JPS59124794A - 電子回路基板の製造方法 - Google Patents
電子回路基板の製造方法Info
- Publication number
- JPS59124794A JPS59124794A JP23413782A JP23413782A JPS59124794A JP S59124794 A JPS59124794 A JP S59124794A JP 23413782 A JP23413782 A JP 23413782A JP 23413782 A JP23413782 A JP 23413782A JP S59124794 A JPS59124794 A JP S59124794A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- copper plating
- plating film
- chip carrier
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title description 12
- 238000007747 plating Methods 0.000 claims description 53
- 239000004020 conductor Substances 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 23
- 239000011888 foil Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000007772 electroless plating Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 36
- 229910052802 copper Inorganic materials 0.000 description 36
- 239000010949 copper Substances 0.000 description 36
- 238000005530 etching Methods 0.000 description 11
- 238000004080 punching Methods 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 5
- 238000005553 drilling Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 206010011732 Cyst Diseases 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 208000031513 cyst Diseases 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23413782A JPS59124794A (ja) | 1982-12-29 | 1982-12-29 | 電子回路基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23413782A JPS59124794A (ja) | 1982-12-29 | 1982-12-29 | 電子回路基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59124794A true JPS59124794A (ja) | 1984-07-18 |
| JPS6350862B2 JPS6350862B2 (enrdf_load_html_response) | 1988-10-12 |
Family
ID=16966212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23413782A Granted JPS59124794A (ja) | 1982-12-29 | 1982-12-29 | 電子回路基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59124794A (enrdf_load_html_response) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6115393A (ja) * | 1984-06-30 | 1986-01-23 | イビデン株式会社 | プリント配線板の製造方法 |
| JPS6472592A (en) * | 1987-09-12 | 1989-03-17 | Ngk Insulators Ltd | Manufacture of ceramic leadless package |
| JP2013084975A (ja) * | 2012-12-12 | 2013-05-09 | Tatsuta Electric Wire & Cable Co Ltd | プリント配線板用シールドフィルム及びその製造方法 |
| CN113518515A (zh) * | 2021-03-15 | 2021-10-19 | 江西宇睿电子科技有限公司 | 断节金属化边制作方法和电路板 |
-
1982
- 1982-12-29 JP JP23413782A patent/JPS59124794A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6115393A (ja) * | 1984-06-30 | 1986-01-23 | イビデン株式会社 | プリント配線板の製造方法 |
| JPS6472592A (en) * | 1987-09-12 | 1989-03-17 | Ngk Insulators Ltd | Manufacture of ceramic leadless package |
| JP2013084975A (ja) * | 2012-12-12 | 2013-05-09 | Tatsuta Electric Wire & Cable Co Ltd | プリント配線板用シールドフィルム及びその製造方法 |
| CN113518515A (zh) * | 2021-03-15 | 2021-10-19 | 江西宇睿电子科技有限公司 | 断节金属化边制作方法和电路板 |
| CN113518515B (zh) * | 2021-03-15 | 2023-09-08 | 江西宇睿电子科技有限公司 | 断节金属化边制作方法和电路板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6350862B2 (enrdf_load_html_response) | 1988-10-12 |
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