JPH0466688B2 - - Google Patents

Info

Publication number
JPH0466688B2
JPH0466688B2 JP59156161A JP15616184A JPH0466688B2 JP H0466688 B2 JPH0466688 B2 JP H0466688B2 JP 59156161 A JP59156161 A JP 59156161A JP 15616184 A JP15616184 A JP 15616184A JP H0466688 B2 JPH0466688 B2 JP H0466688B2
Authority
JP
Japan
Prior art keywords
layer
firing
substrate
ceramic
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59156161A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6132752A (ja
Inventor
Seishiro Yamakawa
Noboru Yamaguchi
Satoru Ogawa
Susumu Kajita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP15616184A priority Critical patent/JPS6132752A/ja
Publication of JPS6132752A publication Critical patent/JPS6132752A/ja
Publication of JPH0466688B2 publication Critical patent/JPH0466688B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP15616184A 1984-07-25 1984-07-25 セラミツクス回路板の製法 Granted JPS6132752A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15616184A JPS6132752A (ja) 1984-07-25 1984-07-25 セラミツクス回路板の製法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15616184A JPS6132752A (ja) 1984-07-25 1984-07-25 セラミツクス回路板の製法

Publications (2)

Publication Number Publication Date
JPS6132752A JPS6132752A (ja) 1986-02-15
JPH0466688B2 true JPH0466688B2 (enrdf_load_stackoverflow) 1992-10-26

Family

ID=15621679

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15616184A Granted JPS6132752A (ja) 1984-07-25 1984-07-25 セラミツクス回路板の製法

Country Status (1)

Country Link
JP (1) JPS6132752A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0273227A3 (en) * 1986-12-22 1989-01-25 Kalman F. Zsamboky A method of improving bond strength between a metal layer and a non-metallic substrate
JPS63254031A (ja) * 1987-04-10 1988-10-20 昭和電工株式会社 回路基板の製造方法
JPH0292872A (ja) * 1988-09-28 1990-04-03 Kyocera Corp セラミック体と銅材の接合方法
JP3495052B2 (ja) * 1992-07-15 2004-02-09 株式会社東芝 メタライズ体およびその製造方法
DE102020111700B4 (de) 2020-04-29 2024-12-05 Rogers Germany Gmbh Trägersubstrat und Verfahren zur Herstellung eines Trägersubstrats

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5195777A (ja) * 1975-02-06 1976-08-21 Handotaiyoki
JPS5645318A (en) * 1979-09-11 1981-04-25 Hitachi Metals Ltd Combined milling tool and preparation thereof
JPS593077A (ja) * 1982-06-29 1984-01-09 株式会社東芝 セラミツク部材と金属との接合方法

Also Published As

Publication number Publication date
JPS6132752A (ja) 1986-02-15

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