JP3138901B2 - Substrate immersion processing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to immersion of a substrate used for surface-treating a thin substrate (hereinafter simply referred to as a substrate) such as a semiconductor wafer or a glass substrate for a liquid crystal in an immersion processing section of a substrate processing apparatus. It relates to a processing device.

[0002]

2. Description of the Related Art Conventionally, there is a substrate processing apparatus as shown in FIG. 19, for example, and a substrate immersion processing apparatus used in an immersion processing section 165 is shown in FIG.
(Hereinafter referred to as Conventional Example 1) or disclosed in Japanese Patent Application Laid-Open No. Hei 4-42531, and shown in FIG. 21 (hereinafter referred to as Conventional Example 2). FIG. 19 is a plan view of the entire substrate processing apparatus.

As shown in FIG. 19, the substrate processing apparatus 150 includes a loading unit 151 for a cassette C containing a substrate W.
And a substrate extracting section 160 for extracting the substrate W from the cassette C.
A substrate transfer robot 175 that collectively holds and transfers a plurality of substrates W; a chuck cleaning unit 163 that cleans a chuck hand of the substrate transfer robot 175;
A plurality of immersion processing units 165 that sequentially immerse the plurality of substrates W held at 75 and sequentially process the drying units 170 disposed on the rear side of the immersion processing unit 165, and store the processed substrates W in the cassette C. And a carry-out section 152 for carrying out the cassette C containing the substrates W.

[0004] In the immersion processing section 165, for example, an immersion processing apparatus as shown in FIGS.
It is configured to perform various surface treatments. FIG.
(A) is a substrate immersion treatment apparatus for performing surface treatment (hereinafter referred to as chemical treatment) on the substrate W with a plurality of types of treatment liquids, and FIG. 20 (B) is a rinsing treatment of the substrate W with pure water _DW. (Hereinafter referred to as pure water treatment). These immersion processing apparatuses are provided with the immersion processing section 165.
(165a to 165f).

The immersion processing apparatus shown in FIG. 20A includes an overflow type substrate processing tank 101a for immersing a substrate W in a processing liquid to perform a surface treatment, a processing liquid supply path 107 connected to the substrate processing tank 101a, and an immersion processing apparatus. The processing liquid supply container 107 is connected to the processing liquid supply path 107 via the processing liquid introduction valve 108, the filter 110, and the pressure pump 115, and the processing liquid overflowing from the substrate processing tank 101a is collected in the processing liquid storage container 106. Recovery path 142a and the processing liquid supply path 1
07 and a supply / discharge switching valve 113a that opens and closes the collection path 142a so that the processing liquid overflowing from the substrate processing tank 101a can be returned to the processing liquid storage container 6 during chemical liquid processing. I have.

Further, the immersion processing apparatus shown in FIG. 20 (B) includes an overflow type substrate cleaning tank 101b and a substrate cleaning tank 10b.
1b connected to a pure water supply path 103 and a pure water supply path 103
, A drain 142b for drawing pure water overflowing from the substrate cleaning tank 101b to a drain 143, a pure water supply 103 and a drain 142b.
And a supply / discharge switching valve 113b that opens and closes the drain and the drain. The drainage overflows from the substrate cleaning tank 101b during the pure water treatment and is discharged to the drain 143.

On the other hand, in Conventional Example 2, as shown in FIG. 21, a plurality of types of processing liquids 102 are sequentially supplied into a single substrate processing tank 101 to perform a surface treatment on the substrate W. That is, an overflow type substrate processing tank 1 in which a plurality of substrates W are immersed in the processing liquid 102 to perform surface treatment of the substrates W.
01 and a plurality of types of processing liquids 1 from the bottom of the substrate processing tank 101.
02 and the processing liquid supply path 1
03 and the processing liquid introduction valves 108 _{A to} 108 _C and the flow rate, respectively.
BR> adjuster 107 _A to 107 - 106 and _C plurality of the processing liquid storage container 106 _A which communicates via a _C, pure water introducing valve 108
_D and the pure water supply source 1 communicated via the flow controller 107 _D
Comprises a 06 _D, and is configured with the inlet valve 108 _A -108 _D selectively open and close controlled to a predetermined processing liquid Q _A to Q _C to supply to the substrate processing chamber 101.

[0008] Among the above-described processing liquid storage container 106 _A - 106 _C, for example, the processing liquid storage container 106 _A hydrogen peroxide Q _A,
The 106 _B in hydrochloric Q _B, 106 _C such etchants Q _C, such as hydrogen fluoride are reservoir. Then, the substrate processing bath 101 stores the processing liquid 10 for each of the plurality of types of surface processing.
2 is configured as an overflow-type processing tank capable of replacing, and the overflowed processing liquid is discharged to a drain (not shown).

[0009]

The above substrate processing apparatus 15
In No. 0, since the immersion processing apparatuses shown in FIGS. 20A and 20B are arranged in each of the immersion processing sections 165a to 165f, there is a problem that the entire apparatus becomes large. Conventional example 2
Is a substrate processing tank 10 for each chemical processing with a plurality of processing liquids.
Since the processing liquid overflowing from 1 is discarded to the drain, the consumption of the processing liquid increases, and the running cost of the entire substrate processing apparatus becomes expensive. The present invention has been made in view of such circumstances, and has as its technical object to prevent the substrate processing apparatus from increasing in size and to reduce running costs.

[0010]

In order to solve the above-mentioned problems, the present invention is configured as follows. According to the first aspect of the present invention, there is provided an overflow type substrate processing tank for immersing a substrate in a processing liquid to perform surface treatment of the substrate, a processing liquid supply path connected to the substrate processing tank, and a processing liquid in the processing liquid supply path. A treatment liquid storage container that is communicated through a liquid introduction valve and a pressure pump in order, a pure water supply path that communicates with the treatment liquid supply path via a pure water introduction valve, and a drain that overflows from the substrate processing tank. In a substrate immersion processing apparatus comprising a drain path leading to a liquid drain, the drain path is branched and one is connected to a drain through a drain valve, and the other is a processing liquid recovery. through the process liquid recovery valve as road communicating with the processing liquid storage container, the chemical treatment, treatment of the processing liquid storage container
Supply the processing liquid from the processing liquid supply path to the substrate processing tank
Flow from the drainage path to the
Collected in the treatment liquid storage container and performed after the above chemical treatment
In pure water treatment, pure water is supplied from the pure water supply path to the substrate processing tank.
Through the drainage path through the drainage valve.
And discarded into a drainage drain .

According to a second aspect of the present invention, in the immersion processing apparatus according to the first aspect, a filter is provided between the pressure feed pump of the processing liquid supply path and the processing liquid introduction valve, and the filter is provided downstream of the processing liquid introduction valve. Side, a pure water supply path is connected to the processing liquid supply path, a connection between the pressure feed pump of the processing liquid supply path and the connection portion of the pure water supply path is connected to the processing liquid recovery path, and the processing liquid pumped up by the pressure feed pump during the pure water treatment is treated with the processing liquid. This is to circulate through the recovery path and to return to the processing liquid storage container.

According to a third aspect of the present invention, in the immersion processing apparatus according to the second aspect, the upstream side of the pressure feed pump of the processing liquid supply path is connected to the processing liquid recovery path, and the processing liquid is recovered during the processing of the chemical liquid. The liquid is circulated from the path to the processing liquid supply path and is returned to the substrate processing tank.

[0013] The invention of claim 4 is the invention of claim 2 or claim 3.
In the immersion treatment apparatus described in (1), a heating means for heating the treatment liquid is provided in a part of the treatment liquid circulation path including the treatment liquid storage container, which is formed during the pure water treatment.

The invention according to claim 5 is the invention according to claims 1 to 4.
In the immersion processing apparatus according to any one of the above, a plurality of processing liquid storage containers are switchably connected to the processing liquid supply path via a processing liquid selection valve, and the processing liquid recovery path is connected to the processing liquid recovery path via a processing liquid return selection valve. A plurality of processing solution storage containers are connected in a switchable manner. In addition, the invention of claim 5 includes one in which a plurality of processing liquid storage containers are switchably connected to a plurality of substrate processing tanks.

[0015]

[Action] In the present invention of claim 1, together with one branches on Sharing, ABS fluid passage communicates with the drainage drained through the drain valve, and the other through the process liquid recovery valve as the processing liquid recovery path above In the chemical solution processing, the processing liquid overflowing from the substrate processing tank is recovered through the processing liquid recovery path and the processing liquid recovery valve, and is returned to the substrate processing tank again because the processing liquid is communicated with the processing liquid storage container. That is, the processing liquid is reused without being discarded.
In addition, in the pure water treatment performed after the chemical solution treatment, pure water is purified.
Water is supplied from the water supply channel to the substrate
And drained from the drainage path to a drainage drain via a drainage valve.
It is.

According to a second aspect of the present invention, in the immersion processing apparatus of the first aspect, a filter is provided between the pressure feed pump of the processing liquid supply path and the processing liquid introduction valve, and a filter is provided downstream of the processing liquid introduction valve. Since the pure water supply path was connected and the connection between the pumping pump of the processing liquid supply path and the pure water supply path connection part was connected to the processing liquid recovery path, while the chemical solution treatment and the pure water treatment were being performed, The processing liquid is refreshed by filtering. That is, when the chemical solution processing is performed, the processing liquid is refreshed by the filter of the processing liquid supply path (hereinafter, simply referred to as filtering). In addition, even when the pure water treatment is performed, the treatment liquid pumped up from the treatment liquid storage container by the pressure feed pump is filtered, flows down the treatment liquid recovery path, and is returned to the treatment liquid storage container again.

According to the third aspect of the present invention, in the immersion processing apparatus of the second aspect, the upstream side of the pressure feed pump of the processing liquid supply path is connected to the processing liquid recovery path, so that the following operation is performed. In the case where the chemical solution processing is performed, the processing liquid overflowing from the substrate processing tank flows down the processing liquid recovery path, flows into the processing liquid supply path without passing through the processing liquid storage vessel, is pumped by the pressure pump, and is again fed. Reflux to the substrate processing tank. In other words, when the chemical treatment is performed, the treatment liquid is sucked by the pressure feed pump and flows down the treatment liquid recovery path. The flow rate of the processing solution flowing down is significantly increased.

According to a fourth aspect of the present invention, in the immersion processing apparatus of the third aspect, a heating means for heating the processing liquid is provided in a part of the processing liquid circulation path including the processing liquid storage container formed during the pure water processing. Therefore, it operates as follows. In the standby state during which the pure water treatment is being performed, the treatment liquid pumped up from the treatment liquid storage container by the pressure pump and returned to the treatment liquid storage container again is heated by the heating means and maintained at a predetermined processing temperature. For example, when performing chemical treatment at high temperature, there is no need to wait for the temperature of the treatment liquid to rise,
It is possible to immediately shift from the pure water treatment to the chemical treatment.

According to a fifth aspect of the present invention, in the immersion processing apparatus according to any one of the first to fourth aspects, a plurality of processing liquid storage containers can be switched to a processing liquid supply path via a processing liquid selection valve. The plurality of processing liquid storage containers are connected to the processing liquid recovery path via a processing liquid return selection valve so as to be switchable. By selecting and connecting an arbitrary processing liquid storage container to at least one substrate processing tank via a processing liquid selection valve, a plurality of chemical solutions can be processed in a single substrate processing tank. In that case, the processing liquid overflowing from the substrate processing tank is collected in each processing liquid storage container for each selected processing liquid.

[0020]

Embodiments of the present invention will be described below with reference to the drawings. First, a substrate processing apparatus for cleaning a substrate to which the present invention is applied will be described. 16 is a schematic perspective view of the substrate processing apparatus, FIG. 17 is a schematic plan view of the apparatus, and FIG. 18 is a schematic longitudinal sectional view of the apparatus. In the substrate processing apparatus 50, a plurality of substrate processing tanks 1 are arranged side by side in an immersion processing section 65 to be described later to perform cleaning processing of a semiconductor wafer (hereinafter, simply referred to as a wafer), and a cleaning liquid (hereinafter, referred to as overflow) from the substrate processing tank 1. The processing liquid is simply collected in the processing liquid storage container 6 and made recyclable.

As shown in FIGS. 16 to 18, the substrate processing apparatus 50 includes a loading / unloading section 51 for the substrate storage cassette C.
The wafer W from the cassette C or the cassette C
A substrate transfer section 60 for loading a wafer W into the inside thereof, and a cassette C
Between the loading / unloading section 51 and the substrate transfer section 60 of the cassette C
Transfer robot 55 for transferring wafers, an immersion processing unit 65 for cleaning a plurality of wafers W collectively, a drip substrate drying unit 70 for wafers W, and a plurality of wafers taken out of the cassette C by the substrate transfer unit 60. And a substrate transfer robot 75 that collectively holds the wafers W and transports them to the immersion processing section 65 and the substrate drying section 70.

The cassette transfer robot 55 is shown in FIG.
As shown in FIGS. 18 to 18, the cassette C which is vertically movable and rotatable and is movable in the direction of the arrow A, and is loaded on the table 61 of the substrate transfer unit 60, is loaded on the loading / unloading unit 51. In addition, the cassette C containing the cleaned wafer W is transferred from the table 61 to the loading / unloading section 51. In addition, the substrate transfer robot 75 is configured as shown in FIG.
As shown in FIGS. 6 to 18, the plurality of wafers W provided so as to be movable in the direction of arrow B and received from the lifter 64 of the substrate transfer unit 60 are held by the substrate holding arm 76 of the substrate transfer robot 75 and moved. Immersion processing section 65 along section 77
And into the substrate drying unit 70.

As described below, the immersion processing section 65 is provided with various immersion processing apparatuses according to the present invention.
However, in FIG. 16 to FIG.
An example in which a plurality are arranged side by side is illustrated. That is, the immersion processing unit 65 is configured by arranging three overflow-type substrate processing tanks 1 in parallel, and is received from the substrate transfer robot 75 by a substrate holder 66 provided in each substrate processing tank 1 so as to be able to move up and down. A plurality of wafers W can be sequentially immersed in each substrate processing tank 1. The specific contents of the immersion processing apparatus according to the embodiment of the present invention will be described later.

As disclosed in, for example, Japanese Patent Application Laid-Open No. 1-255227 proposed by the present applicant, the substrate drying section 70 is configured to rotate around the center of the main plane of the wafer W as a rotation center.
It comprises a drying treatment tank 71 for draining and drying by rotary centrifugal force. The substrate drying unit 70 may be replaced with a drying system using an organic solvent or the like in place of the centrifugal system, or may be configured to promote drying by a heating system or a drying system using reduced pressure. .

The layout of the substrate processing apparatus 50 is as shown in FIGS. 16 to 18, from the front facing the clean room work area 30 to the rear facing the maintenance work area 31. , Substrate transfer section 6
0, the substrate drying unit 70 and the immersion processing unit 65 are sequentially arranged. As shown in FIGS. 16 and 18, a supply / discharge piping chamber 20 for the processing liquid is provided below the three substrate processing tanks 1 of the immersion processing section 65, and a lower part of the supply / discharge piping chamber 20 is provided below the supply / discharge piping chamber 20. The processing liquid storage containers 6 for cleaning are arranged in three upper and lower stages. Further, as shown in FIG. 16 and FIG.
A moving part 77 of the substrate transfer robot 75 is formed on the right side of the substrate drying part 70 and the immersion processing part 65 in the front-rear direction, and a space behind the substrate transfer part 60 is maintained in the left space. It is formed as a space 90. A plurality of pipes, valves and the like are laid on the floor of the maintenance space 90.

That is, in the substrate processing apparatus 50, the substrate processing tank 1, the supply / discharge piping chamber 20, and the processing liquid storage container 6 of the immersion processing section 65 are stacked in three vertical stages and laid out vertically. The maintenance space 90 can be secured in the area facing the left side of the stacking section. In other words, as shown in FIG. 17, various working blocks such as the immersion processing unit 65 and the substrate transfer unit 60 are grouped in an L-shape in plan view, so that a surplus space in the substrate processing apparatus 50 is maintained. Can be set as the source 90. In addition, by mainly stacking the immersion processing units 65 in the vertical direction, the entire substrate processing apparatus 50 can be compactly combined to efficiently save space in the entire clean room, and as the number of the substrate processing apparatuses 50 installed increases, The effective utilization rate of the space in the clean room can be further increased.

The substrate processing tank 1 of the immersion processing section 65
16 to 18 in the layout of the substrate drying unit 70.
As shown in the figure, from the back side facing the maintenance work area 31 to the front side facing the clean room work area 30, the three overflow type substrate processing tanks 1, the drying processing unit 70, and the substrate transfer unit 60 are arranged. Arrange in order. That is, since the substrate drying section 70 is disposed between the immersion processing section 65 and the substrate transfer section 60, the washed wafer W is dried as quickly as possible, returned to the cassette C, and returned from the loading / unloading section 51. It can be carried out efficiently. On the other hand, the substrate drying process is not strongly restricted by the time for returning to the cassette C, and a waiting time can be taken between the completion of the drying process and the return to the substrate transfer unit 60. Adjacent substrate transfer unit 60
However, the drying processing unit 70 can play a role of a buffer.

In addition, since an acid which has been heated is usually used in the acid cleaning treatment, vapor or mist of the acid is apt to be generated. For example, in the substrate processing tank 1 farthest from the clean room work area 30, the acid is removed. When the acid cleaning process is performed, adverse effects on the clean room work area 30 can be prevented, and the safety of the work can be ensured. Hereinafter, embodiments of the various immersion processing devices provided in the immersion processing section 65 will be sequentially described.

FIG. 1 is a schematic system diagram of an immersion apparatus according to Embodiment 1 of the present invention. As shown in FIG. 1, this immersion processing apparatus includes three substrate processing tanks 1.1.1 for cleaning a surface of a substrate W by collectively immersing a plurality of substrates W in a processing liquid.
A processing liquid supply path 7 for supplying a processing liquid from the lower part of each substrate processing tank 1, a processing liquid storage vessel 6 that is in communication with the processing liquid supply path 7 via a processing liquid introduction valve 8 and a pressure pump 15 in order,
The apparatus includes a pure water supply path 3 communicating with the processing liquid supply path 7 via a pure water introduction valve 27, and a drainage path 42 for leading wastewater overflowing from the substrate processing tank 1 to a drainage drain 43. . That is, in each of the substrate processing tanks 1, a predetermined processing liquid Q _A to
Chemical process described later by Q _C is performed separately.

As shown in FIG. 1, the substrate processing tank 1
It is made of quartz glass and is formed in a substantially V-shape in side view and in a substantially rectangular shape in plan view. The processing liquid supply path 7 is connected to the lower part thereof to form a uniform upward flow of the processing liquid in the substrate processing tank 1. The substrate W is configured as an overflow tank that can quickly replace the processing liquid for each of a plurality of types of cleaning processing while performing surface treatment on the substrate W. The substrate processing tank 1 is not limited to quartz glass. For example, when HF or the like that corrodes quartz glass is used as a cleaning liquid, the substrate processing tank 1 may be formed of a corrosion-resistant resin material such as ethylene tetrafluoride resin. good. Further, four or more overflow-type substrate processing tanks 1 may be provided in the immersion processing section 65 in parallel.

As shown in FIG. 1, the processing liquid supply path 7 is connected to the lower part of each substrate processing tank 1 in parallel, and the processing liquid supply valve 7 is connected to the processing liquid supply path 7. 8 and a processing liquid storage container 6 connected via a pressure pump 15;
The processing liquid supply path 7 is provided with a pure water supply path 3 and a pure water supply source (not shown) connected to the treatment liquid supply path 7 via a pure water introduction valve 27. The pure water supply path 3 is a main path of pure water for supplying pure water _DW at room temperature or heated to a predetermined temperature.
It is preferable to use pure water _{DW which} has been subjected to a deoxidation treatment in order to prevent oxidation of the surface of the substrate.

When the processing liquid introduction valve 8 is opened, the processing liquid in the processing liquid storage container 6 is pumped by the pump 15 to the substrate processing tank 1.
, And overflows from the substrate processing tank 1 to perform chemical processing. When the pure water introduction valve 27 is opened, pure water _DW is supplied from the pure water supply path 3 to the substrate processing tank 1 and overflows to perform pure water processing. That is,
Treatment solution selectively suppliable configured with switching operation of the inlet valve 8 and pure water introducing valve 27 processing liquid Q _A to Q _C and pure water D _W to the processing liquid supply path 7. Note that the processing liquid storage container 6, the process liquid Q _A to Q _C is configured to be automatically refilled.

The configuration for discharging the processing liquid Q _A to Q _C, as shown in FIG. 1, an overflow liquid recovery section 41 which is attached to the upper portion of each substrate treatment tank 1, to discharge the processing liquid overflowing It comprises a drain passage 42 and a communication passage 4 led out from the bottom of the substrate processing tank 1 to the drain passage 42 via the supply / discharge switching valve 13. The lower flow side of the drainage passage 42 is branched into two branches, one of which is connected to a drainage drain 43 via a drainage valve 47, and the other is connected to the processing liquid recovery passage 22.
The processing liquid storage container 6 via the processing liquid recovery valve 44
Connect to Note that the supply and discharge switching valve 13 is used to derive the respective processing solution Q _A to Q _C of the substrate processing bath 1 to the drains 42 if required.

In the first embodiment, as shown in FIG. 1, a processing liquid supply path 7 derived from each processing liquid storage container 6 is connected to a lower part of each substrate processing tank 1 through a processing liquid introduction valve 8. are, predetermined processing solution Q _a to Q _C are respectively supplied from the process liquid storing container 6 to each substrate treatment tank 1. Further, a pure water supply path 3 is connected to a lower portion of each substrate processing tank 1 via a pure water introduction valve 27, so that pure water _DW can be supplied to each substrate processing tank 1. Further, the downstream side of the drainage path 42 led out from the upper part of the substrate processing tank 1 is communicated through the drainage valve 47 with the side of the processing liquid storage container 6 communicated through the processing liquid recovery valve 44. It is branched in two directions with the drainage drain 43 side. Therefore, when the described processing solution Q _A in FIG. 1, the processing solution Q _A of the processing liquid storage container 6, after cleaning the wafer W by overflow from the processing liquid supply channel 7 in each of the substrate treatment tank 1, waste The liquid is collected from the liquid path 42 into the processing liquid storage container 6 via the processing liquid recovery valve 44, and is recycled to the substrate processing tank 1.

On the other hand, in the pure water treatment performed after the chemical solution treatment, the pure water _DW is supplied from the pure water supply path 3 to the substrate processing tank 1 and overflows, and from the drain path 42 through the drain valve 47. And is discarded in the drain 43. The processing liquid Q _B
And similarly recoverable configured from the substrate processing chamber 1 also Q _C. Accordingly, since each processing solution Q _A to Q _C overflowed from the substrate processing chamber 1 is recycled are collected in the processing liquid storage container 6 through the treatment liquid recovery valve 44, the treatment liquid for each of a plurality of types of chemical treatment As compared with the conventional example 2 in which the substrate is discarded, the consumption amount of the processing liquid can be effectively suppressed, and the running cost of the entire substrate processing apparatus can be reduced.

Further, in the immersion treatment device, as shown in FIG. 1, since the parallel processing of multiple types of processing solution Q _A to Q _C by the wafer W sequentially immersed into three substrate processing tank 1 which is arranged Throughput is improved. In addition, in this immersion processing apparatus, the processing liquid overflows from the upper portion of the substrate processing tank 1, so that when the chemical liquid processing is shifted to the pure water processing, the chemical liquid can be purified without discharging all the cleaning liquid in the substrate processing tank 1. It can be replaced with water, and the wafer W does not come into contact with air until the chemical solution treatment and the pure water treatment are completed. Therefore, there is no fear that an oxide film is formed on the wafer surface or impurities in the air adhere to the wafer. Further, the wafer W can be loaded and unloaded without discharging the entire cleaning liquid in the substrate processing tank 1.

Next, the contents of the chemical treatment in the first embodiment will be described with reference to an example. In a first substrate treating tank 1 performs SC ₁ treatment. Used as the processing solution Q _A was prepared ammonia (NH ₄ OH) and hydrogen peroxide and the (H ₂ O ₂₎ a mixture of pure water D _W. Processing solution Q _A conduct purification treatment after the chemical treatment with, for removing organic matter such as photoresist, deposited on the surface of the wafer W. Note that SC ₁
A CARO process may be performed instead of the process. The processing solution Q _A in this case using the SPM.

In the second substrate processing tank 1, SC ₂
Perform processing. Hydrochloric acid as a processing liquid Q _B was prepared (HC
1) A mixed solution of hydrogen peroxide (H ₂ O ₂ ) and pure water is used. Similarly conducted purification treatment after the chemical treatment with a processing solution Q _B, to remove metal ions attached to the surface of the wafer W. Further, in the third substrate processing tank 1, HF processing is performed. The processing solution Q _C using a 50% aqueous solution of hydrogen fluoride to etch unexposed portion of the surface of the wafer W. In some cases, phosphoric acid-hydrogen peroxide is used in place of the hydrogen fluoride.

The surface treatment including the cleaning treatment of the wafer is not uniform depending on the manufacturing process, and is not necessarily immersed in the first to third substrate processing tanks 1 sequentially. By the way,
For example, various surface treatments such as the following (1) to (4) are possible. (1) SC ₁ processing → HF processing → SC ₂ processing (2) HF processing → SC ₁ processing → SC ₂ processing (3) SC ₁ processing → SC ₂ processing (4) Others, HF processing only or SC ₁ processing only . The type of the above-mentioned chemical liquid treatment can be similarly applied to the embodiments described later, and a duplicate description will be omitted.

If the HF treatment is included in any of the chemical treatments, if the wafer W is brought into contact with air after the HF treatment, HF, O ₂ and Si react with each other, and the surface of the wafer W becomes impure. Compounds form and become particles.
For this reason, after supplying and circulating HF to the substrate processing tank 1,
The supply of HF is stopped, and then pure water is supplied in a state where HF is put in the substrate processing tank 1, and HF is replaced with pure water by overflowing. As a result, the wafer W always stays in the liquid, and the HF component is removed without generating particles by continuous supply of pure water.

In the above-mentioned chemical solution processing, when a processing liquid other than the HF liquid is collected, when the wafer W may come into contact with air, the cleaning liquid is drained from the bottom of the substrate processing tank 1 and pure water _DW is supplied . In the final rinsing process using the pure water, the specific resistance value of the pure water is detected, or the pure water process is completed after a certain period of time. When the wafer W is pulled up from the substrate processing tank 1 after the final rinsing is completed, it is performed while overflowing pure water in order to prevent floating particles from adhering to the wafer W.

The advantages of the first embodiment are as follows.
That it can prevent an increase in the size of the substrate processing apparatus by reducing the number of the substrate processing chamber 1 by performing the chemical treatment and pure water treatment using a single substrate processing chamber 1, the processing solution Q _A to Q _C treatment liquid storage but may be mentioned that the running cost can be reduced by reusing recovered in a container 6, these advantages are the same in examples 2 to 11 described later, the redundant description Omitted.

FIG. 2 is a schematic system diagram of an immersion processing apparatus according to Embodiment 2 of the present invention. In this immersion processing apparatus, as shown in FIG. 2, one of the three substrate processing tanks 1 provided in the immersion processing section 65 is set as a substrate processing tank dedicated to pure water processing. . That is, the pure water supply path 3 is led out from the lower part of the rinsing tank 1 and the pure water supply path 3 is connected to the pure water supply path 3.
And a pure water supply source (not shown) via
The drainage path 42 is led out from the upper part of the rinsing tank 1, and a drainage drain 43 is connected to the drainage path 42 via a drainage valve 47.
The pure water _DW is supplied to the rinsing tank 1, overflows to treat the wafer W with pure water, and is discharged from the drain passage 42 to the drain 43 through the drain valve 47. I have.

[0044] In Embodiment 2, after the chemical treatment with a processing solution Q _A or Q _B at most two pieces of each of the substrate cleaning tank 1 has been performed,
Subsequently, pure water treatment is performed lightly, and further, pure water treatment with pure water _DW is performed separately in the rinsing tank 1. For this reason, compared with the case where the chemical processing and the pure water processing are performed in each substrate processing tank 1 as in the first embodiment, the wafer W
And the time required for the pure water treatment is reduced, and the throughput is improved.

FIG. 3 is a schematic system diagram of an immersion processing apparatus according to Embodiment 3 of the present invention. In this immersion processing apparatus, a single substrate processing tank 1 is disposed in an immersion processing section 65 of a substrate cleaning apparatus 50, and is supplied to the substrate processing tank 1 similarly to the first or second embodiment. The processing liquid that overflows is collected in the processing liquid storage container 6 via the processing liquid recovery path 22 and the processing liquid recovery valve 44 so that it can be reused, and the pure water _DW that overflows from the substrate processing tank 1 is drained. Drain 4
3 to be discarded. In the third embodiment as well, the consumption of the processing liquid is suppressed and the substrate processing tank 1
By using a single tank, the entire substrate processing apparatus 50 can be made compact.

FIG. 4 is a schematic system diagram of an immersion processing apparatus according to Embodiment 4 of the present invention. In the fourth embodiment, a plurality of processing liquid storage containers 6 are connected in a switchable manner. This immersion treatment apparatus is different from the first embodiment in that the treatment liquid is circulated from the substrate treatment tank 1 to the treatment liquid storage container 6 and can be reused.
3 is different from that of the first embodiment in that three types of chemical processing are separately performed in three substrate processing tanks 1, whereas the fourth exemplary embodiment is configured to perform three kinds of chemical processing in one substrate processing tank 1. It is characterized in that the substrate processing tank 1 is used in common for a plurality of types of chemical processing by performing the chemical processing sequentially.

[0047] That is, as shown in FIG. 4 (A), 3 kinds of the processing liquid Q _A · Q _B · Q each treatment liquid introduction valve 8 _A · 8 _B · 8 _C from the treatment liquid reservoir 6 of _C The processing liquid supply path 7 is connected to the lower part of one substrate processing tank 1 via the same. Here, the processing liquid introduction valves 8 _A , 8 _B , 8 _C correspond to the processing liquid selection valve 82 in claim 5. Further, FIG. 4 (B) in the supply side of the processing liquid, introducing valve connection path treatment liquid introduction valve 8 _A · 8 _B · 8 _C and pure water introducing valve 27 is provided and disconnecting each processing solution was set 16 Indicates that
One end 16a of the connection path 16 is connected to the pure water supply path 3, and the other end 16b is connected to the processing liquid supply path 7.

The downstream side of the drainage passage 42 of the substrate processing tank 1 is branched into four, one of which is connected to the drainage drain 43, and the other is connected to the processing liquid recovery passage 22 (specifically, 22
a, 22b, 22c) as the three types of processing liquids Q _A
Connecting the processing liquid storage container 6 Q _B · Q _C. Various overflowing treatment liquids are collected in the treatment liquid storage container 6 and can be discarded in the drainage drain 43 if necessary. FIG. 4 (C) shows the processing liquid recovery valves 44 _A , 44 _B
The main part of the drainage path 42 in which 44 _C and the drainage valve 47 are gathered is shown. The drainage valve 47 for pure water is provided in the deepest part 42 a on the downstream side of the drainage path 42. Here, the processing liquid recovery valves 44 _A , 44 _B , 44 _C correspond to the processing liquid return selection valve 83 in claim 5.

On the other hand, each processing solution Q _A to the substrate processing tank 1
To Q _C pumping means 25, FIG. 4 (A), the respective processing liquid storage container 6 (specifically 6 _A to 6 _C) processing liquid supply passage 7 derived from (specifically 7 _{A to} 7 _C ), one pump 15 for driving the pump, a motor 19 for driving the pump 15,
A pressure detector 26 (specifically, a pressure gauge) provided on the discharge side of the pressure pump 15 and the control means 12 for controlling the rotation speed of the pressure pump 15 to increase or decrease based on a detection signal from the pressure detector 26. Be composed. In the pumping means 25, excess or deficiency with respect to the set pressure is detected by a pressure detector 26, and the control means 12 drives and controls the drive motor 19 of the pumping pump 15 so that the processing liquid is supplied to the substrate processing tank 1 at a predetermined set pressure. Is pumped.

[0050] When cleaning the wafer W is first treated solution Q _A through the processing liquid inlet valve 8 _A to chemical processing wafers W while overflowing by circulating the substrate processing chamber 1. Continuing then the processing solution Q _A through the process liquid recovery valve 44 _A of the supply and discharge fluid changeover valve 13 and the drain passage 42 treatment liquid storage container 6
To be collected. Then, pure water _DW is supplied to the emptied substrate processing tank 1 via the pure water introduction valve 27, and the process shifts to pure water processing. After rinsing the wafer W while overflowing the pure water, the pure water is discharged. For even the processing solution Q _B · Q _C,
After chemical processing by circulating as in the processing solution Q _A,
The wafer W is lifted from the substrate processing bath 1.

In the above-mentioned pure water treatment, the pure water discharged from the substrate processing tank 1 is discharged to the drain 43 through the drain valve 47. At this time, since the pure water waste liquid is discharged from the innermost part 42a of the drain passage 42, the processing liquid remaining on the inner wall of the drain passage 42 is effectively washed away. Further, the discharge port 45 at the bottom of the substrate processing tank 1 and the supply / discharge liquid switching valve 13 are configured to be capable of quick drain, and the throughput is increased by rapid discharge. If HF treatment is included in any of the chemical treatments, H is added to the substrate processing tank 1 as described above.
Pure water is supplied in a state where F is charged, and HF is replaced with pure water by overflowing. When the substrate W is pulled up from the substrate processing tank 1 after the final rinsing is completed, the pure water is allowed to overflow. Do.

FIG. 5 is a schematic system diagram of an immersion treatment apparatus according to Embodiment 5 of the present invention. A thick line in FIG. 5A shows a treatment liquid path in the case of chemical treatment, and FIG. The bold line shows the pure water path and the processing liquid path in the case of the pure water treatment. The immersion processing apparatus is provided with a single substrate processing tank 1 in the immersion processing section 65 and for performing circulation filtering and temperature adjustment of the processing liquid while the chemical liquid processing and the pure water processing are performed. Things. That is, as shown in FIGS. 5 (A) and 5 (B), the processing liquid introduction valve 8 of the processing liquid supply path 7 and the drainage valve 47 of the drainage path 42 are each configured by a switchable three-way valve.

The lower flow side of the drainage passage 42 is branched into two branches, one of the pipes 21 is connected to the drainage drain 43, and the other is connected to the processing liquid storage container 6 as the processing liquid recovery path 22. . The pure water supply path 3 is located downstream of the processing liquid introduction valve 8.
And the pressure feed pump 15 and the processing liquid introduction valve 8
A filter 10 and an in-line type heater (hereinafter, referred to as “in-line heater”) 81 are additionally provided between them, and the processing liquid supply path 7 and the processing liquid recovery path 22 are connected via a switchable processing liquid introduction valve 8. I do.

When the chemical treatment is performed, as shown in FIG. 5A, the cleaning liquid overflowing from the substrate processing tank 1 to the overflow liquid collecting section 41 is supplied to the processing liquid collecting passage 22.
And is collected in the processing liquid storage container 6 through the pressure feed pump 1 again.
After being sucked up by the filter 5 and filtered and refreshed by the filter 10, it is returned to the substrate processing tank 1. When the pure water treatment is performed, as shown in FIG. 5B, the overflowed pure water is discharged to the drainage drain 43 via the switchable drainage valve 47 and the drainage passage 21. .

During the pure water treatment, the pressure pump 15
The processing liquid pumped up by the filter is filtered by the filter 10 and refreshed, and thereafter, the processing liquid introduction valve 8 which can be switched.
Flows into the processing liquid recovery path 22 through the flow path, and returns to the processing liquid storage container 6 again. Even when a single substrate processing tank 1 is used with the above-described configuration, the processing liquid is circulated and filtered while the chemical liquid processing and the pure water processing are performed, so that the processing liquid can be refreshed. Further, the in-line heater 81 has, for example, a configuration in which a heater is provided on the outer periphery of a pipeline, and heats the processing liquid passing through the pipeline. For this reason,
Even during the above-described pure water processing, the circulating processing liquid can be adjusted to a uniform temperature, and particularly when performing high-temperature chemical processing, a processing liquid at a predetermined temperature is supplied into the substrate processing tank and immediately cleaned. It is possible to shift to processing.

FIG. 6 is a schematic system diagram of an immersion treatment apparatus according to Embodiment 6 of the present invention. A thick line in FIG. 6A shows a treatment liquid circulation path in the case of chemical treatment, and FIG. The bold line indicates a pure water path and a processing liquid circulation path in the case of pure water treatment. This immersion processing apparatus also performs circulation filtering and temperature adjustment of the processing liquid in the same manner as in the fifth embodiment (FIG. 5). That is, as shown in FIGS. 6A and 6B, in the immersion processing apparatus of the fifth embodiment (FIG. 5), a switchable processing liquid recovery valve 44 is provided in the processing liquid recovery path 22, and the processing liquid The upstream side of the feed pump of the supply path 7 and the processing liquid recovery path 22 are connected via the processing liquid recovery valve 44.

When the chemical solution treatment is performed, as shown in FIG.
From 1, the processing liquid is supplied to the processing liquid recovery path 22 through the drain valve 47.
After flowing through the processing liquid supply path 7 via the processing liquid recovery valve 44 without passing through the processing liquid storage container 6, the liquid is filtered and refreshed by the filter 10, and the temperature is adjusted. Reflux to tank 1. On the other hand, when the pure water treatment is performed, as shown in FIG. 6 (B), the treatment liquid pumped up by the pump 15 is refreshed by the filter 10 and, after the temperature is adjusted, the treatment liquid is recovered. It flows down the channel 22 and returns to the processing liquid storage container 6 via the processing liquid recovery valve 44.

In the sixth embodiment, when the chemical solution treatment is performed, the treatment solution is sucked by the pressure pump 15 and flows down the treatment solution collection passage 22. Even if the diameter is small, the flow rate of the processing liquid flowing down is much larger than in Example 5 in which the processing liquid simply flows down by a head. That is, there is an advantage that the processing liquid recovery path 22 need only have a small diameter.

FIG. 7 is a schematic system diagram of an immersion processing apparatus according to Embodiment 7 of the present invention. In the seventh embodiment, three sets of the same immersion processing apparatus as in the sixth embodiment (FIG. 6) are arranged in parallel. In Example 7, as shown in FIG. 7, each respectively, in the substrate processing chamber 1 the chemical treatment of the type with a predetermined processing solution Q _A to Q _C is carried out separately, each processing solution and the wafer W surface-treated Q _a to Q _C is recycled is collected in the processing liquid storage container 6. It is also possible to adjust the temperature of each processing solution Q _A to Q _C by or in-line heater 81 to refresh each processing solution Q _A to Q _C by the circulation filtering.

FIG. 8 is a schematic system diagram of an immersion processing apparatus according to Embodiment 8 of the present invention. This immersion processing apparatus is similar to that of the seventh embodiment.
In FIG. 7, one of the substrate processing tanks 1 is set as a dedicated rinsing tank for pure water treatment, and the other two sets are treated liquids while the chemical solution treatment and the pure water treatment are performed. Embodiment 6 is that the circulation filtering and temperature adjustment of the filter are executed.
It is the same as (FIG. 6). In the eighth embodiment, after chemical treatment with a processing solution Q _A or Q _B at most two pieces of each of the substrate processing chamber 1 has been performed, subsequently lightly pure water process is performed, the pure water D further rinsing dedicated tank 1 Pure water treatment by _W is performed.
As a result, the wafer W can be more strongly rinsed than in the case where the chemical solution treatment and the pure water treatment are sequentially performed in each of the substrate processing tanks 1, the required time of the pure water treatment is reduced, and the throughput is improved.

FIGS. 9 and 10 are schematic system diagrams of an immersion treatment apparatus according to Embodiment 9 of the present invention. The thick line in FIG. 9 indicates a treatment liquid circulation path in the case of chemical treatment, and the thick line in FIG. 4 shows a pure water path and a processing liquid circulation path in the case of pure water treatment. Embodiment 9 is different from Embodiment 9 in that a single substrate processing tank 1 is used.
Embodiment 6 is common to Embodiment 6 (FIG. 6) in that processing solution circulation filtering and temperature adjustment are performed during chemical solution treatment and pure water treatment.

In the ninth embodiment, in the processing liquid supply path 7 shown in FIGS. 9 and 10, the space between the opening / closing valve 9 on the upstream side of the pump and the processing liquid introduction valve 8 is set when the processing liquid is collected. Also serves as the recovery path 22. In FIG. 9, when the chemical solution processing is performed, the open / close valve 9 and the processing liquid introduction valve 8 of the processing liquid supply path 7 and the switchable drain valve 47 a of the drain path 42 are provided.
The open valve, the other valve is closed. The processing liquid Q is pumped up from the pressure pump 15 until it is filled in the substrate processing tank 1 and overflows sufficiently.

Thereafter, the on-off valve 9 on the upstream side of the pump in the processing liquid supply path 7 is closed. The processing liquid Q overflowing from the substrate processing tank 1 flows down the processing liquid recovery path 22 from the overflow recovery section 41 via the drainage path 42 and the drainage valve 47a, and supplies the processing liquid without passing through the processing liquid storage container 6. After flowing into the upstream side of the pump of the passage 7, the water is again pumped up by the pump 15, filtered by the filter 10 and refreshed, and then returned to the substrate processing tank 1. In other words, the circulation filtering of the processing liquid is performed while the chemical processing of the substrate is performed.

When the chemical processing is completed, the on-off valve 9 and the processing liquid introduction valve 8 of the processing liquid supply path 7 are closed, and the drain path 42
Drain valve 47a, processing liquid supply path 7, and processing liquid recovery path 22
The supply / drainage switching valve 13 communicating with the valve is opened. further,
The processing liquid recovery passage 22a at the subsequent stage led out between the pressure pump 15 and the processing liquid introduction valve 8 communicates with the processing liquid storage container 6 via the processing liquid recovery valve 44, and the other valves are closed. The processing liquid Q in the substrate processing tank 1 passes through the processing liquid recovery path 22 → the upstream side of the processing liquid supply path 7 → the pressure pump 15 → the processing liquid recovery path 22 a at the subsequent stage → the processing liquid recovery valve 44, and the processing liquid storage container. Collected in 6.

In FIG. 10, when the processing liquid is recovered and the processing is shifted to the pure water processing, the on-off valve 9 is opened.
The supply / drainage switching valve 13 is closed, and the drainage valve 47 of the drainage passage 42 is closed.
a is switched to the drainage drain 43a side. The processing liquid Q collected in the processing liquid storage container 6 is pumped up by the pressure feed pump 15 and the filter 10 → the processing liquid recovery path 22a →
Circulation filtering is performed via the processing liquid recovery valve 44.

Next, the supply / drainage switching valve 13 is closed, the first drainage valve 47a of the drainage passage 42 is switched to the drain 43a for drainage, and the pure water introduction valve 27 of the pure water supply passage 3a is turned on. The valve is opened. The pure water _DW is filled in the substrate processing tank 1 and overflows to rinse the wafer. Substrate processing tank 1
The pure water _DW that overflows from the drainage drain 4 through the overflow recovery part 41 → the drainage passage 42 → the first drainage valve 47a → the second drainage valve 47b → the drainage drainage passage 21a.
3a. Then, during the processing of the pure water for the wafer, the circulation filtering of the processing liquid is performed.

This ninth embodiment has the following abundant functions in addition to the above-mentioned cyclic filtering. As shown in FIGS. 9 and 10, the substrate processing bath 1 is installed above the ultrasonic cleaning unit 34 in the drainage tank 2, and the wafer is processed by the ultrasonic oscillator 35 through the ultrasonic cleaning unit 34. It can be strongly cleaned (hereinafter, referred to as an ultrasonic cleaning function). The pure water supply path 3 is branched into a pure water introduction path 3a connected to the processing liquid supply path 7 and a shower introduction path 3b connected to the shower pipe 17, and the pure water introduction path 3a has a pure water introduction valve. And a similar unit valve 28 is attached to the shower introduction path 3b. This pure water shower is used when a wafer is lightly cleaned with pure water before performing a chemical solution treatment (hereinafter, referred to as a pure water shower function). Excess pure water from the unit valves 27 and 28 is separated and discharged to a pure water recovery drain 43b described later.

The drainage path 42 is branched into a drainage path 21 and a processing liquid recovery path 22 via a switchable first drainage valve 47a. The drain 21 is branched into a drain 21a for drain and a drain 21b for recovery via a second drain valve 47b. The drainage drain 21a is connected to a drain 43a, and the drain 21b is connected to a pure water drain 43b. The substrate processing tank 1 is provided with a quick drain valve 32 for rapid drainage. When discharging the pure water drain from the substrate processing tank 1, the quick drain valve 32 is opened to discharge the pure water drain. It is made to flow down into the liquid tank 2 and the first drain valve 47a and the second drain valve 47b are appropriately switched and operated to drain the drain 43a.
Alternatively, the water is separated and discharged to the pure water recovery drain 43b (hereinafter, referred to as a separation and discharge function of wastewater).

The processing liquid supply path 7 is provided between the connection portion of the pure water introduction path 3 a and the processing liquid introduction valve 8, and is a supply / discharge switching valve 1.
The lower end of the processing liquid recovery path 22 is communicated between the on-off valve 9 provided in the processing liquid supply path 7 and the pump 15. Further, between the pressure pump 15 and the processing liquid introduction valve 8, a processing liquid recovery path 22a and a processing liquid drain path 21c at the subsequent stage are led out. The processing liquid recovery path 22a at the subsequent stage is connected to the processing liquid storage container 6 via a processing liquid recovery valve 44, and the processing liquid drainage path 21c is connected to a processing liquid recovery drain 43b via a third drain valve 47c. You.

When the processing liquid Q is collected in the processing liquid storage container 6, as described above, the substrate processing tank 1 → the processing liquid supply path 7
→ supply / drainage liquid switching valve 13 → treatment liquid recovery path 22 → pressure pump 1
5 → the filter 10 → the processing liquid Q is recovered in the processing liquid storage container 6 via the second processing liquid recovery path 22a (the processing liquid recovery valve 44). When discarding the exhausted processing liquid Q, the processing liquid recovery valve 44 of the processing liquid recovery path 22a is closed, the third drain valve 47c is opened, and the processing liquid Q is processed by the pressure pump 15. The liquid is discharged to the liquid collecting drain 43c. As a result, the processing liquid Q is separated and discharged into the processing liquid storage container 6 and the processing liquid collecting drain 43c (hereinafter, referred to as a processing liquid separation / discharge function).

A constant temperature heater 5 is immersed in the substrate processing tank 1 and the processing liquid storage container 6 so that the processing liquid can be adjusted to a uniform temperature in combination with the above-mentioned circulation filtering (hereinafter, the processing liquid is maintained at a constant temperature). Function). Thereby, especially in the high-temperature chemical liquid processing, the processing liquid Q at a predetermined temperature can be supplied into the substrate processing tank 1 to immediately perform the cleaning processing, thereby improving the throughput. A bubbling unit 24 is immersed in the substrate processing tank 1 to supply a N ₂ gas from the gas supply path 23 to form a uniform upward flow of the processing liquid Q during the substrate cleaning process. It is configured to promote the cleaning process (hereinafter referred to as a processing solution bubbling function). The gas supply path 23 is provided with a gas introduction valve 37, a unit valve 38, and a gas filter 39.

The treatment liquid storage container 6 has a plurality of chemical liquids q ₁ through a plurality of chemical liquid introduction valves 48a, 48b and 48c.
Q ₂ · q ₃ can be injected, and these chemicals q ₁ · q ₂ · q ₃ can be prepared to produce a required processing liquid (hereinafter referred to as a processing liquid preparation function). . In addition,
The substrate processing tank 1 and the processing liquid storage container 6 contain the processing liquid Q
Detector 1 for detecting liquid level, remaining amount, temperature, etc.
8 are provided.

FIGS. 11, 12 and 13 are schematic system diagrams of an immersion treatment apparatus according to Embodiment 10 of the present invention, wherein the thick line in FIG. 11 indicates the treatment liquid circulation path in the case of chemical treatment. Thick lines in FIG. 12 and FIG. 13 indicate a pure water path and a processing liquid circulation path in the case of pure water treatment, respectively. The immersion treatment device is provided with a plurality of processing liquid reservoir chamber 6 _A · 6 _B having different processing solution for a single substrate processing chamber 1, the treatment liquid supply channel 7 _A
Points to switchably configured for · 7 _B and the treatment liquid recovery passage 22a · 22b of each processing solution reservoir vessel 6 _A · 6 _B are different in the above Example 9 basically.

In the tenth embodiment, similarly to the ninth embodiment, a part of the processing liquid supply path 7 (between the opening / closing valve 9a and the processing liquid introduction valve 8) is connected to the processing liquid recovery path 22 during the processing liquid recovery. Doubles. The on-off valve 9a · connecting the switchable plurality of processing liquid reservoir chamber 6 _A · 6 _B to the treatment liquid supply channel 7
9b corresponds to the processing liquid selection valve 82 in claim 5. Further, the processing liquid supply path 7 also serving as the processing liquid recovery path 22
Selection process liquid recovery valve 44a · 44b for connecting the portion to be switched a plurality of processing liquid reservoir chamber 6 _A · 6 _B (between the on-off valve 9a and the treatment liquid inlet valve 8) back treatment liquid in Claim 5 It corresponds to the valve 83.

A quick drain valve 32 for rapid drainage is provided in the substrate processing tank 1 and the overflow recovery section 41, respectively.
When the substrate processing tank 1 and the overflow recovery section 41 are emptied, a liquid 33 can be quickly drained. Further, the primary chamber of the filter 10 and the overflow recovery section 41 are communicated with each other through a check valve 86 by a communication path 85. When the filter 10 is clogged, the processing liquid is transferred to the overflow recovery section 41. 4
1.

[0076] In FIG. 11, the processing solution Q _{when A} chemical treatment according to is carried out, the first on-off valve 9a of the processing liquid supply passage 7 upstream, a processing liquid inlet valve 8, the downstream side of the on-off valve 14, the first drain valve 47a switchable is opened valve,
Other valves are closed. Processing solution Q _A is pumped from the pressure pump 15 until it overflows sufficiently filled into the substrate processing chamber 1, then off valve 9a is closed,
The first drain valve 47a is opened. Processing solution Q _A overflowing from the substrate processing chamber 1, the overflow recovery section 4
1 → Drainage path 42 → First drainage valve 47a → Treatment liquid recovery path 22
→ The upstream side of the pump of the processing liquid supply path 7 → the pumping pump 15 → the filter 10 → the processing liquid introduction valve 8 → the substrate processing tank 1 is recirculated through the on-off valve 14. That is, the chemical processing of the wafer is performed while performing the circulation filtering of the processing liquid.

When the chemical processing is completed, the on-off valves 9a and 9b and the processing liquid introduction valve 8 on the upstream side of the processing liquid supply path 7 are closed, and the first drain valve 47a of the drain path 42, the processing liquid supply path 7 The supply / drainage switching valve 13 communicating with the processing liquid recovery path 22 is opened. Further, another processing liquid recovery passage 22 a led out between the pressure pump 15 and the processing liquid introduction valve 8 is connected to the processing liquid storage container 6 via the processing liquid recovery valve 44. The other valves are closed, and the processing liquid Q in the substrate processing tank 1 is collected in the processing liquid storage container 6.

When the processing liquid is recovered and the processing is shifted to the pure water processing, as shown in FIG. 12, the on-off valve 9a is opened, the supply / drainage switching valve 13 is closed, and the drainage path 42 is opened. The first drain valve 47a is switched to the drain 43a for drainage.
Recovered in the processing liquid storage container 6 _A treating solution Q _A is the filter 10 is pumped by pressure pump 15, the circulation filtering is performed through the second treatment liquid recovery path 22a. Next, the supply / drainage switching valve 13 is closed, the first drainage valve 47a of the drainage passage 42 is switched to the drain 43a for drainage, and the pure water introduction valve 27 of the pure water supply passage 3a is opened. The pure water _DW is filled in the substrate processing tank 1 and overflows, while rinsing the substrate W. The pure water _DW overflowing from the substrate processing tank 1 is discharged to a drain 43a through an overflow recovery section 41 → a drain path 42 → a first drain valve 47a → a second drain valve 47b. And also during the purification treatment of the substrate circulating filtering processing solution Q _A is performed.

[0079] In FIG. 13, the processing solution Q when chemical treatment by is performed of _B, another on-off valve 19b (processing liquid selection valve 82) for subsequent processing liquid supply passage 7b communicating with the substrate processing bath 1 is connected to the processing liquid reservoir chamber 6 _B through,
Another process liquid recovery valve for this treatment liquid reservoir chamber 6 _B 44
The processing liquid recovery path 22b is connected via b (processing liquid selection valve 83). In other words, when the chemical treatment of the wafer is performed, the circulation filtering of the treatment liquid is performed as shown in FIG. 11, and when the pure water treatment of the wafer is performed,
Circulation filtering processing solution Q _B is performed in FIG. 13. In the tenth embodiment, the ninth embodiment is also used.
Ultrasonic cleaning function, pure water shower function,
It is configured to exhibit the function of separating and discharging pure water, the function of separating and discharging the processing liquid, and the function of maintaining the temperature of the processing liquid.

FIGS. 14 and 15 are schematic system diagrams of an immersion treatment apparatus according to Embodiment 11 of the present invention, respectively.
The bold line in FIG. 4 shows the treatment liquid circulation path in the case of chemical treatment, and FIG.
The thick line in 5 shows the pure water path and the processing liquid circulation path in the case of the pure water treatment. This immersion processing apparatus includes a plurality of substrate processing tanks 1.
Treatment liquid differs a plurality of processing liquid reservoir chamber 6 _A · 6 _B of provided for _A · 1 _B, the processing liquid the substrate supply path 7 _A · 7 _B and the treatment liquid recovery passage 22a · 22b treatment tank 1 _A · Unlike point to switchably configured for 1 _B and the processing liquid reservoir chamber 6 _a · 6 _B is as in example 10, the other points are similar to those in example 10. The same members as those described above are denoted by the same reference numerals, and redundant description will be omitted.

[0081] In this immersion treatment apparatus, as shown in FIG. 14, chemical treatment and pure water processing by each processing solution Q _A and the processing liquid Q _B in each of the substrate treatment tank 1 are carried out selectively in parallel as appropriate. In this case, the chemical solution treatment and the pure water treatment are performed according to the tenth embodiment. That is, when the chemical treatment is performed, as shown in FIG. 14, each processing solution Q _A · Q _B is filled in each of the substrate treatment tank 1, the processing solution Q _A · Q _B overflowed, the overflow Recovery section 41 → drainage path 42 → first drainage valve 47a → processing liquid recovery path 22 → pump upstream of processing liquid supply path 7 → pressure pump 15 → filter 10
→ The processing liquid introduction valve 8 → The substrate processing tank 1 is refluxed via the on-off valve 14. That is, the chemical processing of the wafer is performed while performing the circulation filtering of the processing liquid.

When the processing liquid is collected and the processing is shifted to the pure water processing, as shown in FIG. 15, the processing liquids Q _A and Q _B in the substrate processing tanks 1 are respectively stored in the processing liquid storage vessels 6 _A and 6 _A. 6 Collected in _B. The processing liquids Q _A and Q _B collected in the processing liquid storage containers 6 _A and 6 _B are respectively pumped up by the pressure pump 15 and subjected to circulating filtering through the filter 10 and the processing liquid recovery path 22 a at the subsequent stage. The pure water _DW is filled in the respective substrate processing tanks 1 and overflows to rinse the wafer. The pure water _DW overflowing from each substrate processing tank 1 is supplied to the overflow recovery section 41 → the drain path 42 → the first drain valve 47a → the second drain valve 4 respectively.
It is discharged to drainage drain 43a through 7b. And while the deionized water treatment of the wafer also circulating filtering processing solution Q _A · 6 _B is performed.

In the eleventh embodiment, an example in which two substrate processing tanks and two processing liquid storage containers are selectively connected is illustrated. However, the number of substrate processing tanks and processing liquid storage containers may be further increased. it can. Because the case can be executed in parallel a plurality of chemical processing by each substrate processing tank, also improves further throughput, the chemical treatment and pure water treatment with a processing solution Q _A and the processing liquid Q _B in each substrate processing tank Although it has been described as being selectively performed in parallel as appropriate,
A dedicated chemical processing may be performed for each substrate processing tank.

[0084]

According to the first aspect of the present invention, the processing liquid overflows from the substrate processing tank in the chemical liquid processing through the processing liquid recovery valve and the processing liquid recovery path. Since the liquid is collected in the liquid storage container and circulated again to the substrate processing tank and can be reused, the consumption of the processing liquid can be significantly reduced. Further, since the chemical solution treatment and the pure water treatment can be performed in a single substrate treatment tank, it is possible to prevent an increase in the size of the substrate treatment apparatus. In the invention of claim 2,
Because of the configuration and operation described above, the treatment liquid is refreshed by filtering while the chemical treatment and the pure water treatment are performed.

According to the third aspect of the present invention, when the chemical treatment is performed, the treatment liquid is sucked by the pressure feed pump and flows down the treatment liquid recovery path. However, since the flow rate of the processing liquid flowing down is much larger than that flowing down simply by the head, the processing liquid recovery path needs to have a small pipe diameter. According to the fourth aspect of the present invention, the heating means for heating the processing liquid is provided in a part of the processing liquid circulation path including the processing liquid storage container. It is not necessary to wait, and it is possible to immediately shift from the cleaning process using pure water to the chemical solution process.

According to the fifth aspect of the present invention, since a plurality of chemicals can be processed in at least one substrate processing tank, it is possible to prevent an increase in the size of the substrate processing apparatus. In addition, the consumption of each processing solution can be greatly reduced.

[Brief description of the drawings]

FIG. 1 is a schematic system diagram of an immersion processing apparatus according to a first embodiment.

FIG. 2 is a schematic system diagram of an immersion processing apparatus according to a second embodiment.

FIG. 3 is a schematic system diagram of an immersion processing apparatus according to a third embodiment.

FIG. 4 (A) is a schematic system diagram of an immersion treatment apparatus showing a fourth embodiment, and FIG. 4 (B) shows a portion B in FIG.
FIG. 5 is a vertical sectional view of a main part of a liquid passage showing a portion C in FIG. 4A.

FIG. 5 is a schematic system diagram of an immersion processing apparatus according to a fifth embodiment.

FIG. 6 is a schematic system diagram of an immersion processing apparatus according to a sixth embodiment.

FIG. 7 is a schematic system diagram of an immersion processing apparatus according to a seventh embodiment.

FIG. 8 is a schematic system diagram of an immersion processing apparatus according to an eighth embodiment.

FIG. 9 is a schematic system diagram of an immersion processing apparatus according to a ninth embodiment.

FIG. 10 is a schematic system diagram of an immersion processing apparatus according to a ninth embodiment.

FIG. 11 is a schematic system diagram of an immersion processing apparatus according to Example 10.

FIG. 12 is a schematic system diagram of an immersion processing apparatus according to Example 10.

FIG. 13 is a schematic system diagram of an immersion processing apparatus according to a tenth embodiment.

FIG. 14 is a schematic system diagram of an immersion processing apparatus according to an eleventh embodiment.

FIG. 15 is a schematic system diagram of an immersion apparatus according to an eleventh embodiment.

FIG. 16 is a schematic perspective view of a substrate processing apparatus to which the immersion processing apparatus of the present invention is applied.

FIG. 17 is a schematic plan view of the substrate processing apparatus.

FIG. 18 is a schematic vertical sectional view of the substrate processing apparatus.

FIG. 19 is a schematic plan view of a substrate processing apparatus according to the related art.

FIG. 20 shows an immersion processing apparatus according to Conventional Example 1;
(A) is a schematic system diagram of chemical solution treatment, and (B) is a schematic system diagram of pure water treatment.

FIG. 21 is a schematic explanatory view of a dipping treatment apparatus showing a second conventional example.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Substrate processing tank, 3 ... Pure water supply path, 6 ... Treatment liquid storage container, 7 ... Treatment liquid supply path, 8 ... Treatment liquid introduction valve, 10 ... Filter, 15 ... Pressure pump, 22 ... Treatment liquid recovery path, 27 ...
Pure water introduction valve, 42 ... drain passage, 43 ... drain drain, 44 ...
Treatment liquid recovery valve, 47: drain valve, 81: in-line heater, 82: treatment liquid selection valve, 83: treatment liquid selection return valve, D _W
... pure water, Q _A ~Q _E ... processing solution, W ... substrate.

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kenji Sugimoto 2426-1, Michikami-no-guchi, Yasu-cho, Yasu-cho, Yasu-gun, Shiga Prefecture Inside Yasu Plant of Dainippon Screen Mfg. Co., Ltd. No. 2426-1, Minogami, Gunoyasu-cho, Gunozu-cho, Yasu Works, Dainippon Screen Mfg. Co., Ltd. (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21 / 304,21 / 306 B08B 3/00-3/14

Claims (5)

(57) [Claims] 1. An overflow type substrate processing tank for immersing a substrate in a processing liquid to perform surface treatment of the substrate, a processing liquid supply path connected to the substrate processing tank, and introducing a processing liquid into the processing liquid supply path. A treatment liquid storage container that communicates through a valve and a pressure pump in order, a pure water supply path that communicates with the treatment liquid supply path via a pure water introduction valve, and a drainage drain that overflows from the substrate processing tank. And a drain path for leading out to the substrate, wherein the drain path is branched and one is connected to a drain through a drain valve, and the other is a processing liquid recovery path. through the process liquid recovery valve communicating with the processing liquid storage container, the chemical treatment process of the treatment liquid of the processing liquid storage container liquid supply
From the path to the substrate processing tank to overflow,
From the drainage path to the processing liquid storage container via the processing liquid collection valve
In the pure water treatment that is collected and performed after the above chemical solution treatment, pure water is
Supply from the supply path to the substrate processing tank to overflow,
Discarding from the drainage path to a drainage drain via a drainage valve,
An immersion processing apparatus for a substrate, comprising: 2. A pump is provided between the pressure pump of the processing liquid supply path and the processing liquid introduction valve, and a pure water supply path is communicated downstream of the processing liquid introduction valve. A processing liquid recovery path is connected between the pump and the pure water supply path connection part, and the processing liquid pumped up by the pressure pump during pure water processing is circulated through the processing liquid recovery path and returned to the processing liquid storage container. 2. The immersion processing apparatus for a substrate according to 1. 3. A processing liquid supply path upstream of the pressure feed pump and a processing liquid recovery path are connected to each other, and a processing liquid is circulated from the processing liquid recovery path to the processing liquid supply path during chemical processing, and is returned to the substrate processing tank. The substrate immersion processing apparatus according to claim 2, wherein 4. The substrate according to claim 2, wherein a heating means for heating the processing liquid is provided in a part of the processing liquid circulation path including the processing liquid storage container formed during the pure water processing. Immersion treatment equipment. 5. A plurality of processing liquid storage vessels are switchably connected to a processing liquid supply path via a processing liquid selection valve, and the plurality of processing liquid storage vessels are connected to a processing liquid recovery path via a processing liquid return selection valve. The substrate immersion processing apparatus according to claim 1, wherein the substrate is switchably connected.