JPS59147485A - Method of forming electric circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a method of forming an electric circuit in a resin molded product.

<Prior Art> Conventionally, when making an electrical wiring board, a base is required to support the electrical circuit film. A good example is the laminate, which is currently widely used. On the other hand, there are four approaches that require the base of the electrical circuit membrane to be in the cabinet of the device itself. If an electric circuit is attached to the surface of a resin molded product, which is currently often used as a cabinet, space can be used more effectively, the device can be made more compact, and the range of applications is wide. Examples of methods for forming an electric circuit on the surface of this resin molding include screen printing of conductive paste and intaglio transfer printing. However, due to the lack of progress in the development of inexpensive, low-resistance conductive pastes and the many restrictions on the shape of resin molded products, there are few examples of practical use and lack of versatility.

<Object of the Invention> The present invention has been made with the aim of solving the above-mentioned problems. The present invention provides a method for forming an electric circuit, characterized in that an electric circuit is formed on the resin molded article by embedding it in an object.

<Example> Examples will be described below.

FIG. 1 is a process flow diagram of an electric circuit forming method according to the present invention.

A conductive metal foil 2 is placed on top of the resin molded article (here, a resin plate is used for convenience) 1. The constituent materials of the resin board are:
BS resin, styrene resin, etc. can be used.

The metal foil 2 is pressed out using a stamp pad 3 provided with a convex portion 3I having the same pattern as the electric circuit to be formed, and is simultaneously embedded into the resin molded product (resin plate) 1. At this time, if heat 4 is applied at the same time as pressure, embedding can be easily performed.

When the embedding is completed, the stamp pad 3 is removed, and the portions of the metal foil 2 that do not touch the stamp pad protrusion 31 are removed.

This can be easily done by peeling off the unnecessary metal foil with your fingers or the like.

As a result, an electric circuit was formed inside the resin plate 1.

In order to prevent the metal foil 2 from falling off and being oxidized, the surface of the resin plate is covered with a protective film 6 coated with an adhesive 5, as shown in FIG. At that time, if a hole is made in a part of the protective film 6 (like 0 copy and 0 copy shown in the figure), it is possible to take out the letter from the outside.

Furthermore, when copper foil is used as the metal foil, it can be soldered, so it is possible to mount capacitors, chip resistors, etc., and provide a module function.

In addition, is there any other method for preventing oxidation of metal foil? JJi-
Au plating, resist ink/carbon ink printing,
There are methods such as solder dipping, which can be used as appropriate.

Effects> As explained in detail above, the method for forming an electric circuit of the present invention involves punching out a predetermined portion of the metal foil placed on the surface of the resin molding and embedding it in the resin molding. According to the present invention, there are few restrictions on the shape of the resin molded product (slopes, uneven surfaces, and spheres are also possible), and various metal foils can be used. Therefore, it is possible to provide an extremely effective electric circuit formation method that can solve the conventional problems.

[Brief explanation of the drawing]

FIG. 1 is a process flow diagram, and FIG. 2 is a sectional view. Explanation of the numbers: 1. Resin plate, 2. Metal foil, 3. Stamp base, 31. Convex portion, 4. Heat, 5. Adhesive, 6. Protective film. Agent Patent Attorney Aihiko Fuku (and 2 others) No. 1 (4 Figure 2)

Claims (1)

[Claims] 1. A method for forming an electric circuit, which comprises forming an electric circuit in the resin molding by punching out a predetermined portion of metal foil placed on the surface of the resin molding and embedding it in the resin mold.