JPH0148655B2 - - Google Patents
Info
- Publication number
- JPH0148655B2 JPH0148655B2 JP58154231A JP15423183A JPH0148655B2 JP H0148655 B2 JPH0148655 B2 JP H0148655B2 JP 58154231 A JP58154231 A JP 58154231A JP 15423183 A JP15423183 A JP 15423183A JP H0148655 B2 JPH0148655 B2 JP H0148655B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- polyimide
- chromium
- substrate
- circuitry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920001721 polyimide Polymers 0.000 claims description 46
- 239000004642 Polyimide Substances 0.000 claims description 44
- 239000000758 substrate Substances 0.000 claims description 18
- 238000005530 etching Methods 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 44
- 238000000034 method Methods 0.000 description 19
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 18
- 229910052782 aluminium Inorganic materials 0.000 description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 16
- ZTXONRUJVYXVTJ-UHFFFAOYSA-N chromium copper Chemical compound [Cr][Cu][Cr] ZTXONRUJVYXVTJ-UHFFFAOYSA-N 0.000 description 13
- 229920002120 photoresistant polymer Polymers 0.000 description 12
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 11
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 11
- 239000010408 film Substances 0.000 description 8
- 229910052804 chromium Inorganic materials 0.000 description 7
- 239000011651 chromium Substances 0.000 description 7
- 238000004544 sputter deposition Methods 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000013459 approach Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000009987 spinning Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/467—Adding a circuit layer by thin film methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0376—Etching temporary metallic carrier substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Wire Bonding (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US453443 | 1982-12-27 | ||
| US06/453,443 US4480288A (en) | 1982-12-27 | 1982-12-27 | Multi-layer flexible film module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59123255A JPS59123255A (ja) | 1984-07-17 |
| JPH0148655B2 true JPH0148655B2 (enExample) | 1989-10-20 |
Family
ID=23800610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58154231A Granted JPS59123255A (ja) | 1982-12-27 | 1983-08-25 | 複層フレキシブル・フイルム・モジユ−ル及びその製法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4480288A (enExample) |
| EP (1) | EP0114211B1 (enExample) |
| JP (1) | JPS59123255A (enExample) |
| DE (1) | DE3377440D1 (enExample) |
Families Citing this family (70)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5008656A (en) * | 1984-12-20 | 1991-04-16 | Raytheon Company | Flexible cable assembly |
| US4949224A (en) * | 1985-09-20 | 1990-08-14 | Sharp Kabushiki Kaisha | Structure for mounting a semiconductor device |
| US4709468A (en) * | 1986-01-31 | 1987-12-01 | Texas Instruments Incorporated | Method for producing an integrated circuit product having a polyimide film interconnection structure |
| WO1987006766A1 (en) * | 1986-05-01 | 1987-11-05 | Honeywell Inc. | Multiple integrated circuit interconnection arrangement |
| US4681654A (en) * | 1986-05-21 | 1987-07-21 | International Business Machines Corporation | Flexible film semiconductor chip carrier |
| US4711791A (en) * | 1986-08-04 | 1987-12-08 | The Boc Group, Inc. | Method of making a flexible microcircuit |
| US4945399A (en) * | 1986-09-30 | 1990-07-31 | International Business Machines Corporation | Electronic package with integrated distributed decoupling capacitors |
| US4873615A (en) * | 1986-10-09 | 1989-10-10 | Amp Incorporated | Semiconductor chip carrier system |
| US4744008A (en) * | 1986-11-18 | 1988-05-10 | International Business Machines Corporation | Flexible film chip carrier with decoupling capacitors |
| US4681655A (en) * | 1986-11-24 | 1987-07-21 | Microelectronics And Computer Technology Corporation | Electrical interconnect support system with low dielectric constant |
| US4766670A (en) * | 1987-02-02 | 1988-08-30 | International Business Machines Corporation | Full panel electronic packaging structure and method of making same |
| US4855867A (en) * | 1987-02-02 | 1989-08-08 | International Business Machines Corporation | Full panel electronic packaging structure |
| US5159535A (en) * | 1987-03-11 | 1992-10-27 | International Business Machines Corporation | Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate |
| US4788767A (en) * | 1987-03-11 | 1988-12-06 | International Business Machines Corporation | Method for mounting a flexible film semiconductor chip carrier on a circuitized substrate |
| US5170931A (en) * | 1987-03-11 | 1992-12-15 | International Business Machines Corporation | Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate |
| GB8706857D0 (en) * | 1987-03-23 | 1987-04-29 | Bradley International Ltd Alle | Chip carriers |
| US4933810A (en) * | 1987-04-30 | 1990-06-12 | Honeywell Inc. | Integrated circuit interconnector |
| US4812191A (en) * | 1987-06-01 | 1989-03-14 | Digital Equipment Corporation | Method of forming a multilevel interconnection device |
| US4940510A (en) * | 1987-06-01 | 1990-07-10 | Digital Equipment Corporation | Method of etching in the presence of positive photoresist |
| US4774127A (en) * | 1987-06-15 | 1988-09-27 | Tektronix, Inc. | Fabrication of a multilayer conductive pattern on a dielectric substrate |
| US4743568A (en) * | 1987-07-24 | 1988-05-10 | Motorola Inc. | Multilevel interconnect transfer process |
| US4855872A (en) * | 1987-08-13 | 1989-08-08 | General Electric Company | Leadless ceramic chip carrier printed wiring board adapter |
| JPH0183331U (enExample) * | 1987-11-25 | 1989-06-02 | ||
| US6288561B1 (en) * | 1988-05-16 | 2001-09-11 | Elm Technology Corporation | Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus |
| US5225771A (en) * | 1988-05-16 | 1993-07-06 | Dri Technology Corp. | Making and testing an integrated circuit using high density probe points |
| US4924589A (en) * | 1988-05-16 | 1990-05-15 | Leedy Glenn J | Method of making and testing an integrated circuit |
| US5512397A (en) * | 1988-05-16 | 1996-04-30 | Leedy; Glenn J. | Stepper scanner discretionary lithography and common mask discretionary lithography for integrated circuits |
| JPH0638464B2 (ja) * | 1988-05-26 | 1994-05-18 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | 薄い可撓性基板構造体 |
| US4937707A (en) * | 1988-05-26 | 1990-06-26 | International Business Machines Corporation | Flexible carrier for an electronic device |
| US4965700A (en) * | 1988-05-26 | 1990-10-23 | International Business Machines Corporation | Thin film package for mixed bonding of chips |
| US4987100A (en) * | 1988-05-26 | 1991-01-22 | International Business Machines Corporation | Flexible carrier for an electronic device |
| US5216807A (en) * | 1988-05-31 | 1993-06-08 | Canon Kabushiki Kaisha | Method of producing electrical connection members |
| JP2702507B2 (ja) * | 1988-05-31 | 1998-01-21 | キヤノン株式会社 | 電気的接続部材及びその製造方法 |
| US4906803A (en) * | 1988-11-08 | 1990-03-06 | International Business Machines Corporation | Flexible supporting cable for an electronic device and method of making same |
| JP2676112B2 (ja) * | 1989-05-01 | 1997-11-12 | イビデン株式会社 | 電子部品搭載用基板の製造方法 |
| US4899439A (en) * | 1989-06-15 | 1990-02-13 | Microelectronics And Computer Technology Corporation | Method of fabricating a high density electrical interconnect |
| US5072075A (en) * | 1989-06-28 | 1991-12-10 | Digital Equipment Corporation | Double-sided hybrid high density circuit board and method of making same |
| EP0411165B1 (en) * | 1989-07-26 | 1997-04-02 | International Business Machines Corporation | Method of forming of an integrated circuit chip packaging structure |
| US5244833A (en) * | 1989-07-26 | 1993-09-14 | International Business Machines Corporation | Method for manufacturing an integrated circuit chip bump electrode using a polymer layer and a photoresist layer |
| US4920639A (en) * | 1989-08-04 | 1990-05-01 | Microelectronics And Computer Technology Corporation | Method of making a multilevel electrical airbridge interconnect |
| US4997517A (en) * | 1990-01-09 | 1991-03-05 | Olin Corporation | Multi-metal layer interconnect tape for tape automated bonding |
| US4999699A (en) * | 1990-03-14 | 1991-03-12 | International Business Machines Corporation | Solder interconnection structure and process for making |
| JP3280394B2 (ja) * | 1990-04-05 | 2002-05-13 | ロックヒード マーティン コーポレーション | 電子装置 |
| US5065227A (en) * | 1990-06-04 | 1991-11-12 | International Business Machines Corporation | Integrated circuit packaging using flexible substrate |
| JPH0450820A (ja) * | 1990-06-14 | 1992-02-19 | Seiko Epson Corp | 配線接続装置 |
| US5250758A (en) * | 1991-05-21 | 1993-10-05 | Elf Technologies, Inc. | Methods and systems of preparing extended length flexible harnesses |
| US5518674A (en) * | 1991-06-28 | 1996-05-21 | Texas Instruments Incorporated | Method of forming thin film flexible interconnect for infrared detectors |
| US5288542A (en) * | 1992-07-14 | 1994-02-22 | International Business Machines Corporation | Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof |
| US5854534A (en) * | 1992-08-05 | 1998-12-29 | Fujitsu Limited | Controlled impedence interposer substrate |
| US5544017A (en) * | 1992-08-05 | 1996-08-06 | Fujitsu Limited | Multichip module substrate |
| US5572140A (en) * | 1993-08-25 | 1996-11-05 | Sunright Limited | Reusable carrier for burn-in/testing on non packaged die |
| US5382759A (en) * | 1993-09-28 | 1995-01-17 | Trw Inc. | Massive parallel interconnection attachment using flexible circuit |
| US5534466A (en) * | 1995-06-01 | 1996-07-09 | International Business Machines Corporation | Method of making area direct transfer multilayer thin film structure |
| US5757079A (en) * | 1995-12-21 | 1998-05-26 | International Business Machines Corporation | Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages and the resulting MLTF structure |
| US6541709B1 (en) | 1996-11-01 | 2003-04-01 | International Business Machines Corporation | Inherently robust repair process for thin film circuitry using uv laser |
| US5818697A (en) * | 1997-03-21 | 1998-10-06 | International Business Machines Corporation | Flexible thin film ball grid array containing solder mask |
| US6071597A (en) * | 1997-08-28 | 2000-06-06 | 3M Innovative Properties Company | Flexible circuits and carriers and process for manufacture |
| US5976391A (en) * | 1998-01-13 | 1999-11-02 | Ford Motor Company | Continuous Flexible chemically-milled circuit assembly with multiple conductor layers and method of making same |
| US6036809A (en) * | 1999-02-16 | 2000-03-14 | International Business Machines Corporation | Process for releasing a thin-film structure from a substrate |
| US6235544B1 (en) | 1999-04-20 | 2001-05-22 | International Business Machines Corporation | Seed metal delete process for thin film repair solutions using direct UV laser |
| US6335495B1 (en) | 1999-06-29 | 2002-01-01 | International Business Machines Corporation | Patterning a layered chrome-copper structure disposed on a dielectric substrate |
| US6391220B1 (en) | 1999-08-18 | 2002-05-21 | Fujitsu Limited, Inc. | Methods for fabricating flexible circuit structures |
| US6316734B1 (en) | 2000-03-07 | 2001-11-13 | 3M Innovative Properties Company | Flexible circuits with static discharge protection and process for manufacture |
| US6459043B1 (en) | 2001-03-29 | 2002-10-01 | 3M Innovative Properties Company | Flexible circuit with electrostatic damage limiting feature and method of manufacture |
| US6815620B2 (en) * | 2001-03-29 | 2004-11-09 | 3M Innovative Properties Company | Flexible circuit with electrostatic damage limiting feature |
| US6995954B1 (en) | 2001-07-13 | 2006-02-07 | Magnecomp Corporation | ESD protected suspension interconnect |
| US7489493B2 (en) * | 2003-12-01 | 2009-02-10 | Magnecomp Corporation | Method to form electrostatic discharge protection on flexible circuits using a diamond-like carbon material |
| TWI381433B (zh) * | 2006-07-27 | 2013-01-01 | 巨擘科技股份有限公司 | 結合ｉｃ整合基板與載板之結構及其製造方法與電子裝置之製造方法 |
| MY193261A (en) * | 2015-07-01 | 2022-09-28 | Qdos Interconnect Sdn Bhd | Integrated circuit package |
| US11842829B2 (en) | 2022-03-21 | 2023-12-12 | International Business Machines Corporation | Flexible electrical cable with four copper layers |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5517518B2 (enExample) * | 1972-01-28 | 1980-05-12 | ||
| US3823467A (en) * | 1972-07-07 | 1974-07-16 | Westinghouse Electric Corp | Solid-state circuit module |
| US3838984A (en) * | 1973-04-16 | 1974-10-01 | Sperry Rand Corp | Flexible carrier and interconnect for uncased ic chips |
| US4023197A (en) * | 1974-04-15 | 1977-05-10 | Ibm Corporation | Integrated circuit chip carrier and method for forming the same |
| EP0042943A1 (en) * | 1980-07-02 | 1982-01-06 | International Business Machines Corporation | Multilayer integrated circuit substrate structure and process for making such structures |
-
1982
- 1982-12-27 US US06/453,443 patent/US4480288A/en not_active Expired - Lifetime
-
1983
- 1983-08-25 JP JP58154231A patent/JPS59123255A/ja active Granted
- 1983-11-03 DE DE8383110965T patent/DE3377440D1/de not_active Expired
- 1983-11-03 EP EP83110965A patent/EP0114211B1/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59123255A (ja) | 1984-07-17 |
| EP0114211A2 (en) | 1984-08-01 |
| US4480288A (en) | 1984-10-30 |
| EP0114211B1 (en) | 1988-07-20 |
| DE3377440D1 (en) | 1988-08-25 |
| EP0114211A3 (en) | 1985-12-11 |
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