JPS59161055A - 樹脂封止型電子装置 - Google Patents

樹脂封止型電子装置

Info

Publication number
JPS59161055A
JPS59161055A JP59028517A JP2851784A JPS59161055A JP S59161055 A JPS59161055 A JP S59161055A JP 59028517 A JP59028517 A JP 59028517A JP 2851784 A JP2851784 A JP 2851784A JP S59161055 A JPS59161055 A JP S59161055A
Authority
JP
Japan
Prior art keywords
stem
transistor
heat sink
semiconductor element
vicinity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59028517A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6149818B2 (enExample
Inventor
Shinaya Okamura
岡村　思無邪
Susumu Fujii
進 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59028517A priority Critical patent/JPS59161055A/ja
Publication of JPS59161055A publication Critical patent/JPS59161055A/ja
Publication of JPS6149818B2 publication Critical patent/JPS6149818B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59028517A 1984-02-20 1984-02-20 樹脂封止型電子装置 Granted JPS59161055A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59028517A JPS59161055A (ja) 1984-02-20 1984-02-20 樹脂封止型電子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59028517A JPS59161055A (ja) 1984-02-20 1984-02-20 樹脂封止型電子装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP12611576A Division JPS5925384B2 (ja) 1976-10-22 1976-10-22 電子装置

Publications (2)

Publication Number Publication Date
JPS59161055A true JPS59161055A (ja) 1984-09-11
JPS6149818B2 JPS6149818B2 (enExample) 1986-10-31

Family

ID=12250874

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59028517A Granted JPS59161055A (ja) 1984-02-20 1984-02-20 樹脂封止型電子装置

Country Status (1)

Country Link
JP (1) JPS59161055A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4887149A (en) * 1986-07-17 1989-12-12 Sgs Microelectronica S.P.A. Semiconductor device mounted in a highly flexible, segmented package, provided with heat sink

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5352070A (en) * 1976-10-22 1978-05-12 Hitachi Ltd Semiconductor unit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5352070A (en) * 1976-10-22 1978-05-12 Hitachi Ltd Semiconductor unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4887149A (en) * 1986-07-17 1989-12-12 Sgs Microelectronica S.P.A. Semiconductor device mounted in a highly flexible, segmented package, provided with heat sink

Also Published As

Publication number Publication date
JPS6149818B2 (enExample) 1986-10-31

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