JPS59132632A - Assembling method of semiconductor element - Google Patents
Assembling method of semiconductor elementInfo
- Publication number
- JPS59132632A JPS59132632A JP691783A JP691783A JPS59132632A JP S59132632 A JPS59132632 A JP S59132632A JP 691783 A JP691783 A JP 691783A JP 691783 A JP691783 A JP 691783A JP S59132632 A JPS59132632 A JP S59132632A
- Authority
- JP
- Japan
- Prior art keywords
- connecting conductor
- contact
- conductor
- semiconductor element
- stopper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は平型半導体素子を用いた半導体装置装置への
半導体素子の組込み方法に関する。この種の装置におい
ては運転中にある程度の確率で半導体素子の故障を考え
る必要がある。したがって故障が起った場合にはできる
だけ速やかに、また確実かつ容易に不良素子を良品に交
換できることが要求される。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of incorporating a semiconductor element into a semiconductor device using a flat semiconductor element. In this type of device, it is necessary to consider failure of semiconductor elements with a certain probability during operation. Therefore, when a failure occurs, it is required to be able to replace the defective element with a good one as quickly, reliably and easily as possible.
第１図は半導体変換器の要部の構造を示す一例で、イは
平面図口は正面図である。図において平型半導体素子１
は一方の電極が一方の接続導体２に当接し、他方の電極
が液冷の冷却体３を介して他方の接続導体４に当接する
ように配列されている。また一方の接続導体２にはその
表面に垂直に２個の絶縁スタッド５および６が取り付け
られ、絶縁スタッドの先端には絶縁スタッド５，６と嵌
合し絶縁ワッシャ７を介してボルト８によって固定され
た圧力保持板９が取り付けられる。また出力保持板９の
中央部には先端にセンターピン１１を有する押しねじ１
０が取り付けられ、前記冷却体３および接続導体４とに
それぞれ設けられた溝とセンターピン１１とを嵌合する
ことにより、冷却体３の半導体素子と当接する端面が接
続導体２の表面と平行にかつ導体表面内の所定位置に保
持されるよう形成されている。また押しねじ１０に取り
付けられた皿ばね１２および押しねじ１０の頭部１３に
より、半導体素子１．冷却体３．接続導体４は接続導体
２の表面に所定の圧力で押し付けられており、それぞれ
の当接面における熱的おれ、ヒユーズ１４を介して別の
接続導体１５に接続されている。上述の部品１〜１５に
よりエレメント１６が構成される。半導体変換装置にお
いては接続導体２および１５を共通の接続導体として、
両接続導体上に多数のエレメントが互いに僅かな間隔を
おいて並列に取り付けられるとともに、焼討かの接続導
体が１個のキュビクルに収納され、集積度の高い装置と
することにより据着は面積の縮小が図られている。また
エレメント１６の取付は状態における上下関係は第１図
口のようになっており、また消耗品であるヒユーズの交
換を容易にするためにキュビクルの扉を開けたときヒユ
ーズが手前に位置するよう配置されるのが普通である。FIG. 1 is an example showing the structure of the main parts of a semiconductor converter, in which A is a plan view and A is a front view. In the figure, a flat semiconductor device 1
are arranged so that one electrode is in contact with one of the connecting conductors 2 and the other electrode is in contact with the other connecting conductor 4 via a liquid-cooled cooling body 3. Furthermore, two insulating studs 5 and 6 are attached perpendicularly to the surface of one of the connecting conductors 2, and the tips of the insulating studs are fitted with the insulating studs 5 and 6 and fixed with bolts 8 through insulating washers 7. The pressure holding plate 9 is then attached. Also, in the center of the output holding plate 9, there is a push screw 1 having a center pin 11 at the tip.
0 is attached, and by fitting the center pin 11 into the grooves provided in the cooling body 3 and the connecting conductor 4, the end surface of the cooling body 3 that comes into contact with the semiconductor element is parallel to the surface of the connecting conductor 2. and is formed to be held in place within the conductor surface. Further, the disk spring 12 attached to the push screw 10 and the head 13 of the push screw 10 cause the semiconductor element 1 Cooling body 3. The connecting conductor 4 is pressed against the surface of the connecting conductor 2 with a predetermined pressure, and is connected to another connecting conductor 15 via a thermal break and a fuse 14 on each contact surface. Element 16 is constituted by parts 1 to 15 described above. In the semiconductor conversion device, the connection conductors 2 and 15 are used as a common connection conductor,
A large number of elements are installed in parallel on both connecting conductors with a small distance from each other, and the connecting conductors are housed in one cubicle, resulting in a highly integrated device that saves installation space. efforts are being made to reduce the In addition, the vertical relationship of the element 16 is as shown in Figure 1, and in order to facilitate the replacement of the fuse, which is a consumable item, the fuse is positioned at the front when the cubicle door is opened. It is usually placed.
押しねじ１０を僅かにゆるめて接続導体４を上方に押し
廻して作業空間を広げ、このすき間から一方の手を差し
入れて交換素子を下側から保持しておいて、他方の手で
押しねじ１ｏを緩め、手の上に落下した素子を取り出し
て行なった。つぎに新しい素子を指先で持ち、接続導体
２と冷却体３との間のすき間に差し込む、ついで目測で
素子１の中心と冷却体３の中心とを合わせ、この状態を
保ちつつ押しねじ１０を締め付ける、そして素子１が落
下しないことを確認してから指を離し、接続導体４を元
の位置にもどしてヒユーズ１４を仮止めし、押しねじ１
０を規定のトルクで増し締めするという方法で行なわれ
ていた。才た接続導体２あるいは冷却体３の平型半導体
素子との当接面の所定位置に素子と係合する僅かな凹所
を設けるこ ５−
とにより、素子の位置合わせを容易にしかつ素子の落下
を防ぐ方法が試みられる場合もあった。Slightly loosen the push screw 10 and push the connecting conductor 4 upwards to widen the working space. Insert one hand through this gap to hold the replacement element from below, and use the other hand to tighten the push screw 1o. I loosened the handle and took out the element that had fallen onto my hand. Next, hold a new element with your fingertips and insert it into the gap between the connecting conductor 2 and the cooling element 3. Then, visually align the center of the element 1 with the center of the cooling element 3, and while maintaining this state, tighten the set screw 10. Tighten it, and after confirming that the element 1 does not fall, release your finger, return the connecting conductor 4 to its original position, temporarily tighten the fuse 14, and tighten the set screw 1.
This was done by retightening 0 to the specified torque. By providing a slight recess that engages with the element at a predetermined position on the contact surface of the flat connecting conductor 2 or the cooling body 3 with the flat semiconductor element, alignment of the element is facilitated and the element is easily aligned. In some cases, attempts were made to prevent falls.
このように従来は素子１を指先でつまんでエレメントの
狭い空間で取り出したり、差し込んだりするために作業
の能率も悪く、時として素子１を取り落とす危険もあっ
た。また目側で位置決めを行なうために取り付は位置が
不正確になりやすい欠点もあった。また接続導体２の表
面に凹所を設ける加工は接続導体が細長い板状であるた
めに精度の高い加工を行なうには費用がかさむ欠点があ
った。これらの従来の欠点を除去するために作業空間を
広く取るならば装置全体が大きくならざるを得なくなる
という欠点もあった。As described above, in the past, the element 1 had to be taken out or inserted in a narrow space of the element by being pinched with the fingertips, which resulted in poor work efficiency, and there was sometimes a risk of the element 1 being dropped. Furthermore, since the positioning is performed on the eye side, there is also the drawback that the mounting position tends to be inaccurate. Further, the process of forming recesses on the surface of the connecting conductor 2 has the disadvantage that it is expensive to perform highly accurate machining because the connecting conductor is in the form of an elongated plate. In order to eliminate these conventional drawbacks, if a larger working space were to be provided, the overall size of the apparatus would have to be increased.
本発明は前述の状況に鑑みてなされたもので、装置を大
きくせずに速やかにまた安全確実に素子の交換を行なえ
る方法を提供することを目的とする。The present invention has been made in view of the above-mentioned situation, and it is an object of the present invention to provide a method for quickly and safely replacing elements without increasing the size of the device.
この目的は本発明の構成によれば、半導体素子の組込み
方法は導体表面に垂直に固定された絶縁スタッドを有す
る一方の接続導体と前記絶縁スタ ６ −
ラドの先端部に固定された圧力保持板を介して前記一方
の接続導体面と平行にかつ調整自在な間隙を隔てて保持
された他方の接続導体との間の所定位置に平形半導体素
子を挿入し、前記間隙を縮小して素子を両溝体間に組込
む方法であって、前記平型半導体素子の外周面に３個所
以上で接する挾持体を用いて素子を挾持して両溝体間に
挿入し、挾持体と一方の接続導体とに対をなして設けら
れ嵌合もしくは当接することにより少なくとも一方向の
相対位置を規制する係合部を少なくとも２対係合させる
ことにより、前記素子の一方の電極面を一方の接続導体
の表面の所定位置に接触させ、他方の接続導体の表面を
素子の他方の電極面に接触させて押比し、しかる後挟持
体を素子より取り外すことにより達成される。According to the configuration of the present invention, this purpose is achieved by connecting one connecting conductor having an insulating stud fixed perpendicularly to the conductor surface and a pressure holding plate fixed to the tip of the insulating stud. A flat semiconductor element is inserted into a predetermined position between the one connecting conductor surface and the other connecting conductor held parallel to the other connecting conductor with an adjustable gap between them, and the gap is reduced to separate the two elements. In this method, the device is inserted between the two groove bodies by using a clamping body that contacts the outer circumferential surface of the flat semiconductor element at three or more places, and the clamping body and one connecting conductor are inserted between the two groove bodies. By engaging at least two pairs of engaging portions that are provided in pairs and restrict the relative position in at least one direction by fitting or abutting, one electrode surface of the element is connected to the surface of one connecting conductor. This is achieved by bringing the surface of the other connecting conductor into contact with the other electrode surface of the element and pressing it down, and then removing the clamping body from the element.
以下本発明の実施例を添付図面を参照しつつ説明する。Embodiments of the present invention will be described below with reference to the accompanying drawings.
第２図は本発明の実施例を示す構造図で、挟持体２１に
挾持された平型半導体素子１が接続導体２の表面内の所
定位置に位置決めされ、他方の接続導体４および接続導
体の一部を構成する冷却体３が、押しねじ１０および皿
ばね１２により所定の締付は圧力で接続導体２に押圧さ
れた状態を示している。FIG. 2 is a structural diagram showing an embodiment of the present invention, in which the flat semiconductor element 1 held between the clamping bodies 21 is positioned at a predetermined position within the surface of the connecting conductor 2, and the other connecting conductor 4 and the connecting conductor are The cooling body 3 forming a part of the figure is shown being pressed against the connecting conductor 2 by a set screw 10 and a disc spring 12 with a predetermined tightening pressure.
第２図において、挟持体２０はＡ点を支点として１対の
ハンドル２１の開閉に対応して１対の腕２２および２３
が開閉するプライヤであり、腕２２および２３の先端部
には素子１を構成するひだ付碍管の胴部を挾持するため
の係合部２２ａおよび２３ａが設けられている。腕２２
に設けられた係合部２２ａは碍管の外周のほぼ４分の１
周と、腕２３に設けられた係合部２３ａは３分の１から
２分の１周とそれぞれ接するように形成され素子を挾持
して運搬することができる。また挟持体２０に挾持され
た素子１を接続導体２の表面内の所定位置に位置決めす
るために、挾持体２０の一方の腕２２には絶縁スタッド
５と対をなす嵌合部２４と、接続導体２の一方のかど部
あるいは側面２６に所定の長さにわたり当接するストッ
パ２５とが設けられている、したがって素子の位置決め
は素子１を挾持した挾持体２０を素子の一方の電極面が
接続導体２の表面と接触するように接続導体の側方より
近づけ、嵌合部２４を絶縁スタッド５と嵌合させて、接
続導体２のＸ方向の位置決めを行ない、ついでストッパ
２５を接続導体２の縁端部２６に平行に当接させてＹ方
向の位置の規制を行ない、ストッパ２５と縁端部２６と
をストッパの長さ全域にわたって当接するよう調整する
ことにより挟持体の方向規制を行なうことにより達成さ
れる。In FIG. 2, the clamping body 20 has a pair of arms 22 and 23 corresponding to the opening and closing of the pair of handles 21, with the point A as the fulcrum.
are pliers that open and close, and the arms 22 and 23 are provided with engaging portions 22a and 23a at their distal ends for clamping the body of the pleated insulator tube that constitutes the element 1. arm 22
The engaging portion 22a provided in the insulator is approximately one quarter of the outer circumference of the insulator
The circumference and the engaging portion 23a provided on the arm 23 are formed so as to be in contact with one-third to one-half of the circumference, respectively, so that the element can be held and transported. In addition, in order to position the element 1 held by the holding body 20 at a predetermined position on the surface of the connecting conductor 2, one arm 22 of the holding body 20 has a fitting part 24 that pairs with the insulating stud 5, and a connecting part 24 that pairs with the insulating stud 5. A stopper 25 that abuts over a predetermined length is provided on one corner or side surface 26 of the conductor 2. Therefore, the positioning of the element is performed by placing the clamping body 20 holding the element 1 between the clamps 20 and 25 so that one electrode surface of the element is connected to the connecting conductor. 2 from the side of the connection conductor so as to make contact with the surface of the connection conductor 2, fit the fitting part 24 with the insulating stud 5, position the connection conductor 2 in the X direction, and then move the stopper 25 to the edge of the connection conductor 2. The position of the holding body in the Y direction is regulated by bringing it into contact with the end 26 in parallel, and the direction of the holding body is regulated by adjusting the stopper 25 and the edge 26 so that they come into contact with each other over the entire length of the stopper. achieved.
第３図は前述の実施例における素子組込み作業の状態図
で、素子を組み込む時はイ１１ロ、ノの順に、素子を取
り外す時はハ１口、イの順に作業が行われる。第１図に
おいてヒユーズ１４が接続導体１５から取り外され、押
しねじ１０が緩められて、接続導体２と接続導体を兼ね
た冷却体３との間には素子を挿入するすき間が保たれた
状態になっている。そこで素子の組込み作業はまず、第
３図イのように素子ｌを挾持体２０で挾持して接続導体
２と冷却体３とのすき間に挿入し、絶縁スタッド５と嵌
合部２４とを嵌合し、ストッパ２５と接続導体２の縁端
部２６とを平行に当接する、こ ９−
のようにして素子１は所定位置に位置決めされるので、
この状態を保持しつつ片手で押しねじ１０の頭部１３を
所定のトルクで締めつける。このようにして素子は接続
導体２と４との間に固定される。つぎに第３図口のよう
に挾持体２０の一方の腕２３を開き、第３図ハのように
挟持体２０を引き抜くことにより素子の組込みが完了す
る。なおストッパ２５は接続導体の縁端となるべく広い
範囲で当接させた方が正確な位置決めができる、したが
って図に示すように腕２２に固着したストッパ２５を腕
２３の下面に沿って点線で示すように延長した方がよい
。FIG. 3 is a state diagram of the element assembling work in the above-mentioned embodiment, in which the work is performed in the order of A11B and C when installing the element, and the work is performed in the order of C1 and A when removing the element. In FIG. 1, the fuse 14 is removed from the connecting conductor 15, the push screw 10 is loosened, and a gap for inserting the element is maintained between the connecting conductor 2 and the cooling body 3 which also serves as the connecting conductor. It has become. Therefore, to assemble the element, first, as shown in FIG. The stopper 25 and the edge 26 of the connecting conductor 2 are brought into contact with each other in parallel. In this way, the element 1 is positioned at a predetermined position.
While maintaining this state, use one hand to tighten the head 13 of the push screw 10 to a predetermined torque. In this way the element is fixed between the connecting conductors 2 and 4. Next, one arm 23 of the clamping body 20 is opened as shown in FIG. 3, and the mounting of the element is completed by pulling out the clamping body 20 as shown in FIG. 3C. It should be noted that more accurate positioning can be achieved if the stopper 25 is brought into contact with the edge of the connecting conductor over as wide a range as possible.Therefore, as shown in the figure, the stopper 25 fixed to the arm 22 is shown by a dotted line along the lower surface of the arm 23. It is better to extend it like this.
第４図は本発明の他の実施例を示す正面図である。図に
おいて挾持体３０は、大きな腕３１と小さな腕３２とで
構成され、大きな腕の先端部には素子１の外周のほぼ４
分の１周と接する凹所３３と、絶縁スタッド５と対をな
す嵌合部３４と、絶縁スタッド６と対をなす嵌合部３５
とが設けられている。また小さな腕３２の先端は腕３１
と同一平面内において素子１の外周き接する挟持部３６
１０−
が設けられ、引張りコイルばね３７により挾持部３６が
常に素子１に圧着されるよう形成され、素子１を挟持体
３０に取り付けあるいは取り外す際にのみレバー３８を
操作すればよく、素子の運搬。FIG. 4 is a front view showing another embodiment of the present invention. In the figure, the clamping body 30 is composed of a large arm 31 and a small arm 32, and the tip of the large arm has approximately 40 mm of the outer circumference of the element 1.
A recess 33 in contact with one-quarter circumference, a fitting portion 34 that pairs with the insulating stud 5, and a fitting portion 35 that pairs with the insulating stud 6
is provided. Also, the tip of the small arm 32 is the arm 31
A clamping portion 36 that contacts the outer periphery of the element 1 in the same plane as
10- is provided, and the clamping part 36 is always pressed against the element 1 by the tension coil spring 37, and it is only necessary to operate the lever 38 when attaching or removing the element 1 from the clamping body 30. .
挿入などの操作は腕３１を折って行うことができる。し
たがって素子の位置決めは絶縁スタッドと嵌合すること
により容易に行うことができる。Operations such as insertion can be performed by folding the arm 31. Therefore, the element can be easily positioned by fitting with the insulating stud.
本発明によれば平形半導体素子の組込み、取出し方法を
前述のように構成したことによりつぎの効果が得られた
。すなわち従来ヒユーズを取り外すことによって作り出
した狭い作業スペースに手を差し込んで素子を指先で受
は止めるという不安定な作業を行っていたのを挾持体を
用いることにより排除したので、誤まって素子を取り落
す心配が無くなった。また素子の位置決めを一方の接続
導体に固定された絶縁スタッドまたは接続導体の縁端部
を衝にして行なうこととし、挾持体に前記絶縁スタッド
または導体の縁端部と対をなす係合部を設け、少なくと
も２対の係合部を嵌合または当接することにより容易に
素子を所定位置に挿入１１−
できるようにした。これらにより素子の組込み作業およ
び取出し作業を従来より速やかにまた安全かつ確実に実
施することができ、平型半導体素子を用いた変換装置を
素子の交換作業のために大型化するなどのテメリットを
防止できた。According to the present invention, the following effects were obtained by configuring the method for assembling and extracting a flat semiconductor element as described above. In other words, the use of the clamp eliminates the unstable task of inserting your hand into the narrow work space created by removing the fuse and holding the element with your fingertips, making it impossible to accidentally remove the element. No more worries about dropping it. In addition, the element is positioned by using an insulating stud fixed to one of the connecting conductors or the edge of the connecting conductor as a counter, and the clamping body is provided with an engaging portion that pairs with the insulating stud or the edge of the conductor. By fitting or abutting at least two pairs of engaging portions, the element can be easily inserted into a predetermined position. As a result, element assembly and removal operations can be carried out more quickly, safely and reliably than before, and disadvantages such as increasing the size of a conversion device using flat semiconductor elements due to element replacement work can be avoided. did it.
第１図（′；を平型半導体素子を用いた変換装置のエレ
メントの構造図、第２図は本発明の実施例を示す構造図
、第３図は実施例における半導体素子の組込み作業の状
態図、第４図は本発明の他の実施例を示す構造図である
。
図において１・・・平型半導体素子、２，４．１５・・
・接続導体、３・・・冷却体（接続導体兼用）、５，６
・・・絶縁スタッド、９・・・圧力保持板、１０・・・
押しねじ、１１・・・センターピン、１２・・・皿ばね
、１４・・・ヒユーズ、２０．３０・・・挾持体、２２
． ２３．３１゜３２・・・腕、２４，３４，３５・・
・嵌合部、２５・・・ストッパ、２２ａ、 ２３ａ、
３３． ３６・・・挾持部、３７・・・（イン
（ｒＪン
−ｆ ２ 図
Ｉ
ｔ′３ 図
３
７４ 圓
＝１５５−Fig. 1 (') is a structural diagram of an element of a conversion device using a flat semiconductor element, Fig. 2 is a structural diagram showing an embodiment of the present invention, and Fig. 3 is a state of the work of assembling the semiconductor element in the embodiment. 4 are structural diagrams showing other embodiments of the present invention. In the figures, 1... flat semiconductor element, 2, 4, 15...
・Connection conductor, 3...Cooling body (also serves as connection conductor), 5, 6
...Insulating stud, 9...Pressure holding plate, 10...
Push screw, 11... Center pin, 12... Belleville spring, 14... Fuse, 20.30... Clamping body, 22
．． 23.31°32...arm, 24,34,35...
- Fitting portion, 25...stopper, 22a, 23a,
33. 36... Holding part, 37... (in(rJn-f 2 Figure I t'3 Figure 3 74 Circle = 155-
Claims (1)
一方の接続導体と前記絶縁スタッドの先端部に固定され
た圧力保持板を介して前記一方の接続導体面と平行にか
つ調整自在な間隙を隔てて保持された他方の接続導体と
の間の所定位置に平形半導体素子を挿入し、前記間隙を
縮小して素子を両統導体間に組込む方法であって、前記
平形半導体素子の外周面に３個所以上で接する挟持体を
用いて素子を挾持し両接続導体間に挿入し、挾持体と一
方の接続導体とに対をなして設けられ嵌合才たは当接す
ることにより少なくとも一方向の相対位置を規制する保
合部を２対係合させることにより、前記素子の一方の電
極面を一方の接続導体の表面の所定位置に接触させ、他
方の接続導体の表面を素子の他方の電極面に接触させて
押圧し、し２、特許請求の範囲第１項記載の方法におい
て、挾持体が前記平型半導体素子の外周のほぼ４分の１
周および３分の１周を包囲して前記素子を挾持する１対
の腕を有するプライヤとして形成されるとともに、前記
素子の４分の１周を包囲する一方の腕に前記絶縁スタッ
ドの外周面と倍合する保合部と前記一方の接続導体の側
面き当接する保合部とを備え、前記２対の係合部を嵌合
もしくは当接した時挟持体に挾持された平型半導体素子
が前記一方の接続導体の表面の所定位置に位置決めされ
ることを特徴とする事砲半導体素子の組込み方法ｄ３）
特許請求の範囲第１項または第２項のいずれかに記載の
方法において、罰記挾持体が一方の腕に前記絶縁スタッ
ド２個の外周面とそれぞれ嵌合する２個の保合部を備え
、前記２対の係合部を嵌ことを特徴とする電相半導体素
子の組込み方法。。1) Create an adjustable gap parallel to the one connecting conductor surface through one connecting conductor having an insulating stud fixed perpendicularly to the conductor surface and a pressure holding plate fixed to the tip of the insulating stud. A method of inserting a flat semiconductor element into a predetermined position between the other connecting conductor held apart, reducing the gap, and assembling the element between both conductors, the method comprising: The element is held between the two connecting conductors by holding the element using a holding body that touches at more than one point, and the holding body and one of the connecting conductors are provided as a pair and are mated or in contact with each other to form a relative relationship in at least one direction. By engaging two pairs of retaining parts that regulate the position, one electrode surface of the element is brought into contact with a predetermined position on the surface of one connecting conductor, and the surface of the other connecting conductor is brought into contact with the other electrode surface of the element. 2. In the method according to claim 1, the clamping body is approximately one quarter of the outer circumference of the flat semiconductor element.
The pliers are formed as a pair of arms that surround the circumference and one-third of the circumference and hold the element, and one arm that surrounds one-quarter of the circumference of the element has an outer circumferential surface of the insulating stud. and a retaining part that abuts against the side surface of the one connecting conductor, the flat semiconductor element being held between the clamping bodies when the two pairs of engaging parts are fitted or in contact with each other. is positioned at a predetermined position on the surface of the one connecting conductor d3)
In the method according to claim 1 or 2, the penetrating clamp holder includes two retaining portions on one arm that respectively fit with the outer circumferential surfaces of the two insulating studs. . A method for assembling an electrophase semiconductor device, characterized in that the two pairs of engaging portions are fitted. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP691783A JPS59132632A (en) | 1983-01-19 | 1983-01-19 | Assembling method of semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP691783A JPS59132632A (en) | 1983-01-19 | 1983-01-19 | Assembling method of semiconductor element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59132632A true JPS59132632A (en) | 1984-07-30 |
| JPH0141257B2 JPH0141257B2 (en) | 1989-09-04 |
Family
ID=11651581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP691783A Granted JPS59132632A (en) | 1983-01-19 | 1983-01-19 | Assembling method of semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59132632A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007227696A (en) * | 2006-02-24 | 2007-09-06 | Nichicon Corp | Metallized film capacitor |
| JP2008053280A (en) * | 2006-08-22 | 2008-03-06 | Hitachi Aic Inc | Aluminum electrolytic capacitor |
-
1983
- 1983-01-19 JP JP691783A patent/JPS59132632A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007227696A (en) * | 2006-02-24 | 2007-09-06 | Nichicon Corp | Metallized film capacitor |
| JP2008053280A (en) * | 2006-08-22 | 2008-03-06 | Hitachi Aic Inc | Aluminum electrolytic capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0141257B2 (en) | 1989-09-04 |
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