JPS59123581A - Washing apparatus - Google Patents

Washing apparatus

Info

Publication number
JPS59123581A
JPS59123581A JP22803682A JP22803682A JPS59123581A JP S59123581 A JPS59123581 A JP S59123581A JP 22803682 A JP22803682 A JP 22803682A JP 22803682 A JP22803682 A JP 22803682A JP S59123581 A JPS59123581 A JP S59123581A
Authority
JP
Japan
Prior art keywords
cleaning
liquid
cleaned
cleaning chamber
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22803682A
Other languages
Japanese (ja)
Inventor
臼田 欣也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP22803682A priority Critical patent/JPS59123581A/en
Publication of JPS59123581A publication Critical patent/JPS59123581A/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は、例えば半導体若しくはガラス基板の表面に付
着した塵埃の除去、または、現象、エツチング後のリン
ス工程に用いる洗浄装置に関fるつ〔発明の技術的背景
〕 この種の従来の装置は第1図に示でように、蒸留水また
はリンス液等の洗浄液II、L2.L3ヶそれぞれ貯え
た洗浄$1,2.3Y並設し、半導体若しくはガラス基
板等の被洗浄物体(保持具?含む)10ケ、先ず洗浄槽
1の洗浄液に浸漬し、所定の時間ン経過した後にこれ?
引上げ、次いで。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a cleaning device used, for example, for removing dust attached to the surface of a semiconductor or glass substrate, or for a rinsing process after etching. TECHNICAL BACKGROUND OF THE INVENTION As shown in FIG. 1, this type of conventional apparatus uses cleaning liquids II, L2. 10 objects to be cleaned (including holders?) such as semiconductors or glass substrates were first immersed in the cleaning solution in cleaning tank 1, and then a predetermined period of time had elapsed. This later?
Pull up, then.

洗浄槽2および3においても同様な操作を繰返して表面
の異物ケ洗い流した後、洗浄槽3の近傍に設けられた乾
燥機4によって乾燥させる構成のものが多かった。
In many cleaning tanks 2 and 3, similar operations were repeated to wash away foreign matter on the surface, and then the dryer 4 installed near the cleaning tank 3 was used to dry the product.

この場合、被洗浄物体10から除去された異物の中、比
重の小さいものは、浮遊異物として洗浄液の表面部に残
り、この浮遊異物が被洗浄物体10の引上げ時に、その
表面に再度付着fる惧れがあるので、通常は洗浄液ンオ
ーバフローせ、しめて浮遊異物?取除くようにしている
In this case, among the foreign substances removed from the object 10 to be cleaned, those with low specific gravity remain on the surface of the cleaning liquid as floating foreign substances, and when the object 10 to be cleaned is pulled up, these floating foreign substances adhere to the surface again. Since there is a risk of floating foreign matter, I usually let the cleaning solution overflow and tighten it. I'm trying to remove it.

〔背景技術の問題点〕[Problems with background technology]

斯かる従来の洗浄装置にあっては、浮遊異物?除去fる
べく洗浄液をオーバ70−させてはいるものの、洗浄液
の表面部から浮遊異物?完全に除去するに長時間ン要し
、洗浄ン短時間で完了する場合には、被洗浄物体10の
引上げ時に浮遊異物が再び表面に付着′fるとともに、
この浮遊異物が次段の洗浄槽に持ち込まれろと言う欠点
があった。
In such conventional cleaning equipment, floating foreign matter? Although the cleaning solution was heated over 70°C to remove it, are foreign particles floating from the surface of the cleaning solution? If it takes a long time to completely remove the foreign matter and cleaning is completed in a short time, the floating foreign matter will re-adhere to the surface when the object 10 to be cleaned is pulled up.
There was a drawback that this floating foreign matter was carried into the next stage cleaning tank.

また−被洗浄物体が例えばガラスであるとき、洗浄液へ
の出し入れに際して静電気が発生し、この静電気によっ
て浮遊異物または空気中の塵埃が吸引され、十分な洗浄
効果が得られないことがあった。
In addition, when the object to be cleaned is glass, for example, static electricity is generated when the object is put in and taken out of the cleaning liquid, and this static electricity attracts floating foreign matter or dust in the air, making it impossible to obtain a sufficient cleaning effect.

〔発明の目的〕[Purpose of the invention]

本発明は上記事情?考慮してなされたもので、被洗浄物
体の洗浄液への出し入れ同数?著しく減少させるととも
に、被洗浄物体ケ引上げろ位置の浮遊異物を速やかに除
去し得、これによって洗浄効果ン格段に向上させ得る洗
浄装置の提供を目的とfる。
Is the present invention based on the above circumstances? Is this done with consideration given to the number of times the object to be cleaned is put in and out of the cleaning solution? It is an object of the present invention to provide a cleaning device that can significantly reduce floating foreign matter and quickly remove floating foreign matter at a position where an object to be cleaned is pulled up, thereby significantly improving the cleaning effect.

〔発明の概要〕[Summary of the invention]

この目的?達成fるために1本発明の洗浄装置は、オー
バフロー面が段階的に変化fる複数の洗浄室ケ有し、隣
接でろ該洗浄室の隔壁に被洗浄物体ン移動させ得る液移
動孔がオーバフロー面下に形成され、且つ、オーバフロ
ー面が最も低い前記洗浄室の、前記液移動孔に対向f石
側壁に液回収孔が形成された洗浄槽と、オーバフロー面
が最も高い前記洗浄至に洗浄液乞供給して、前記各洗浄
室ケオーバフローせしめる洗浄液供給手段と、前記被洗
浄物体を洗浄液に浸漬させた状態で、前記液移動孔を通
して、オーバフロー面の低い洗浄室から高い洗浄室に順
次移動させるとともに、前記各洗浄室内で前記破洗浄物
体?液の流下方向とは反対の方向に移動させ°る搬送装
置とを具備f石構成を採る。
This purpose? In order to achieve this, the cleaning device of the present invention has a plurality of cleaning chambers in which the overflow surface changes stepwise, and a liquid transfer hole through which an object to be cleaned can be moved is provided in the partition wall of the cleaning chamber adjacent to the overflow surface. A cleaning tank having a liquid recovery hole formed in the side wall of the stone facing the liquid transfer hole of the cleaning chamber formed below the surface and having the lowest overflow surface, and a cleaning tank having a liquid recovery hole formed in the side wall of the stone and a cleaning liquid collecting hole in the cleaning chamber having the highest overflow surface. a cleaning liquid supply means for supplying cleaning liquid to overflow each of the cleaning chambers, and moving the object to be cleaned, immersed in the cleaning liquid, sequentially from the cleaning chamber with a low overflow surface to the cleaning chamber with a high overflow surface through the liquid transfer hole; , the cleaning object in each cleaning chamber? A conveying device for moving the liquid in the direction opposite to the direction in which the liquid flows is adopted.

〔発明の実施例〕[Embodiments of the invention]

以下、添付図面?参照して本発明の一実施例について説
明fる。
Is the attached drawing below? An embodiment of the present invention will be described with reference to FIG.

第2図は本発明に係る洗浄装置の構成ケ、洗浄液の「盾
環系と併せて示した主要部の断面図である。
FIG. 2 is a cross-sectional view of the main parts of the cleaning device according to the present invention, showing the structure of the cleaning liquid together with the shield ring system.

同図において、洗浄槽加はオーバフロー面が段階的に高
くなる洗浄室21 、22 、 田w有し、この中、洗
浄室21および22間の隔壁四と、洗浄室22および田
の間の@壁四とにそれぞれ洗浄液ケ移動させるとともに
被洗浄物体10ン48動させ得る液移動子しす。
In the same figure, the cleaning tank has cleaning chambers 21, 22, and 2 whose overflow surfaces become higher in stages, and among these, there is a partition wall 4 between the cleaning chambers 21 and 22, and a partition wall 4 between the cleaning chambers 22 and 22. The liquid mover is capable of moving the cleaning liquid to each of the four walls and moving the object to be cleaned 10 times.

29 a カオーバフロー面下に形成されている。29a Formed below the cover flow surface.

また、オーバフロー面が最も低い洗浄室21の。In addition, the cleaning chamber 21 has the lowest overflow surface.

隔壁路に対向fろ側壁27の下部には洗浄液を回収ち液
回収孔27aが形成されている。
A liquid recovery hole 27a for recovering the cleaning liquid is formed in the lower part of the side wall 27 facing the partition wall passage.

なお、洗浄室21.η、23は[頑−列に配置されてお
り、各洗浄室の内底部には、被洗浄物体10Y載置して
洗浄室の配列方間に移動させるコンベヤッ。
Note that the cleaning chamber 21. .eta., 23 are arranged in a rigid row, and at the inner bottom of each cleaning chamber is a conveyor for placing objects 10Y to be cleaned and moving them in the arrangement direction of the cleaning chambers.

5.26が、それぞれオーバフロー面に対応して段階的
に高くなる位1′#に設けら゛れ、さらに、洗浄室乙お
よび田には液移動孔7!8bおよび29a?通って送給
される被洗浄物体10%’段差の、!;)るコンベヤに
移すための上昇機構35および36が設けられている。
5.26 are provided at 1'# in stages corresponding to the overflow surface, and liquid transfer holes 7, 8b and 29a are provided in the cleaning chambers B and B, respectively. The object to be cleaned is fed through a 10% step difference! ;) Lifting mechanisms 35 and 36 are provided for transfer to a conveyor.

また、オーバフロー面が最も高い洗浄室乙に隣接して乾
燥機30が配置されている。
Further, the dryer 30 is arranged adjacent to the cleaning chamber B where the overflow surface is the highest.

一方、洗浄槽加の外側部ま1こは下部には、各洗浄室の
オーバフロー液?回収でるとともに、洗浄室21の液回
収孔27aより流出f7)洗浄液?貯えろタンク31カ
設けられ、さらに、オーバフロー面の最も高い洗浄室2
3の上部には被洗浄物体10ンシヤワー洗浄でるだめの
シャワー給水器讃が設けられ、このタン′り31とシャ
ワー給水−1534とが管接続されるとともにその途中
にポンプ32およびフィルタ33が配設されている。
On the other hand, at the bottom of the outside of the cleaning tank, there is overflow liquid from each cleaning chamber. At the same time, the cleaning liquid flows out from the liquid recovery hole 27a of the cleaning chamber 21 f7) Cleaning liquid? There are 31 storage tanks, and 2 cleaning chambers with the highest overflow surface.
A shower water supply system for cleaning the object to be cleaned is provided at the top of the tank 31, and this tank 31 and the shower water supply 1534 are connected through a pipe, and a pump 32 and a filter 33 are disposed in the middle thereof. has been done.

上記の如く構成された本宅明の洗浄装置の作用?以下に
説明fろ。
How does Akira Hontaku's cleaning device configured as described above work? Please explain below.

先ず、ポンプ32と駆動f、bと、タンク31内に貯え
られた洗浄液がA矢印で示しに方向に送給されるととも
にフィルタ33ヲ介してシャワー給水器讃に供給され、
そのシャワー水が洗浄室路内に落下fろ。このようにし
て、洗浄室23内に落下した洗浄水は液移動孔29aお
よび28 a f通って洗浄室2】に流れ込むが、この
洗浄室21の側壁に形成した液回収孔27aの口径を適
切に定めろことによって洗浄液が洗浄室21,22.2
’(の順に貯えられる。
First, the pump 32, the drives f and b, and the cleaning liquid stored in the tank 31 are fed in the direction indicated by the arrow A, and are also supplied to the shower water supply system through the filter 33.
The shower water falls into the washing room channel. In this way, the cleaning water that has fallen into the cleaning chamber 23 passes through the liquid transfer holes 29a and 28 a f and flows into the cleaning chamber 2. The cleaning liquid is supplied to the cleaning chambers 21, 22.2.
'( are stored in the order of

この場合、液回収孔27a、液移勃孔四a、29a。In this case, liquid recovery hole 27a, liquid transfer hole 4a, 29a.

各洗浄室のオーバフロー面およびポンプ32の液送給源
は、互いに密接な関係を有でるものであるが、ここでは
各洗浄室に洗浄液が貯えられたとき、各洗浄室より略等
電の洗浄液が、洗浄槽加の側方にオーバフローでろよう
に講じられている。
The overflow surface of each cleaning chamber and the liquid supply source of the pump 32 are closely related to each other, but here, when cleaning liquid is stored in each cleaning chamber, approximately isoelectric cleaning liquid is discharged from each cleaning chamber. An overflow is provided on the side of the cleaning tank.

しかして、洗浄家路に落下てろ洗浄水の大部分はベルト
コンベア24,25.26に沿って流動してタンク、う
1に回収され、オーバフローした残りの洗浄液もま1こ
タンク31に回収され、これによって洗浄液の浄化循環
系が形成される。
Most of the washing water that falls on the washing route flows along the belt conveyors 24, 25, and 26 and is collected in the tank 1, and the remaining overflowing washing liquid is also collected in the tank 31. This forms a cleaning circulation system for the cleaning liquid.

次に、被洗浄物体10を、オーバフロー面が最も低い洗
浄室の最下流側にてベルトコンベヤ24上に載置’fa
と、この被洗浄物体1oはB矢印方向すなわち洗浄液の
流下方向とは反対の方向に移送されながら洗浄が行なわ
れ、次いで、液移動孔28 a f通って洗浄室22に
導かれ、この洗浄室内のベルトコンベヤ部に移し変えら
れる。このとき、詳細の構成は省略しであるものの、上
昇機構35はネル洗浄物体10?段差のあるベルトコン
ベヤに移し変える7ためのものである。
Next, the object to be cleaned 10 is placed on the belt conveyor 24 at the most downstream side of the cleaning chamber where the overflow surface is the lowest.
Then, the object to be cleaned 1o is cleaned while being transferred in the direction of arrow B, that is, in the direction opposite to the direction in which the cleaning liquid flows, and is then led to the cleaning chamber 22 through the liquid transfer holes 28a to 28f, and is introduced into the cleaning chamber 22. is transferred to the belt conveyor section. At this time, although the detailed configuration is omitted, the lifting mechanism 35 is connected to the flannel cleaning object 10? This is for transferring to a belt conveyor with steps.

以下、同様にして被洗浄物体1oはベルトコンベヤ5お
よび213KJ−って洗浄液の流下方向とは反対の方向
に移送されながら、洗浄室ηおよび詔にて洗浄が行なわ
れる。
Thereafter, the object to be cleaned 1o is similarly transported by the belt conveyor 5 and 213KJ- in the direction opposite to the direction in which the cleaning liquid flows, and is cleaned in the cleaning chamber η and the ejector.

ここで2ベルトコンベヤ24 、 Z5.26は洗浄効
果ン損なわないものである限り、特にベルトである必要
はなく、移動レール辱ン用いてもよい。
Here, the two-belt conveyors 24 and Z5, 26 do not need to be belts, and moving rails may be used as long as they do not impair the cleaning effect.

続いて2被洗浄物体1oが洗浄室23の上流側に到達し
たとき、この被洗浄物体1oは洗浄液から引き上げられ
、その真上に位置fろシャワー給水器34によってシャ
ワー洗浄され2次いで、乾燥機3oによって乾燥されろ
Subsequently, when the object 1o to be cleaned reaches the upstream side of the cleaning chamber 23, the object 1o to be cleaned is pulled up from the cleaning liquid, is shower-washed by a shower water supply device 34 located directly above it, and then placed in a dryer. Dry with 3o.

なお被洗浄物体10ケ洗浄室21のベルトコンベヤ別に
截置f石工程、他のベルトコンベヤに移し変えるべく上
昇機構、357作嘴させ石工程、洗浄家路にて洗浄液外
に引上げてシャワー洗浄を行う工程および乾燥機側への
搬入工程等は、洗浄の仕様によって定まるベルトコンベ
ヤの速度と関連・つけて適切に制御されろものである。
In addition, the 10 objects to be cleaned are placed separately on the belt conveyor of the cleaning chamber 21 in the stone process, the lifting mechanism is moved to another belt conveyor, the stone process is moved to the 357 beak, and the objects are lifted out of the cleaning solution on the way home for shower cleaning. The process and the process of carrying the product to the dryer side, etc., must be appropriately controlled in relation to the speed of the belt conveyor determined by the cleaning specifications.

かかる構成?採った場合、フィルタ33によって浄化さ
れ1こ最も清浄度の高い洗浄液が洗浄室Z”+ +c供
給されることから、被洗浄物体10&ま順次清浄度の高
い洗浄室にて洗浄が行なわれ、吐っ、各洗浄室では洗浄
液が流動し、その流下方向とは反対方向に被洗浄物体1
0ン移動させるので理想的な洗浄状四が得られろ。
That configuration? When the cleaning liquid is purified by the filter 33 and is supplied to the cleaning chamber Z''+ +c, the object to be cleaned 10& is sequentially cleaned in the cleaning chambers with the highest cleanliness. In each cleaning chamber, the cleaning liquid flows, and the object to be cleaned 1 flows in the opposite direction to the flowing direction.
Since it moves 0 degrees, an ideal cleaning condition can be obtained.

また、洗浄室毎に洗浄液がオーバフローfろように講じ
られているので、上流側の洗浄室の浮遊異物(は速やか
に洗浄室外[廃山され、これらの浮遊異物がそのまま下
流側の洗浄室に持ち込まれろという事態ケ未然に防ぎ得
、特に下流側の洗浄室における洗浄効果を高めろことが
できろ。
In addition, since measures are taken to prevent the cleaning solution from overflowing in each cleaning chamber, floating foreign matter in the upstream cleaning chamber is promptly discarded outside the cleaning chamber, and these floating foreign matter are directly transported to the downstream cleaning chamber. It is possible to prevent such situations from occurring, especially by increasing the effectiveness of cleaning in downstream cleaning rooms.

さらに、被庚浄物体10は最下流の洗浄室にて洗浄液に
浸漬され、最上流の洗浄室にて洗浄液から引上げられろ
ことから、常に洗浄液中に浸漬させ1こままでの洗浄が
行なわれ、被洗浄物体10の洗浄液への出し入れ回数ケ
最小に留め得るととも((、ガラス等の静電気ン帯び易
いものであっても、空気中の塵埃ン吸引でにとの対策が
極めて4易になる。
Furthermore, since the object 10 to be cleaned is immersed in the cleaning liquid in the most downstream cleaning chamber and pulled up from the cleaning liquid in the most upstream cleaning chamber, it is always immersed in the cleaning liquid and cleaned one by one. The number of times the object 10 to be cleaned can be taken in and out of the cleaning solution can be kept to a minimum (() Even if the object 10 to be cleaned is easily charged with static electricity, such as glass, it becomes extremely easy to take measures against dust in the air. .

また、被洗浄物体10の引上げは、清浄i奮の最も旨い
洗浄室中で、しかもその最上流側で行なわれbため、浮
遊異物が表面に付着てるとい5蓼態?解消fろことがで
きろ。
In addition, since the object 10 to be cleaned is lifted in the cleanest cleaning chamber and at the most upstream side thereof, floating foreign matter may adhere to the surface. Can you solve it?

なお、上記実施例では、各洗浄室より略匡チオの洗浄欣
ンオーパフローせしめろ場合について説明したが、例え
ば、浮遊異物が最も多いと予・萌されろ最下流力洗浄室
21におげ石オーバフロー計ケ最も多く−r6ように構
成すれば洗浄効果乞さら((漏めることができる。
In addition, in the above embodiment, the case where the cleaning chamber 21 is caused to overflow from each cleaning chamber is explained. For example, if the most amount of floating foreign matter is present, the stone overflows to the lowest power cleaning chamber 21. If the configuration is as follows: -r6, the cleaning effect will be poor ((it can leak).

まTこ2上記実施例では、回収された液ケ浄化しながら
循環させるものについて説明したが、洗浄液として例え
ば水道水?用いる場合にはポンプ32およびフィルタ3
3ン除去すればよい。
In the above embodiment, the recovered liquid was purified and circulated, but for example, tap water could be used as the cleaning liquid? If used, pump 32 and filter 3
All you have to do is remove 3.

さらにまた、上記実施例ではコンベヤ24,25゜26
を常時駆動f石場合について説明したが、これらのコン
ベヤ上に被洗浄物体?載置した状態で一定時間停止させ
るようにしてもよい。
Furthermore, in the above embodiment, the conveyors 24, 25° 26
We have explained the case of constantly driven stones, but what about the objects to be cleaned on these conveyors? It may be made to stop for a certain period of time in the mounted state.

〔発明の効果〕〔Effect of the invention〕

以上の説明によって明らかな如く、本発明の洗浄装置に
よれば、被洗浄物体の洗浄液への出し入れ回数ケ著しく
減少させ4るとともに、被再浄物体ケ引上げろ位置での
浮遊異物ケ速やかに除去し得、これによって洗浄効果ケ
格段に向上させることができ”10 また、洗浄液は各洗浄室内で常時流動し、被洗浄物体を
洗浄液の流下方向とは反対方向に移動させるので2被洗
浄物体の表面部において常に液交換がなされ、単なる浸
漬に比較してより大きな洗浄効果が得られろ。
As is clear from the above explanation, according to the cleaning device of the present invention, the number of times the object to be cleaned is taken in and out of the cleaning liquid is significantly reduced4, and floating foreign matter can be promptly removed at the position where the object to be recleaned is pulled up. In addition, since the cleaning liquid is constantly flowing in each cleaning chamber and the object to be cleaned is moved in the opposite direction to the direction in which the cleaning liquid flows, the cleaning effect can be greatly improved. The liquid is constantly exchanged on the surface, and a greater cleaning effect can be obtained than with simple immersion.

さらに、被洗浄物体?コンベヤ上に載iff シてこれ
ケ停止させた場合でも速度は小さいながら2液交換は常
時性なわれることから、長時間の浸漬洗浄に好適な状態
が得られろ。
Furthermore, the object to be cleaned? Even if it is placed on the conveyor and stopped, the two-liquid exchange is carried out constantly, albeit at a small speed, so that conditions suitable for long-term immersion cleaning can be obtained.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の洗浄装置の概略的な構成ン示す説明図、
第2図は本発明に係る洗浄装置の一実施例の構成ケ、洗
浄液の循環系ン併せて示した主要部の所面図である。 10・・・被洗浄物体、加・・・洗浄槽、 21 、2
2.2:(、・・・洗浄室、24,25.26・・・コ
ンベヤ、27a・・・液回収孔。 28 a 、 29a・・・液移動孔、30・・・乾燥
機、31・・・タンク。 32・・・ポ〉′プ、33・・・フィルタ、詞・・・シ
ャワー給水器。 35.36・・・上昇機構。
FIG. 1 is an explanatory diagram showing the schematic configuration of a conventional cleaning device;
FIG. 2 is a top view of the main parts of an embodiment of the cleaning device according to the present invention, showing the configuration and cleaning fluid circulation system. 10... Object to be cleaned, processing... cleaning tank, 21, 2
2.2: (...Cleaning chamber, 24, 25.26...Conveyor, 27a...Liquid collection hole. 28a, 29a...Liquid transfer hole, 30...Dryer, 31. ...tank. 32...pop, 33...filter, word...shower water supply device. 35.36...lifting mechanism.

Claims (1)

【特許請求の範囲】 1、ドパフロー面が段階的に変化fる複数の洗浄室ケ有
し、隣接する該洗浄室の隔壁に被洗浄物体を移動させ得
る液移動孔がオーバフロー面下に形成され、且つ、オー
バフロー1所が最も低い前記洗浄室の前記液移動孔に対
向てる側壁に液回収孔カー形成された洗浄側と、オーバ
フロー面が最も高い前記洗浄室に洗浄液ケ供給して、前
記各洗浄室ンオーバフローせしめる洗浄液供給手段と、
前記被洗浄物体を洗浄液に浸漬させた状態で、前記液移
動孔?通して、オーバフロー面の低い洗浄室から高い洗
浄室に順次移動させろとともに、前記各洗浄室で前記被
洗浄物体ケ液の流下方向とは反対の方向に移動させ6搬
送装置と?具備したこと1/特徴とする洗浄装置。 2、前記洗浄液供給手段はオーバフロー液および前記液
回収孔より回収した洗浄tLヲ貯えるタンクと2このタ
ンク内の洗浄液?オーバフロー面の最も高い前記洗浄室
に供給fろポンプと、こ・の洗浄液?浄化′f7)フィ
ルタと2具えろことン特徴と−r石特許請求の範囲第1
項記載の洗浄装置−
[Scope of Claims] 1. It has a plurality of cleaning chambers in which the dopa flow surface changes stepwise, and a liquid transfer hole is formed under the overflow surface to allow the object to be cleaned to move to the partition wall of the adjacent cleaning chamber. , and supplying the cleaning liquid to a cleaning side in which a liquid recovery hole is formed in a side wall opposite to the liquid transfer hole of the cleaning chamber where the overflow is lowest, and to the cleaning chamber where the overflow is the highest, a cleaning liquid supply means for overflowing the cleaning chamber;
While the object to be cleaned is immersed in the cleaning liquid, the liquid transfer hole ? The object to be cleaned is sequentially moved from the cleaning chamber with a low overflow surface to the cleaning chamber with a high overflow surface through the cleaning chamber, and in each of the cleaning chambers, the object to be cleaned is moved in a direction opposite to the direction in which the liquid flows. Features 1/Characteristic cleaning equipment. 2. The cleaning liquid supply means includes a tank for storing the overflow liquid and the cleaning tL recovered from the liquid recovery hole; 2. The cleaning liquid in this tank? The filtration pump that supplies the cleaning chamber with the highest overflow surface and this cleaning solution? Purification 'f7) Filter and two features and -r stone Claim 1
Cleaning equipment described in section -
JP22803682A 1982-12-28 1982-12-28 Washing apparatus Pending JPS59123581A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22803682A JPS59123581A (en) 1982-12-28 1982-12-28 Washing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22803682A JPS59123581A (en) 1982-12-28 1982-12-28 Washing apparatus

Publications (1)

Publication Number Publication Date
JPS59123581A true JPS59123581A (en) 1984-07-17

Family

ID=16870189

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22803682A Pending JPS59123581A (en) 1982-12-28 1982-12-28 Washing apparatus

Country Status (1)

Country Link
JP (1) JPS59123581A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61133633A (en) * 1984-12-03 1986-06-20 Mitsubishi Electric Corp Wet scrubber of semiconductor wafer
JPH0794460A (en) * 1993-09-20 1995-04-07 Shin Etsu Handotai Co Ltd Method for cleaning semiconductor wafer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61133633A (en) * 1984-12-03 1986-06-20 Mitsubishi Electric Corp Wet scrubber of semiconductor wafer
JPH0794460A (en) * 1993-09-20 1995-04-07 Shin Etsu Handotai Co Ltd Method for cleaning semiconductor wafer

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