JPS59151424A - 塗布装置 - Google Patents

塗布装置

Info

Publication number
JPS59151424A
JPS59151424A JP58024591A JP2459183A JPS59151424A JP S59151424 A JPS59151424 A JP S59151424A JP 58024591 A JP58024591 A JP 58024591A JP 2459183 A JP2459183 A JP 2459183A JP S59151424 A JPS59151424 A JP S59151424A
Authority
JP
Japan
Prior art keywords
resist
temperature
substrate
revolution
motor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58024591A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0437575B2 (enExample
Inventor
Hideyuki Hirose
廣瀬　秀幸
Masatoshi Komatani
駒谷　正俊
Haruo Sasaki
晴夫 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58024591A priority Critical patent/JPS59151424A/ja
Publication of JPS59151424A publication Critical patent/JPS59151424A/ja
Publication of JPH0437575B2 publication Critical patent/JPH0437575B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP58024591A 1983-02-18 1983-02-18 塗布装置 Granted JPS59151424A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58024591A JPS59151424A (ja) 1983-02-18 1983-02-18 塗布装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58024591A JPS59151424A (ja) 1983-02-18 1983-02-18 塗布装置

Publications (2)

Publication Number Publication Date
JPS59151424A true JPS59151424A (ja) 1984-08-29
JPH0437575B2 JPH0437575B2 (enExample) 1992-06-19

Family

ID=12142395

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58024591A Granted JPS59151424A (ja) 1983-02-18 1983-02-18 塗布装置

Country Status (1)

Country Link
JP (1) JPS59151424A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0205148A3 (en) * 1985-06-12 1988-12-28 Hitachi, Ltd. Method of applying a resist
JPH01226002A (ja) * 1988-03-07 1989-09-08 Tokyo Electron Ltd 半導体製造装置及び処理方法
EP0810633A3 (en) * 1996-05-28 1998-09-02 Tokyo Electron Limited Coating film forming method and apparatus
WO1998053919A1 (de) * 1997-05-28 1998-12-03 Singulus Technologies Ag Verfahren und vorrichtung zur schichtdicken- insbesondere bondschichtdickenregelung
US6025012A (en) * 1995-09-20 2000-02-15 Matsushita Electric Industrial Co., Ltd. Method and apparatus for determining film thickness control conditions and discharging liquid to a rotating substrate
US6507482B2 (en) 2000-11-13 2003-01-14 Nec Tokin Toyama, Ltd. Chip type solid electrolytic capacitor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0205148A3 (en) * 1985-06-12 1988-12-28 Hitachi, Ltd. Method of applying a resist
JPH01226002A (ja) * 1988-03-07 1989-09-08 Tokyo Electron Ltd 半導体製造装置及び処理方法
US6025012A (en) * 1995-09-20 2000-02-15 Matsushita Electric Industrial Co., Ltd. Method and apparatus for determining film thickness control conditions and discharging liquid to a rotating substrate
EP0810633A3 (en) * 1996-05-28 1998-09-02 Tokyo Electron Limited Coating film forming method and apparatus
WO1998053919A1 (de) * 1997-05-28 1998-12-03 Singulus Technologies Ag Verfahren und vorrichtung zur schichtdicken- insbesondere bondschichtdickenregelung
US6507482B2 (en) 2000-11-13 2003-01-14 Nec Tokin Toyama, Ltd. Chip type solid electrolytic capacitor

Also Published As

Publication number Publication date
JPH0437575B2 (enExample) 1992-06-19

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