体基板の製造方法及び半導体装置の製造方法 | |
| JP2004363592A (ja) | 十分に格子緩和された高品質SiGeオン・インシュレータ基板材料を製造する方法、基板材料、およびヘテロ構造 | |
| JP2006524426A (ja) | 基板上に歪層を製造する方法と層構造 | |
| JPH10294281A (ja) | 転位低減方法 | |
| CN1622294A (zh) | 改善有缺陷的半导体材料质量的方法 | |
| US4693758A (en) | Method of making devices in silicon, on insulator regrown by laser beam | |
| JPS5918196A (ja) | 単結晶薄膜の製造方法 | |
| JPS59181609A (ja) | 半導体装置の製造方法 | |
| JPS5821818B2 (ja) | 半導体単結晶膜の製造方法 | |
| JPS59228713A (ja) | 半導体装置の製造方法 | |
| JP3273037B2 (ja) | ヘテロ構造半導体多層薄膜の製造方法 | |
| JPS6091623A (ja) | 半導体単結晶薄膜の製造方法 | |
| JPS6028223A (ja) | 半導体結晶薄膜の製造方法 | |
| JPH0810669B2 (ja) | Soi膜の形成方法 | |
| JPH0620056B2 (ja) | CaF▲下2▼膜成長方法 | |
| KR20010038202A (ko) | 반도체박막을 저온성장하는 방법 | |
| JPS58176930A (ja) | 半導体装置の製造方法 | |
| JPS60126813A (ja) | 半導体装置の製造方法 | |
| JPS63311718A (ja) | ヘテロ構造単結晶半導体薄膜の製造方法 | |
| JPH03297148A (ja) | 半導体装置の製造方法 | |
| JP2699347B2 (ja) | 半導体基板の製造方法 | |
| JPS5893215A (ja) | 半導体単結晶薄膜の製造方法 |