JPS59143346A - 半導体基板材料の製造方法 - Google Patents
半導体基板材料の製造方法Info
- Publication number
- JPS59143346A JPS59143346A JP58017140A JP1714083A JPS59143346A JP S59143346 A JPS59143346 A JP S59143346A JP 58017140 A JP58017140 A JP 58017140A JP 1714083 A JP1714083 A JP 1714083A JP S59143346 A JPS59143346 A JP S59143346A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- semiconductor substrate
- organic binder
- solvent
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims description 28
- 239000000758 substrate Substances 0.000 title claims description 22
- 239000004065 semiconductor Substances 0.000 title claims description 19
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000000843 powder Substances 0.000 claims description 34
- 239000011230 binding agent Substances 0.000 claims description 22
- 239000012298 atmosphere Substances 0.000 claims description 17
- 230000001590 oxidative effect Effects 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 239000002904 solvent Substances 0.000 claims description 13
- 229910001182 Mo alloy Inorganic materials 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000004898 kneading Methods 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 description 13
- 238000005245 sintering Methods 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 238000004663 powder metallurgy Methods 0.000 description 5
- 229910052721 tungsten Inorganic materials 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 238000009776 industrial production Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- DSSYKIVIOFKYAU-XCBNKYQSSA-N (R)-camphor Chemical compound C1C[C@@]2(C)C(=O)C[C@@H]1C2(C)C DSSYKIVIOFKYAU-XCBNKYQSSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 241000723346 Cinnamomum camphora Species 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229960000846 camphor Drugs 0.000 description 1
- 229930008380 camphor Natural products 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229940057995 liquid paraffin Drugs 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Powder Metallurgy (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58017140A JPS59143346A (ja) | 1983-02-03 | 1983-02-03 | 半導体基板材料の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58017140A JPS59143346A (ja) | 1983-02-03 | 1983-02-03 | 半導体基板材料の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59143346A true JPS59143346A (ja) | 1984-08-16 |
| JPH0336304B2 JPH0336304B2 (enrdf_load_stackoverflow) | 1991-05-31 |
Family
ID=11935699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58017140A Granted JPS59143346A (ja) | 1983-02-03 | 1983-02-03 | 半導体基板材料の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59143346A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0449642A (ja) * | 1990-06-18 | 1992-02-19 | Nippon Tungsten Co Ltd | 半導体装置用基板材料及びその製造方法 |
| JPH04124205A (ja) * | 1990-09-12 | 1992-04-24 | Nippon Tungsten Co Ltd | 高精度ウェイト部品とその製造方法 |
-
1983
- 1983-02-03 JP JP58017140A patent/JPS59143346A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0449642A (ja) * | 1990-06-18 | 1992-02-19 | Nippon Tungsten Co Ltd | 半導体装置用基板材料及びその製造方法 |
| JPH04124205A (ja) * | 1990-09-12 | 1992-04-24 | Nippon Tungsten Co Ltd | 高精度ウェイト部品とその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0336304B2 (enrdf_load_stackoverflow) | 1991-05-31 |
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