JPS53114068A - Method of producing electronic part - Google Patents

Method of producing electronic part

Info

Publication number
JPS53114068A
JPS53114068A JP2761177A JP2761177A JPS53114068A JP S53114068 A JPS53114068 A JP S53114068A JP 2761177 A JP2761177 A JP 2761177A JP 2761177 A JP2761177 A JP 2761177A JP S53114068 A JPS53114068 A JP S53114068A
Authority
JP
Japan
Prior art keywords
electronic part
producing electronic
producing
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2761177A
Other languages
Japanese (ja)
Inventor
Tooru Nomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP2761177A priority Critical patent/JPS53114068A/en
Publication of JPS53114068A publication Critical patent/JPS53114068A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
JP2761177A 1977-03-15 1977-03-15 Method of producing electronic part Pending JPS53114068A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2761177A JPS53114068A (en) 1977-03-15 1977-03-15 Method of producing electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2761177A JPS53114068A (en) 1977-03-15 1977-03-15 Method of producing electronic part

Publications (1)

Publication Number Publication Date
JPS53114068A true JPS53114068A (en) 1978-10-05

Family

ID=12225717

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2761177A Pending JPS53114068A (en) 1977-03-15 1977-03-15 Method of producing electronic part

Country Status (1)

Country Link
JP (1) JPS53114068A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5848442A (en) * 1981-09-17 1983-03-22 Matsushita Electric Ind Co Ltd Sealing of electronic parts
JPS59125841U (en) * 1983-02-15 1984-08-24 松下電器産業株式会社 Stopping the flow of resin for protecting semiconductor elements

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5848442A (en) * 1981-09-17 1983-03-22 Matsushita Electric Ind Co Ltd Sealing of electronic parts
JPS59125841U (en) * 1983-02-15 1984-08-24 松下電器産業株式会社 Stopping the flow of resin for protecting semiconductor elements

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