JPS59155995A - 多層配線基板の導体接続法 - Google Patents
多層配線基板の導体接続法Info
- Publication number
- JPS59155995A JPS59155995A JP3167883A JP3167883A JPS59155995A JP S59155995 A JPS59155995 A JP S59155995A JP 3167883 A JP3167883 A JP 3167883A JP 3167883 A JP3167883 A JP 3167883A JP S59155995 A JPS59155995 A JP S59155995A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- paste
- baking
- multilayer
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 title claims description 28
- 238000000034 method Methods 0.000 title claims description 13
- 229910052721 tungsten Inorganic materials 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 12
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 10
- 229910052750 molybdenum Inorganic materials 0.000 claims description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 5
- 239000011247 coating layer Substances 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 18
- 238000007639 printing Methods 0.000 description 8
- 238000001465 metallisation Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 230000005856 abnormality Effects 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3167883A JPS59155995A (ja) | 1983-02-25 | 1983-02-25 | 多層配線基板の導体接続法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3167883A JPS59155995A (ja) | 1983-02-25 | 1983-02-25 | 多層配線基板の導体接続法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59155995A true JPS59155995A (ja) | 1984-09-05 |
| JPH0148672B2 JPH0148672B2 (enrdf_load_stackoverflow) | 1989-10-20 |
Family
ID=12337764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3167883A Granted JPS59155995A (ja) | 1983-02-25 | 1983-02-25 | 多層配線基板の導体接続法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59155995A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63153893A (ja) * | 1986-12-18 | 1988-06-27 | 伊勢電子工業株式会社 | 多層プリント配線板 |
-
1983
- 1983-02-25 JP JP3167883A patent/JPS59155995A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63153893A (ja) * | 1986-12-18 | 1988-06-27 | 伊勢電子工業株式会社 | 多層プリント配線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0148672B2 (enrdf_load_stackoverflow) | 1989-10-20 |
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