JPS59132632A - 半導体素子の組込み方法 - Google Patents

半導体素子の組込み方法

Info

Publication number
JPS59132632A
JPS59132632A JP58006917A JP691783A JPS59132632A JP S59132632 A JPS59132632 A JP S59132632A JP 58006917 A JP58006917 A JP 58006917A JP 691783 A JP691783 A JP 691783A JP S59132632 A JPS59132632 A JP S59132632A
Authority
JP
Japan
Prior art keywords
connecting conductor
contact
conductor
circumference
pairs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58006917A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0141257B2 (enExample
Inventor
Tachio Kawasaki
川崎　太刀雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Fuji Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd, Fuji Electric Manufacturing Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP58006917A priority Critical patent/JPS59132632A/ja
Publication of JPS59132632A publication Critical patent/JPS59132632A/ja
Publication of JPH0141257B2 publication Critical patent/JPH0141257B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Landscapes

  • Die Bonding (AREA)
JP58006917A 1983-01-19 1983-01-19 半導体素子の組込み方法 Granted JPS59132632A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58006917A JPS59132632A (ja) 1983-01-19 1983-01-19 半導体素子の組込み方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58006917A JPS59132632A (ja) 1983-01-19 1983-01-19 半導体素子の組込み方法

Publications (2)

Publication Number Publication Date
JPS59132632A true JPS59132632A (ja) 1984-07-30
JPH0141257B2 JPH0141257B2 (enExample) 1989-09-04

Family

ID=11651581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58006917A Granted JPS59132632A (ja) 1983-01-19 1983-01-19 半導体素子の組込み方法

Country Status (1)

Country Link
JP (1) JPS59132632A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007227696A (ja) * 2006-02-24 2007-09-06 Nichicon Corp 金属化フィルムコンデンサ
JP2008053280A (ja) * 2006-08-22 2008-03-06 Hitachi Aic Inc アルミ電解コンデンサ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007227696A (ja) * 2006-02-24 2007-09-06 Nichicon Corp 金属化フィルムコンデンサ
JP2008053280A (ja) * 2006-08-22 2008-03-06 Hitachi Aic Inc アルミ電解コンデンサ

Also Published As

Publication number Publication date
JPH0141257B2 (enExample) 1989-09-04

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