JPS59171123A - 真空処理装置 - Google Patents

真空処理装置

Info

Publication number
JPS59171123A
JPS59171123A JP58044143A JP4414383A JPS59171123A JP S59171123 A JPS59171123 A JP S59171123A JP 58044143 A JP58044143 A JP 58044143A JP 4414383 A JP4414383 A JP 4414383A JP S59171123 A JPS59171123 A JP S59171123A
Authority
JP
Japan
Prior art keywords
vacuum
wafer
chamber
vacuum processing
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58044143A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0329171B2 (enExample
Inventor
Yutaka Kakehi
掛樋　豊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58044143A priority Critical patent/JPS59171123A/ja
Publication of JPS59171123A publication Critical patent/JPS59171123A/ja
Publication of JPH0329171B2 publication Critical patent/JPH0329171B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices

Landscapes

  • Drying Of Semiconductors (AREA)
JP58044143A 1983-03-18 1983-03-18 真空処理装置 Granted JPS59171123A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58044143A JPS59171123A (ja) 1983-03-18 1983-03-18 真空処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58044143A JPS59171123A (ja) 1983-03-18 1983-03-18 真空処理装置

Publications (2)

Publication Number Publication Date
JPS59171123A true JPS59171123A (ja) 1984-09-27
JPH0329171B2 JPH0329171B2 (enExample) 1991-04-23

Family

ID=12683413

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58044143A Granted JPS59171123A (ja) 1983-03-18 1983-03-18 真空処理装置

Country Status (1)

Country Link
JP (1) JPS59171123A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02295149A (ja) * 1989-05-10 1990-12-06 Fujitsu Ltd 基板搬送装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59119846A (ja) * 1982-12-27 1984-07-11 Fujitsu Ltd 真空処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59119846A (ja) * 1982-12-27 1984-07-11 Fujitsu Ltd 真空処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02295149A (ja) * 1989-05-10 1990-12-06 Fujitsu Ltd 基板搬送装置

Also Published As

Publication number Publication date
JPH0329171B2 (enExample) 1991-04-23

Similar Documents

Publication Publication Date Title
US6330755B1 (en) Vacuum processing and operating method
JPH04229633A (ja) 真空ウェハ搬送処理装置及び方法
CN108695207A (zh) 基片处理装置
JP3320539B2 (ja) 被処理体の搬入、搬出装置
JP2001118904A5 (enExample)
JP2003115518A (ja) 基板処理装置
JPS60113428A (ja) 半導体製造装置
JP2001239144A (ja) ロードロック式真空装置
JP4229497B2 (ja) 基板処理装置および基板の処理方法
JPH1079412A (ja) 半導体製造装置
JPH0387386A (ja) 基板処理装置及び真空処理方法
JPH0542507B2 (enExample)
JPH0329171B2 (enExample)
JPH0252449A (ja) 基板のロード・アンロード方法
JPH04298059A (ja) 真空処理装置
JPH0237742A (ja) 半導体装置の製造装置
JP3421358B2 (ja) 搬送方法
JP2550787B2 (ja) 半導体装置の製造装置
USRE39775E1 (en) Vacuum processing operating method with wafers, substrates and/or semiconductors
JPS61168934A (ja) ウエハハンドリング方法
JP2601369Y2 (ja) 枚葉式成膜装置における基板搬送装置
JP2883597B2 (ja) 真空処理装置及び半導体基板処理方法
JP2000271469A (ja) 真空処理装置
JP2912318B2 (ja) 真空処理装置用搬送システム
JPS6085527A (ja) 真空処理装置