JPS59123254A - リボン状材料の反り修正装置 - Google Patents

リボン状材料の反り修正装置

Info

Publication number
JPS59123254A
JPS59123254A JP23346282A JP23346282A JPS59123254A JP S59123254 A JPS59123254 A JP S59123254A JP 23346282 A JP23346282 A JP 23346282A JP 23346282 A JP23346282 A JP 23346282A JP S59123254 A JPS59123254 A JP S59123254A
Authority
JP
Japan
Prior art keywords
lead frame
die
lead
reversal
frames
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23346282A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0430186B2 (enrdf_load_stackoverflow
Inventor
Akinori Nakatsuru
中津留　彰典
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP23346282A priority Critical patent/JPS59123254A/ja
Publication of JPS59123254A publication Critical patent/JPS59123254A/ja
Publication of JPH0430186B2 publication Critical patent/JPH0430186B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP23346282A 1982-12-28 1982-12-28 リボン状材料の反り修正装置 Granted JPS59123254A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23346282A JPS59123254A (ja) 1982-12-28 1982-12-28 リボン状材料の反り修正装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23346282A JPS59123254A (ja) 1982-12-28 1982-12-28 リボン状材料の反り修正装置

Publications (2)

Publication Number Publication Date
JPS59123254A true JPS59123254A (ja) 1984-07-17
JPH0430186B2 JPH0430186B2 (enrdf_load_stackoverflow) 1992-05-21

Family

ID=16955406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23346282A Granted JPS59123254A (ja) 1982-12-28 1982-12-28 リボン状材料の反り修正装置

Country Status (1)

Country Link
JP (1) JPS59123254A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010269368A (ja) * 2009-05-25 2010-12-02 T K R:Kk プレス金型構造

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7469367B2 (ja) * 2022-05-16 2024-04-16 矢崎総業株式会社 反り修正装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010269368A (ja) * 2009-05-25 2010-12-02 T K R:Kk プレス金型構造

Also Published As

Publication number Publication date
JPH0430186B2 (enrdf_load_stackoverflow) 1992-05-21

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