JPS59172807A - 積層型位相同期圧電発振器 - Google Patents

積層型位相同期圧電発振器

Info

Publication number
JPS59172807A
JPS59172807A JP4744983A JP4744983A JPS59172807A JP S59172807 A JPS59172807 A JP S59172807A JP 4744983 A JP4744983 A JP 4744983A JP 4744983 A JP4744983 A JP 4744983A JP S59172807 A JPS59172807 A JP S59172807A
Authority
JP
Japan
Prior art keywords
piezoelectric oscillator
circuit
voltage holding
holding circuit
voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4744983A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0468803B2 (https=
Inventor
Yuzo Shimada
嶋田　勇三
Shuzo Fujii
修三 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP4744983A priority Critical patent/JPS59172807A/ja
Priority to EP83112593A priority patent/EP0111890B1/en
Priority to DE8383112593T priority patent/DE3382208D1/de
Priority to US06/561,506 priority patent/US4574255A/en
Priority to AU22427/83A priority patent/AU563467B2/en
Publication of JPS59172807A publication Critical patent/JPS59172807A/ja
Publication of JPH0468803B2 publication Critical patent/JPH0468803B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/495—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
    • C04B35/497—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates based on solid solutions with lead oxides
    • C04B35/499—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates based on solid solutions with lead oxides containing also titanates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
    • H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
JP4744983A 1982-12-15 1983-03-22 積層型位相同期圧電発振器 Granted JPS59172807A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP4744983A JPS59172807A (ja) 1983-03-22 1983-03-22 積層型位相同期圧電発振器
EP83112593A EP0111890B1 (en) 1982-12-15 1983-12-14 Monolithic multicomponents ceramic substrate with at least one dielectric layer of a composition having a perovskite structure
DE8383112593T DE3382208D1 (de) 1982-12-15 1983-12-14 Monolithisches vielschichtkeramiksubstrat mit mindestens einer dielektrischen schicht aus einem material mit perovskit-struktur.
US06/561,506 US4574255A (en) 1982-12-15 1983-12-15 MMC Substrate including capacitors having perovskite structure dielectric and electrical devices including MMC substrate
AU22427/83A AU563467B2 (en) 1982-12-15 1983-12-15 Ceramic substrate for piezoelectric element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4744983A JPS59172807A (ja) 1983-03-22 1983-03-22 積層型位相同期圧電発振器

Publications (2)

Publication Number Publication Date
JPS59172807A true JPS59172807A (ja) 1984-09-29
JPH0468803B2 JPH0468803B2 (https=) 1992-11-04

Family

ID=12775457

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4744983A Granted JPS59172807A (ja) 1982-12-15 1983-03-22 積層型位相同期圧電発振器

Country Status (1)

Country Link
JP (1) JPS59172807A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6416670U (https=) * 1987-07-21 1989-01-27
JP2007149879A (ja) * 2005-11-25 2007-06-14 Kyocera Corp 電子部品封止用基板およびそれを用いた電子装置、電子装置の製造方法
JP2007160499A (ja) * 2005-11-16 2007-06-28 Kyocera Corp 電子部品封止用基板および複数個取り形態の電子部品封止用基板、並びに電子部品封止用基板を用いた電子装置および電子装置の製造方法
JP2011035170A (ja) * 2009-07-31 2011-02-17 Olympus Corp 多層積層回路
US7932594B2 (en) 2005-11-16 2011-04-26 Kyocera Corporation Electronic component sealing substrate for hermetically sealing a micro electronic mechanical system of an electronic component

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5176062A (ja) * 1974-12-26 1976-07-01 Suwa Seikosha Kk Denshidokei
JPS51106050A (en) * 1975-03-14 1976-09-20 Citizen Watch Co Ltd Denshidokeiniokeru denshikairososhi
JPS5239871U (https=) * 1975-09-11 1977-03-22
JPS5240664U (https=) * 1975-09-17 1977-03-23
JPS5479468A (en) * 1977-12-08 1979-06-25 Fujitsu Ltd Method of producing ceramic multiicircuit layer board
JPS5521665A (en) * 1978-08-04 1980-02-15 Mitsubishi Electric Corp Constituent of multi-layer transmission line
JPS56154805A (en) * 1980-04-30 1981-11-30 Mitsubishi Electric Corp Multilayer uniting method for triplet strip line
JPS5816595A (ja) * 1981-07-23 1983-01-31 ティーディーケイ株式会社 混成集積回路

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5176062A (ja) * 1974-12-26 1976-07-01 Suwa Seikosha Kk Denshidokei
JPS51106050A (en) * 1975-03-14 1976-09-20 Citizen Watch Co Ltd Denshidokeiniokeru denshikairososhi
JPS5239871U (https=) * 1975-09-11 1977-03-22
JPS5240664U (https=) * 1975-09-17 1977-03-23
JPS5479468A (en) * 1977-12-08 1979-06-25 Fujitsu Ltd Method of producing ceramic multiicircuit layer board
JPS5521665A (en) * 1978-08-04 1980-02-15 Mitsubishi Electric Corp Constituent of multi-layer transmission line
JPS56154805A (en) * 1980-04-30 1981-11-30 Mitsubishi Electric Corp Multilayer uniting method for triplet strip line
JPS5816595A (ja) * 1981-07-23 1983-01-31 ティーディーケイ株式会社 混成集積回路

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6416670U (https=) * 1987-07-21 1989-01-27
JP2007160499A (ja) * 2005-11-16 2007-06-28 Kyocera Corp 電子部品封止用基板および複数個取り形態の電子部品封止用基板、並びに電子部品封止用基板を用いた電子装置および電子装置の製造方法
US7932594B2 (en) 2005-11-16 2011-04-26 Kyocera Corporation Electronic component sealing substrate for hermetically sealing a micro electronic mechanical system of an electronic component
JP2007149879A (ja) * 2005-11-25 2007-06-14 Kyocera Corp 電子部品封止用基板およびそれを用いた電子装置、電子装置の製造方法
JP2011035170A (ja) * 2009-07-31 2011-02-17 Olympus Corp 多層積層回路

Also Published As

Publication number Publication date
JPH0468803B2 (https=) 1992-11-04

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