JPH04256318A - Chemical treatment device - Google Patents

Abstract

PURPOSE:To see that the whole quantity of the chemicals in a chemical vessel can be replaced with cleaned chemicals at a time so as to improve the cleaning effect of chemicals by supplying the chemicals in a plurality of spare vessels alternately to chemical vessels and circulating them alternately so as to clean them. CONSTITUTION:The whole quantity of chemicals which have cleaned or etched a semiconductor wafer in a chemical vessel 1 are shifted from a chemical vessel 1 to a spare vessel 2 by opening a liquid discharge valve 8, and then the liquid discharge valve 8 is closed. Next, the chemicals in the spare vessel 3, which were being circulated and filtered by a pump 13, a filter 11, and a circulation valve 7, are supplied to the chemical vessel 1 by closing the circulation valve 7 and opening a liquid supply valve 5, and next chemical processing is performed. And while performing chemical processing in the chemical vessel 1, the chemical shifted to the spare vessel 2 is cleaned, being circulated and filtered by a chemical pump 12, a filter 10, and a circulation valve 6. Hereby, the chemicals can be filtered completely by batch method, and a wafer can be processed in always cleaned chemicals.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chemical processing apparatus, and more particularly to a chemical processing apparatus for semiconductor devices.

0002

2. Description of the Related Art A conventional chemical processing apparatus, as shown in FIG. 2, includes a chemical layer 14 filled with a chemical for etching or cleaning a semiconductor wafer, and a pump 16 that collects and sends out the chemical overflowing from the chemical tank 14. and a filter 15 that filters the chemical liquid from the pump 16 and supplies it to the chemical liquid tank 14. In order to improve the cleanliness of the chemical liquid, the shape of the chemical liquid tank 14 may be devised or the capacity of the pump 16 may be increased. Measures were taken to increase the size and flow rate.

0003

[Problems to be Solved by the Invention] This conventional chemical processing equipment cannot reliably filter all of the chemical at once, so dust that has adhered to the wafer and has been brought in from the previous process, and dust that has been generated during processing. It takes a huge amount of time for the dust to be filtered out and reduced, which is what is normally used. There is a problem in that cleaning cannot be done within the wafer processing time, and dust constantly increases in the chemical solution.

0004

[Means for Solving the Problems] A chemical processing apparatus of the present invention includes a chemical layer for etching or cleaning a semiconductor wafer in a chemical, a plurality of drain valves connected to the chemical layer, and a plurality of drain valves connected to the chemical layer. a reserve tank connected to each of the valves to store the chemical liquid in the chemical tank; a pump and a filter connected to the reserve tank to circulate and purify the chemical liquid in the reserve tank;
The liquid supply valve is connected to the output side of the filter and supplies the filtered chemical liquid from the preliminary tank to the chemical liquid tank.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a block diagram for explaining one embodiment of the present invention.

As shown in FIG. 1, there is a chemical tank 1 for etching and cleaning semiconductor wafers in a chemical solution, and a first and a second tank connected to the chemical tank 1 for discharging the chemical solution in the chemical tank 1. 2 drain valves 8 and 9, first and second reserve tanks 2 and 3 which are connected to the drain valves 8 and 9 and can store the entire amount of the chemical liquid in the chemical liquid tank 1, and First and second pumps 12 and 13 that are connected to each other to discharge the respective chemical liquids from the preliminary layers 2 and 3, and first and second filters that are connected to the pumps 12 and 13 respectively to filter the chemical liquids. 10, 11 and
The preparatory tank 2,
The first and second circulation valves 6 and 7 are connected to filters 11 and 12 for returning the cleaned chemical solution to the chemical tank 1.
The first and second liquid supply valves 4 and 5 are provided for supplying liquid to the liquid.

A drain valve 8 is opened to transfer the entire amount of the chemical in the chemical tank 1 to the preliminary tank 2, and then the drain valve 8 is closed. Next, the circulation valve 7 is closed, the liquid supply valve 5 is opened, and the chemical liquid in the preliminary tank 3, which has been circulated and filtered by the pump 13, filter 11, and circulation valve 7, is supplied to the chemical liquid tank 1, and the next chemical liquid treatment is carried out. conduct. During the chemical treatment in the chemical tank 1, the chemical liquid transferred to the preliminary tank 2 is circulated by a pump 12, a filter 10, and a circulation valve 6, and is filtered and purified.

In this way, by alternately supplying the chemical solutions in the reserve tanks 2 and 3 to the chemical solution tank 1 and purifying them by circulating them alternately, the entire amount of the chemical solution in the chemical solution tank can be replaced with the purified chemical solution at once. The cleaning effect of the resulting chemical solution can be improved.

[0010] Note that three or more sets of purification systems including preliminary tanks may be installed, so that the usage period of the chemical solution can be shortened and treatment can be performed with a highly clean chemical solution.

[0011]

[Effects of the Invention] As explained above, the present invention has the function of completely filtering the chemical solution in a batch manner, so that the wafers are always treated with the cleaned chemical solution, and the wafers are not brought in with the chemical solution attached to the wafers. This has the effect of completely removing dust from the previous process.

[Brief explanation of the drawing]

FIG. 1 is a block diagram for explaining one embodiment of the present invention.

FIG. 2 is a block diagram for explaining a conventional chemical processing device.

[Explanation of symbols]

1,14 Chemical tank 2, 3 Preliminary tank 4, 5 Liquid supply valve 6,7 Circulation valve 8,9 Drainage balgo 10, 11, 15 Filter 12, 13, 16 Pump

Claims (1)

[Claims] 1. A chemical layer for etching or cleaning a semiconductor wafer in a chemical solution, a plurality of drain valves connected to the chemical layer, and a plurality of drain valves connected to each of the drain valves for discharging the chemical solution in the chemical tank. a pump and filter connected to the reserve tank to circulate and purify the chemical solution in the reserve tank; and a pump and filter connected to the output side of the filter to transfer the filtered chemical solution in the reserve tank to the chemical solution tank. A chemical liquid processing device comprising: a liquid supply valve for supplying a liquid to the liquid supply valve;