JPS59123255A - 複層フレキシブル・フイルム・モジユ−ル及びその製法 - Google Patents
複層フレキシブル・フイルム・モジユ−ル及びその製法Info
- Publication number
- JPS59123255A JPS59123255A JP58154231A JP15423183A JPS59123255A JP S59123255 A JPS59123255 A JP S59123255A JP 58154231 A JP58154231 A JP 58154231A JP 15423183 A JP15423183 A JP 15423183A JP S59123255 A JPS59123255 A JP S59123255A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- polyimide
- substrate
- chromium
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title description 19
- 229920001721 polyimide Polymers 0.000 claims description 47
- 239000004642 Polyimide Substances 0.000 claims description 45
- 239000000758 substrate Substances 0.000 claims description 15
- 238000005530 etching Methods 0.000 claims description 10
- 238000000151 deposition Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 14
- ZTXONRUJVYXVTJ-UHFFFAOYSA-N chromium copper Chemical compound [Cr][Cu][Cr] ZTXONRUJVYXVTJ-UHFFFAOYSA-N 0.000 description 13
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 10
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 9
- 229920002120 photoresistant polymer Polymers 0.000 description 9
- 239000010408 film Substances 0.000 description 8
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000009987 spinning Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- GXDVEXJTVGRLNW-UHFFFAOYSA-N [Cr].[Cu] Chemical compound [Cr].[Cu] GXDVEXJTVGRLNW-UHFFFAOYSA-N 0.000 description 1
- -1 by evaporation Chemical compound 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/467—Adding a circuit layer by thin film methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0376—Etching temporary metallic carrier substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Wire Bonding (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US453443 | 1982-12-27 | ||
| US06/453,443 US4480288A (en) | 1982-12-27 | 1982-12-27 | Multi-layer flexible film module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59123255A true JPS59123255A (ja) | 1984-07-17 |
| JPH0148655B2 JPH0148655B2 (enExample) | 1989-10-20 |
Family
ID=23800610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58154231A Granted JPS59123255A (ja) | 1982-12-27 | 1983-08-25 | 複層フレキシブル・フイルム・モジユ−ル及びその製法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4480288A (enExample) |
| EP (1) | EP0114211B1 (enExample) |
| JP (1) | JPS59123255A (enExample) |
| DE (1) | DE3377440D1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62252952A (ja) * | 1986-01-31 | 1987-11-04 | テキサス インスツルメンツ インコーポレイテツド | 相互配線回路素子の製作方法および該方法により製作した集積回路製品 |
| JPS6442157A (en) * | 1987-07-24 | 1989-02-14 | Motorola Inc | Method of treating and transposing multi-level interconnection lines |
Families Citing this family (68)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5008656A (en) * | 1984-12-20 | 1991-04-16 | Raytheon Company | Flexible cable assembly |
| US4949224A (en) * | 1985-09-20 | 1990-08-14 | Sharp Kabushiki Kaisha | Structure for mounting a semiconductor device |
| WO1987006766A1 (en) * | 1986-05-01 | 1987-11-05 | Honeywell Inc. | Multiple integrated circuit interconnection arrangement |
| US4681654A (en) * | 1986-05-21 | 1987-07-21 | International Business Machines Corporation | Flexible film semiconductor chip carrier |
| US4711791A (en) * | 1986-08-04 | 1987-12-08 | The Boc Group, Inc. | Method of making a flexible microcircuit |
| US4945399A (en) * | 1986-09-30 | 1990-07-31 | International Business Machines Corporation | Electronic package with integrated distributed decoupling capacitors |
| US4873615A (en) * | 1986-10-09 | 1989-10-10 | Amp Incorporated | Semiconductor chip carrier system |
| US4744008A (en) * | 1986-11-18 | 1988-05-10 | International Business Machines Corporation | Flexible film chip carrier with decoupling capacitors |
| US4681655A (en) * | 1986-11-24 | 1987-07-21 | Microelectronics And Computer Technology Corporation | Electrical interconnect support system with low dielectric constant |
| US4766670A (en) * | 1987-02-02 | 1988-08-30 | International Business Machines Corporation | Full panel electronic packaging structure and method of making same |
| US4855867A (en) * | 1987-02-02 | 1989-08-08 | International Business Machines Corporation | Full panel electronic packaging structure |
| US5159535A (en) * | 1987-03-11 | 1992-10-27 | International Business Machines Corporation | Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate |
| US4788767A (en) * | 1987-03-11 | 1988-12-06 | International Business Machines Corporation | Method for mounting a flexible film semiconductor chip carrier on a circuitized substrate |
| US5170931A (en) * | 1987-03-11 | 1992-12-15 | International Business Machines Corporation | Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate |
| GB8706857D0 (en) * | 1987-03-23 | 1987-04-29 | Bradley International Ltd Alle | Chip carriers |
| US4933810A (en) * | 1987-04-30 | 1990-06-12 | Honeywell Inc. | Integrated circuit interconnector |
| US4812191A (en) * | 1987-06-01 | 1989-03-14 | Digital Equipment Corporation | Method of forming a multilevel interconnection device |
| US4940510A (en) * | 1987-06-01 | 1990-07-10 | Digital Equipment Corporation | Method of etching in the presence of positive photoresist |
| US4774127A (en) * | 1987-06-15 | 1988-09-27 | Tektronix, Inc. | Fabrication of a multilayer conductive pattern on a dielectric substrate |
| US4855872A (en) * | 1987-08-13 | 1989-08-08 | General Electric Company | Leadless ceramic chip carrier printed wiring board adapter |
| JPH0183331U (enExample) * | 1987-11-25 | 1989-06-02 | ||
| US6288561B1 (en) * | 1988-05-16 | 2001-09-11 | Elm Technology Corporation | Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus |
| US5225771A (en) * | 1988-05-16 | 1993-07-06 | Dri Technology Corp. | Making and testing an integrated circuit using high density probe points |
| US4924589A (en) * | 1988-05-16 | 1990-05-15 | Leedy Glenn J | Method of making and testing an integrated circuit |
| US5512397A (en) * | 1988-05-16 | 1996-04-30 | Leedy; Glenn J. | Stepper scanner discretionary lithography and common mask discretionary lithography for integrated circuits |
| JPH0638464B2 (ja) * | 1988-05-26 | 1994-05-18 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | 薄い可撓性基板構造体 |
| US4937707A (en) * | 1988-05-26 | 1990-06-26 | International Business Machines Corporation | Flexible carrier for an electronic device |
| US4965700A (en) * | 1988-05-26 | 1990-10-23 | International Business Machines Corporation | Thin film package for mixed bonding of chips |
| US4987100A (en) * | 1988-05-26 | 1991-01-22 | International Business Machines Corporation | Flexible carrier for an electronic device |
| US5216807A (en) * | 1988-05-31 | 1993-06-08 | Canon Kabushiki Kaisha | Method of producing electrical connection members |
| JP2702507B2 (ja) * | 1988-05-31 | 1998-01-21 | キヤノン株式会社 | 電気的接続部材及びその製造方法 |
| US4906803A (en) * | 1988-11-08 | 1990-03-06 | International Business Machines Corporation | Flexible supporting cable for an electronic device and method of making same |
| JP2676112B2 (ja) * | 1989-05-01 | 1997-11-12 | イビデン株式会社 | 電子部品搭載用基板の製造方法 |
| US4899439A (en) * | 1989-06-15 | 1990-02-13 | Microelectronics And Computer Technology Corporation | Method of fabricating a high density electrical interconnect |
| US5072075A (en) * | 1989-06-28 | 1991-12-10 | Digital Equipment Corporation | Double-sided hybrid high density circuit board and method of making same |
| EP0411165B1 (en) * | 1989-07-26 | 1997-04-02 | International Business Machines Corporation | Method of forming of an integrated circuit chip packaging structure |
| US5244833A (en) * | 1989-07-26 | 1993-09-14 | International Business Machines Corporation | Method for manufacturing an integrated circuit chip bump electrode using a polymer layer and a photoresist layer |
| US4920639A (en) * | 1989-08-04 | 1990-05-01 | Microelectronics And Computer Technology Corporation | Method of making a multilevel electrical airbridge interconnect |
| US4997517A (en) * | 1990-01-09 | 1991-03-05 | Olin Corporation | Multi-metal layer interconnect tape for tape automated bonding |
| US4999699A (en) * | 1990-03-14 | 1991-03-12 | International Business Machines Corporation | Solder interconnection structure and process for making |
| JP3280394B2 (ja) * | 1990-04-05 | 2002-05-13 | ロックヒード マーティン コーポレーション | 電子装置 |
| US5065227A (en) * | 1990-06-04 | 1991-11-12 | International Business Machines Corporation | Integrated circuit packaging using flexible substrate |
| JPH0450820A (ja) * | 1990-06-14 | 1992-02-19 | Seiko Epson Corp | 配線接続装置 |
| US5250758A (en) * | 1991-05-21 | 1993-10-05 | Elf Technologies, Inc. | Methods and systems of preparing extended length flexible harnesses |
| US5518674A (en) * | 1991-06-28 | 1996-05-21 | Texas Instruments Incorporated | Method of forming thin film flexible interconnect for infrared detectors |
| US5288542A (en) * | 1992-07-14 | 1994-02-22 | International Business Machines Corporation | Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof |
| US5854534A (en) * | 1992-08-05 | 1998-12-29 | Fujitsu Limited | Controlled impedence interposer substrate |
| US5544017A (en) * | 1992-08-05 | 1996-08-06 | Fujitsu Limited | Multichip module substrate |
| US5572140A (en) * | 1993-08-25 | 1996-11-05 | Sunright Limited | Reusable carrier for burn-in/testing on non packaged die |
| US5382759A (en) * | 1993-09-28 | 1995-01-17 | Trw Inc. | Massive parallel interconnection attachment using flexible circuit |
| US5534466A (en) * | 1995-06-01 | 1996-07-09 | International Business Machines Corporation | Method of making area direct transfer multilayer thin film structure |
| US5757079A (en) * | 1995-12-21 | 1998-05-26 | International Business Machines Corporation | Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages and the resulting MLTF structure |
| US6541709B1 (en) | 1996-11-01 | 2003-04-01 | International Business Machines Corporation | Inherently robust repair process for thin film circuitry using uv laser |
| US5818697A (en) * | 1997-03-21 | 1998-10-06 | International Business Machines Corporation | Flexible thin film ball grid array containing solder mask |
| US6071597A (en) * | 1997-08-28 | 2000-06-06 | 3M Innovative Properties Company | Flexible circuits and carriers and process for manufacture |
| US5976391A (en) * | 1998-01-13 | 1999-11-02 | Ford Motor Company | Continuous Flexible chemically-milled circuit assembly with multiple conductor layers and method of making same |
| US6036809A (en) * | 1999-02-16 | 2000-03-14 | International Business Machines Corporation | Process for releasing a thin-film structure from a substrate |
| US6235544B1 (en) | 1999-04-20 | 2001-05-22 | International Business Machines Corporation | Seed metal delete process for thin film repair solutions using direct UV laser |
| US6335495B1 (en) | 1999-06-29 | 2002-01-01 | International Business Machines Corporation | Patterning a layered chrome-copper structure disposed on a dielectric substrate |
| US6391220B1 (en) | 1999-08-18 | 2002-05-21 | Fujitsu Limited, Inc. | Methods for fabricating flexible circuit structures |
| US6316734B1 (en) | 2000-03-07 | 2001-11-13 | 3M Innovative Properties Company | Flexible circuits with static discharge protection and process for manufacture |
| US6459043B1 (en) | 2001-03-29 | 2002-10-01 | 3M Innovative Properties Company | Flexible circuit with electrostatic damage limiting feature and method of manufacture |
| US6815620B2 (en) * | 2001-03-29 | 2004-11-09 | 3M Innovative Properties Company | Flexible circuit with electrostatic damage limiting feature |
| US6995954B1 (en) | 2001-07-13 | 2006-02-07 | Magnecomp Corporation | ESD protected suspension interconnect |
| US7489493B2 (en) * | 2003-12-01 | 2009-02-10 | Magnecomp Corporation | Method to form electrostatic discharge protection on flexible circuits using a diamond-like carbon material |
| TWI381433B (zh) * | 2006-07-27 | 2013-01-01 | 巨擘科技股份有限公司 | 結合ｉｃ整合基板與載板之結構及其製造方法與電子裝置之製造方法 |
| MY193261A (en) * | 2015-07-01 | 2022-09-28 | Qdos Interconnect Sdn Bhd | Integrated circuit package |
| US11842829B2 (en) | 2022-03-21 | 2023-12-12 | International Business Machines Corporation | Flexible electrical cable with four copper layers |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5517518B2 (enExample) * | 1972-01-28 | 1980-05-12 | ||
| US3823467A (en) * | 1972-07-07 | 1974-07-16 | Westinghouse Electric Corp | Solid-state circuit module |
| US3838984A (en) * | 1973-04-16 | 1974-10-01 | Sperry Rand Corp | Flexible carrier and interconnect for uncased ic chips |
| US4023197A (en) * | 1974-04-15 | 1977-05-10 | Ibm Corporation | Integrated circuit chip carrier and method for forming the same |
| EP0042943A1 (en) * | 1980-07-02 | 1982-01-06 | International Business Machines Corporation | Multilayer integrated circuit substrate structure and process for making such structures |
-
1982
- 1982-12-27 US US06/453,443 patent/US4480288A/en not_active Expired - Lifetime
-
1983
- 1983-08-25 JP JP58154231A patent/JPS59123255A/ja active Granted
- 1983-11-03 DE DE8383110965T patent/DE3377440D1/de not_active Expired
- 1983-11-03 EP EP83110965A patent/EP0114211B1/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62252952A (ja) * | 1986-01-31 | 1987-11-04 | テキサス インスツルメンツ インコーポレイテツド | 相互配線回路素子の製作方法および該方法により製作した集積回路製品 |
| JPS6442157A (en) * | 1987-07-24 | 1989-02-14 | Motorola Inc | Method of treating and transposing multi-level interconnection lines |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0148655B2 (enExample) | 1989-10-20 |
| EP0114211A2 (en) | 1984-08-01 |
| US4480288A (en) | 1984-10-30 |
| EP0114211B1 (en) | 1988-07-20 |
| DE3377440D1 (en) | 1988-08-25 |
| EP0114211A3 (en) | 1985-12-11 |
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