JPS59125841U - 半導体素子保護用樹脂の流れ止め - Google Patents
半導体素子保護用樹脂の流れ止めInfo
- Publication number
- JPS59125841U JPS59125841U JP1983019487U JP1948783U JPS59125841U JP S59125841 U JPS59125841 U JP S59125841U JP 1983019487 U JP1983019487 U JP 1983019487U JP 1948783 U JP1948783 U JP 1948783U JP S59125841 U JPS59125841 U JP S59125841U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- flow
- semiconductor elements
- stopping
- protecting semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図は従来の流れ止めを使用した半導体素子の保護構
造図、第２図は本考案の一実施例の断面構造を示す図で
ある。 １・・・・・・半導体素子、２・・・・・・配線基板、
３・・・・・・半導体素子保護用樹脂、４・・・・・・
流れ止め、５・・・・・・熱硬化性樹脂。
造図、第２図は本考案の一実施例の断面構造を示す図で
ある。 １・・・・・・半導体素子、２・・・・・・配線基板、
３・・・・・・半導体素子保護用樹脂、４・・・・・・
流れ止め、５・・・・・・熱硬化性樹脂。
Claims (1)
- 配線基板上に実装された半導体素子の周囲に、その半導
体素子を保護するための樹脂が流出することを防ぐ流れ
止めを設け、その流れ止めの下端部には熱硬化性樹脂を
付着させ、その流れ止めの下端部は上記配線基板上に接
着できるようにしたことを特徴とする半導体素子保護用
樹脂の流れ止め。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983019487U JPS59125841U (ja) | 1983-02-15 | 1983-02-15 | 半導体素子保護用樹脂の流れ止め |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983019487U JPS59125841U (ja) | 1983-02-15 | 1983-02-15 | 半導体素子保護用樹脂の流れ止め |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59125841U true JPS59125841U (ja) | 1984-08-24 |
Family
ID=30150631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983019487U Pending JPS59125841U (ja) | 1983-02-15 | 1983-02-15 | 半導体素子保護用樹脂の流れ止め |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59125841U (ja) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5347770A (en) * | 1976-10-13 | 1978-04-28 | Seiko Instr & Electronics Ltd | Production of semiconductor device |
| JPS53114068A (en) * | 1977-03-15 | 1978-10-05 | Tokyo Shibaura Electric Co | Method of producing electronic part |
| JPS5637638A (en) * | 1979-09-05 | 1981-04-11 | Yamagata Nippon Denki Kk | Manufacturing of semiconductor device |
-
1983
- 1983-02-15 JP JP1983019487U patent/JPS59125841U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5347770A (en) * | 1976-10-13 | 1978-04-28 | Seiko Instr & Electronics Ltd | Production of semiconductor device |
| JPS53114068A (en) * | 1977-03-15 | 1978-10-05 | Tokyo Shibaura Electric Co | Method of producing electronic part |
| JPS5637638A (en) * | 1979-09-05 | 1981-04-11 | Yamagata Nippon Denki Kk | Manufacturing of semiconductor device |
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