JPS5917720Y2 - ワイパア−ム - Google Patents
ワイパア−ムInfo
- Publication number
- JPS5917720Y2 JPS5917720Y2 JP17731879U JP17731879U JPS5917720Y2 JP S5917720 Y2 JPS5917720 Y2 JP S5917720Y2 JP 17731879 U JP17731879 U JP 17731879U JP 17731879 U JP17731879 U JP 17731879U JP S5917720 Y2 JPS5917720 Y2 JP S5917720Y2
- Authority
- JP
- Japan
- Prior art keywords
- outer cylinder
- friction material
- wiper arm
- wiper
- material layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003831 antifriction material Substances 0.000 claims description 17
- 229910045601 alloy Inorganic materials 0.000 claims description 10
- 239000000956 alloy Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910000831 Steel Inorganic materials 0.000 claims description 5
- 239000010959 steel Substances 0.000 claims description 5
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000005357 flat glass Substances 0.000 description 8
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 238000002788 crimping Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Sliding-Contact Bearings (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17731879U JPS5917720Y2 (ja) | 1979-12-21 | 1979-12-21 | ワイパア−ム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17731879U JPS5917720Y2 (ja) | 1979-12-21 | 1979-12-21 | ワイパア−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5695958U JPS5695958U (enrdf_load_stackoverflow) | 1981-07-30 |
| JPS5917720Y2 true JPS5917720Y2 (ja) | 1984-05-23 |
Family
ID=29687903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17731879U Expired JPS5917720Y2 (ja) | 1979-12-21 | 1979-12-21 | ワイパア−ム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5917720Y2 (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0717184B2 (ja) * | 1986-05-06 | 1995-03-01 | 市光工業株式会社 | ワイパア−ムの付勢装置 |
| JPH0616847Y2 (ja) * | 1987-06-16 | 1994-05-02 | 自動車電機工業株式会社 | ワイパア−ム |
| JP7232101B2 (ja) * | 2019-03-29 | 2023-03-02 | 株式会社デンソーワイパシステムズ | ワイパーアーム |
-
1979
- 1979-12-21 JP JP17731879U patent/JPS5917720Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5695958U (enrdf_load_stackoverflow) | 1981-07-30 |
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