JPS59136491A - 非シアン化物浴による銅めっき方法 - Google Patents

非シアン化物浴による銅めっき方法

Info

Publication number
JPS59136491A
JPS59136491A JP59000182A JP18284A JPS59136491A JP S59136491 A JPS59136491 A JP S59136491A JP 59000182 A JP59000182 A JP 59000182A JP 18284 A JP18284 A JP 18284A JP S59136491 A JPS59136491 A JP S59136491A
Authority
JP
Japan
Prior art keywords
copper
anode
plating
plating solution
cathode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59000182A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6254397B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
リリ−・シ−・トマスゼウスキ−
サデアス・ダブリユ・トマスゼウスキ−
ロバ−ト・エイ・トレメル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OMI International Corp
Original Assignee
OMI International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OMI International Corp filed Critical OMI International Corp
Publication of JPS59136491A publication Critical patent/JPS59136491A/ja
Publication of JPS6254397B2 publication Critical patent/JPS6254397B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP59000182A 1983-01-03 1984-01-04 非シアン化物浴による銅めっき方法 Granted JPS59136491A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US06/455,353 US4469569A (en) 1983-01-03 1983-01-03 Cyanide-free copper plating process
US551135 1983-11-16
US455353 1995-05-31

Publications (2)

Publication Number Publication Date
JPS59136491A true JPS59136491A (ja) 1984-08-06
JPS6254397B2 JPS6254397B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-11-14

Family

ID=23808453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59000182A Granted JPS59136491A (ja) 1983-01-03 1984-01-04 非シアン化物浴による銅めっき方法

Country Status (2)

Country Link
US (1) US4469569A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS59136491A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010168626A (ja) * 2009-01-23 2010-08-05 Okuno Chem Ind Co Ltd 亜鉛含有金属又はマグネシウム含有金属からなる物品用ストライク銅めっき液

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4521282A (en) * 1984-07-11 1985-06-04 Omi International Corporation Cyanide-free copper electrolyte and process
US4935065A (en) * 1986-08-22 1990-06-19 Ecolab Inc. Phosphate-free alkaline detergent for cleaning-in-place of food processing equipment
US4933051A (en) * 1989-07-24 1990-06-12 Omi International Corporation Cyanide-free copper plating process
CA2053342A1 (en) * 1990-10-22 1992-04-23 Robert A. Tremmel Nickel electroplating process with reduced nickel ion build up
US5174886A (en) * 1991-02-22 1992-12-29 Mcgean-Rohco, Inc. High-throw acid copper plating using inert electrolyte
US5100517A (en) * 1991-04-08 1992-03-31 The Goodyear Tire & Rubber Company Process for applying a copper layer to steel wire
US5266212A (en) * 1992-10-13 1993-11-30 Enthone-Omi, Inc. Purification of cyanide-free copper plating baths
US6054037A (en) * 1998-11-11 2000-04-25 Enthone-Omi, Inc. Halogen additives for alkaline copper use for plating zinc die castings
US6866765B2 (en) * 2000-07-07 2005-03-15 Hitachi Metals, Ltd. Electrolytic copper-plated R-T-B magnet and plating method thereof
GB0106131D0 (en) * 2001-03-13 2001-05-02 Macdermid Plc Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys
US6664633B1 (en) 2001-09-10 2003-12-16 Lsi Logic Corporation Alkaline copper plating
US6974767B1 (en) * 2002-02-21 2005-12-13 Advanced Micro Devices, Inc. Chemical solution for electroplating a copper-zinc alloy thin film
US20060096868A1 (en) * 2004-11-10 2006-05-11 Siona Bunce Nickel electroplating bath designed to replace monovalent copper strike solutions
US20060231409A1 (en) * 2005-03-31 2006-10-19 Tdk Corporation Plating solution, conductive material, and surface treatment method of conductive material
CN101302635B (zh) * 2008-01-18 2010-12-08 梁国柱 钢铁件酸性预镀铜电镀添加剂及预镀工艺
US20100084278A1 (en) * 2008-10-02 2010-04-08 Rowan Anthony J Novel Cyanide-Free Electroplating Process for Zinc and Zinc Alloy Die-Cast Components
CN103422078B (zh) * 2012-05-22 2016-04-27 比亚迪股份有限公司 一种化学镀铜液及其制备方法
CN102677116B (zh) * 2012-06-12 2013-05-08 山东建筑大学 一种在铁基体上双脉冲预镀无氰碱铜的方法
KR101823285B1 (ko) * 2014-01-13 2018-01-29 쑹화 쑨 무-시안 구리 예비도금 전기도금액 및 이의 제조방법
US10731258B2 (en) 2014-10-27 2020-08-04 Surface Technology, Inc. Plating bath solutions
US10006126B2 (en) 2014-10-27 2018-06-26 Surface Technology, Inc. Plating bath solutions
CN104789999B (zh) * 2015-04-24 2016-05-11 深圳市崇辉表面技术开发有限公司 一种铁件直接电镀酸铜溶液
CN105455321B (zh) * 2015-12-16 2019-01-22 毛琴飞 一种锌合金拉链链齿

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2709847A (en) * 1951-05-04 1955-06-07 Bendix Aviat Corp Cadmium plated aluminum and the method of making the same
DE1496916B1 (de) * 1964-09-22 1969-10-23 Monsanto Co Cyanidfreies,galvanisches Bad und Verfahren zum Abscheiden galvanischer UEberzuege
BE791401A (fr) * 1971-11-15 1973-05-14 Monsanto Co Compositions et procedes electrochimiques
US3833486A (en) * 1973-03-26 1974-09-03 Lea Ronal Inc Cyanide-free electroplating
US3914162A (en) * 1973-06-25 1975-10-21 Monsanto Co Compositions and process for the electrodeposition of metals
US3928147A (en) * 1973-10-09 1975-12-23 Monsanto Co Method for electroplating
DE3012168A1 (de) * 1980-03-27 1981-10-01 Schering Ag Berlin Und Bergkamen, 1000 Berlin Verfahren zur galvanischen abscheidung von kupferniederschlaegen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010168626A (ja) * 2009-01-23 2010-08-05 Okuno Chem Ind Co Ltd 亜鉛含有金属又はマグネシウム含有金属からなる物品用ストライク銅めっき液

Also Published As

Publication number Publication date
US4469569A (en) 1984-09-04
JPS6254397B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-11-14

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Legal Events

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EXPY Cancellation because of completion of term