JPS59172722A - アライメントマ−クの製造方法 - Google Patents
アライメントマ−クの製造方法Info
- Publication number
- JPS59172722A JPS59172722A JP58047025A JP4702583A JPS59172722A JP S59172722 A JPS59172722 A JP S59172722A JP 58047025 A JP58047025 A JP 58047025A JP 4702583 A JP4702583 A JP 4702583A JP S59172722 A JPS59172722 A JP S59172722A
- Authority
- JP
- Japan
- Prior art keywords
- alignment mark
- film
- alignment
- oxide film
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58047025A JPS59172722A (ja) | 1983-03-23 | 1983-03-23 | アライメントマ−クの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58047025A JPS59172722A (ja) | 1983-03-23 | 1983-03-23 | アライメントマ−クの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59172722A true JPS59172722A (ja) | 1984-09-29 |
| JPS6347330B2 JPS6347330B2 (cg-RX-API-DMAC10.html) | 1988-09-21 |
Family
ID=12763632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58047025A Granted JPS59172722A (ja) | 1983-03-23 | 1983-03-23 | アライメントマ−クの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59172722A (cg-RX-API-DMAC10.html) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61154127A (ja) * | 1984-12-27 | 1986-07-12 | Oki Electric Ind Co Ltd | ウエハ−アライメント・マ−ク |
| JPH02134808A (ja) * | 1988-11-16 | 1990-05-23 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPH0377309A (ja) * | 1989-08-19 | 1991-04-02 | Fujitsu Ltd | 半導体装置の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5180777A (cg-RX-API-DMAC10.html) * | 1975-01-13 | 1976-07-14 | Hitachi Ltd | |
| JPS5662324A (en) * | 1979-10-26 | 1981-05-28 | Seiko Epson Corp | Semiconductor device position fitting method |
-
1983
- 1983-03-23 JP JP58047025A patent/JPS59172722A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5180777A (cg-RX-API-DMAC10.html) * | 1975-01-13 | 1976-07-14 | Hitachi Ltd | |
| JPS5662324A (en) * | 1979-10-26 | 1981-05-28 | Seiko Epson Corp | Semiconductor device position fitting method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61154127A (ja) * | 1984-12-27 | 1986-07-12 | Oki Electric Ind Co Ltd | ウエハ−アライメント・マ−ク |
| JPH02134808A (ja) * | 1988-11-16 | 1990-05-23 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPH0377309A (ja) * | 1989-08-19 | 1991-04-02 | Fujitsu Ltd | 半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6347330B2 (cg-RX-API-DMAC10.html) | 1988-09-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW488080B (en) | Method for producing thin film transistor | |
| JPS59224123A (ja) | ウエハアライメントマ−ク | |
| US5128283A (en) | Method of forming mask alignment marks | |
| JPH0425126A (ja) | 半導体装置の製造方法 | |
| JPH0722179B2 (ja) | 半導体ウエ−ハの位置合せマ−クの形成方法 | |
| JPS6347330B2 (cg-RX-API-DMAC10.html) | ||
| US5665645A (en) | Method of manufacturing a semiconductor device using reticles | |
| JP3474865B2 (ja) | 半導体装置の製造方法 | |
| JP3159168B2 (ja) | 半導体装置とその製造方法 | |
| JP2666393B2 (ja) | 半導体装置 | |
| JPS59155921A (ja) | レジストパタ−ンの形成方法 | |
| JP3373382B2 (ja) | 半導体装置の製造方法 | |
| JPH10189425A (ja) | アライメント方法、アライメント精度測定方法及びアライメント測定用マーク | |
| JPS6097639A (ja) | 半導体装置の製造方法 | |
| JP2913716B2 (ja) | 半導体装置 | |
| JPH0536583A (ja) | 位置合せ方法および半導体集積回路装置の製造方法 | |
| JPS5952867A (ja) | 絶縁層に識別記号を刻設した半導体装置及びその製造方法 | |
| JPH04239116A (ja) | 半導体装置の製造方法 | |
| JPS60249347A (ja) | セミカスタムicの製造方法 | |
| JP2822938B2 (ja) | 重ね合わせ精度の測定方法 | |
| JPH07240362A (ja) | 半導体装置の製造方法 | |
| JP3330673B2 (ja) | 半導体装置及びその製造方法 | |
| JPH063813B2 (ja) | 薄膜トランジスタの製造方法 | |
| JPS6229138A (ja) | マ−ク合わせ方法およびそれに用いるアライメントマ−ク | |
| JPH0822947A (ja) | パターン形成方法及び半導体装置の製造方法 |