JPS59172258A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS59172258A
JPS59172258A JP58044419A JP4441983A JPS59172258A JP S59172258 A JPS59172258 A JP S59172258A JP 58044419 A JP58044419 A JP 58044419A JP 4441983 A JP4441983 A JP 4441983A JP S59172258 A JPS59172258 A JP S59172258A
Authority
JP
Japan
Prior art keywords
film
bonding pad
semiconductor device
phosphorus
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58044419A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0343785B2 (enExample
Inventor
Shigeo Ishii
石井　重雄
Kazuhiro Tsurumaru
鶴丸　和弘
Shunichiro Shigematsu
重松　俊一郎
Izumi Tezuka
手塚　泉
Eiji Minamimura
南村　英二
Isao Sakamoto
功 坂本
Kazuo Shimizu
一男 清水
Shizuo Kondo
近藤　静雄
Keisuke Takada
啓祐 高田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Microcomputer System Ltd
Hitachi Ltd
Original Assignee
Hitachi Ltd
Hitachi Microcomputer Engineering Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Microcomputer Engineering Ltd filed Critical Hitachi Ltd
Priority to JP58044419A priority Critical patent/JPS59172258A/ja
Publication of JPS59172258A publication Critical patent/JPS59172258A/ja
Publication of JPH0343785B2 publication Critical patent/JPH0343785B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/147—
    • H10W74/121—
    • H10W74/137—
    • H10W70/60—
    • H10W72/01515—
    • H10W72/075—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/59—
    • H10W72/884—
    • H10W72/90—
    • H10W72/934—
    • H10W72/983—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP58044419A 1983-03-18 1983-03-18 半導体装置 Granted JPS59172258A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58044419A JPS59172258A (ja) 1983-03-18 1983-03-18 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58044419A JPS59172258A (ja) 1983-03-18 1983-03-18 半導体装置

Publications (2)

Publication Number Publication Date
JPS59172258A true JPS59172258A (ja) 1984-09-28
JPH0343785B2 JPH0343785B2 (enExample) 1991-07-03

Family

ID=12690968

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58044419A Granted JPS59172258A (ja) 1983-03-18 1983-03-18 半導体装置

Country Status (1)

Country Link
JP (1) JPS59172258A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH027549A (ja) * 1988-02-24 1990-01-11 Motorola Inc 接着増進剤を有するプラスチック封止用半導体ダイ

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56150830A (en) * 1980-04-25 1981-11-21 Hitachi Ltd Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56150830A (en) * 1980-04-25 1981-11-21 Hitachi Ltd Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH027549A (ja) * 1988-02-24 1990-01-11 Motorola Inc 接着増進剤を有するプラスチック封止用半導体ダイ

Also Published As

Publication number Publication date
JPH0343785B2 (enExample) 1991-07-03

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