JPS59171129A - 自動配線検査装置 - Google Patents

自動配線検査装置

Info

Publication number
JPS59171129A
JPS59171129A JP58044791A JP4479183A JPS59171129A JP S59171129 A JPS59171129 A JP S59171129A JP 58044791 A JP58044791 A JP 58044791A JP 4479183 A JP4479183 A JP 4479183A JP S59171129 A JPS59171129 A JP S59171129A
Authority
JP
Japan
Prior art keywords
inspection
wire
output
image
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58044791A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0576185B2 (enExample
Inventor
Masahito Nakajima
雅人 中島
Hiroyuki Tsukahara
博之 塚原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58044791A priority Critical patent/JPS59171129A/ja
Publication of JPS59171129A publication Critical patent/JPS59171129A/ja
Publication of JPH0576185B2 publication Critical patent/JPH0576185B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
JP58044791A 1983-03-17 1983-03-17 自動配線検査装置 Granted JPS59171129A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58044791A JPS59171129A (ja) 1983-03-17 1983-03-17 自動配線検査装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58044791A JPS59171129A (ja) 1983-03-17 1983-03-17 自動配線検査装置

Publications (2)

Publication Number Publication Date
JPS59171129A true JPS59171129A (ja) 1984-09-27
JPH0576185B2 JPH0576185B2 (enExample) 1993-10-22

Family

ID=12701235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58044791A Granted JPS59171129A (ja) 1983-03-17 1983-03-17 自動配線検査装置

Country Status (1)

Country Link
JP (1) JPS59171129A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0244205A (ja) * 1988-08-03 1990-02-14 Nec Corp ボンディングワイヤの形状検査装置
JPH0376137A (ja) * 1989-08-18 1991-04-02 Toshiba Corp ワイヤボンディング検査装置
US5170062A (en) * 1990-10-12 1992-12-08 Kabushiki Kaisha Toshiba Wire bonding inspecting apparatus with moving imaging area
CN103091339A (zh) * 2013-03-01 2013-05-08 苏州爱特盟光电有限公司 一种用于键合工艺微缺陷检测的方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57155743A (en) * 1981-03-20 1982-09-25 Fujitsu Ltd Inspection device for semiconductor bonding wire
JPH0339418A (ja) * 1989-07-04 1991-02-20 Sumitomo Metal Ind Ltd 高温での弾性率低下の少ない鉄骨建築用鋼材の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57155743A (en) * 1981-03-20 1982-09-25 Fujitsu Ltd Inspection device for semiconductor bonding wire
JPH0339418A (ja) * 1989-07-04 1991-02-20 Sumitomo Metal Ind Ltd 高温での弾性率低下の少ない鉄骨建築用鋼材の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0244205A (ja) * 1988-08-03 1990-02-14 Nec Corp ボンディングワイヤの形状検査装置
JPH0376137A (ja) * 1989-08-18 1991-04-02 Toshiba Corp ワイヤボンディング検査装置
US5170062A (en) * 1990-10-12 1992-12-08 Kabushiki Kaisha Toshiba Wire bonding inspecting apparatus with moving imaging area
CN103091339A (zh) * 2013-03-01 2013-05-08 苏州爱特盟光电有限公司 一种用于键合工艺微缺陷检测的方法

Also Published As

Publication number Publication date
JPH0576185B2 (enExample) 1993-10-22

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