JPS59119774A - 光結合半導体装置 - Google Patents
光結合半導体装置Info
- Publication number
- JPS59119774A JPS59119774A JP57232809A JP23280982A JPS59119774A JP S59119774 A JPS59119774 A JP S59119774A JP 57232809 A JP57232809 A JP 57232809A JP 23280982 A JP23280982 A JP 23280982A JP S59119774 A JPS59119774 A JP S59119774A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- light
- pellet
- light emitting
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 9
- 230000008878 coupling Effects 0.000 title abstract 3
- 238000010168 coupling process Methods 0.000 title abstract 3
- 238000005859 coupling reaction Methods 0.000 title abstract 3
- 239000002184 metal Substances 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 239000008188 pellet Substances 0.000 abstract description 46
- 239000003822 epoxy resin Substances 0.000 abstract description 12
- 229920000647 polyepoxide Polymers 0.000 abstract description 12
- 238000000465 moulding Methods 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 6
- 238000009413 insulation Methods 0.000 abstract description 5
- 239000004593 Epoxy Substances 0.000 abstract 1
- 238000007598 dipping method Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57232809A JPS59119774A (ja) | 1982-12-25 | 1982-12-25 | 光結合半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57232809A JPS59119774A (ja) | 1982-12-25 | 1982-12-25 | 光結合半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59119774A true JPS59119774A (ja) | 1984-07-11 |
JPH0355989B2 JPH0355989B2 (enrdf_load_stackoverflow) | 1991-08-27 |
Family
ID=16945100
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57232809A Granted JPS59119774A (ja) | 1982-12-25 | 1982-12-25 | 光結合半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59119774A (enrdf_load_stackoverflow) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6373678A (ja) * | 1986-09-17 | 1988-04-04 | Mitsubishi Electric Corp | 半導体装置 |
US5127071A (en) * | 1990-03-13 | 1992-06-30 | Sumitomo Electric Industries, Ltd. | Optical module including receptacle, and method of producing the same |
US5170453A (en) * | 1990-08-28 | 1992-12-08 | Sumitomo Electric Industries, Ltd. | Optical module |
US5304818A (en) * | 1990-03-16 | 1994-04-19 | Sumitomo Electric Industries, Ltd. | Lead frame |
-
1982
- 1982-12-25 JP JP57232809A patent/JPS59119774A/ja active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6373678A (ja) * | 1986-09-17 | 1988-04-04 | Mitsubishi Electric Corp | 半導体装置 |
US5127071A (en) * | 1990-03-13 | 1992-06-30 | Sumitomo Electric Industries, Ltd. | Optical module including receptacle, and method of producing the same |
US5304818A (en) * | 1990-03-16 | 1994-04-19 | Sumitomo Electric Industries, Ltd. | Lead frame |
US5170453A (en) * | 1990-08-28 | 1992-12-08 | Sumitomo Electric Industries, Ltd. | Optical module |
Also Published As
Publication number | Publication date |
---|---|
JPH0355989B2 (enrdf_load_stackoverflow) | 1991-08-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7405104B2 (en) | Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same | |
JPH10261821A (ja) | 半導体発光装置及びその製造方法 | |
JPH10144965A (ja) | 光半導体装置及びその製造方法 | |
JP2000174350A (ja) | 光半導体モジュール | |
US20190181305A1 (en) | Light emitting device package | |
JP4117868B2 (ja) | 光結合素子 | |
JPH0537021A (ja) | 光半導体装置 | |
JPS59119774A (ja) | 光結合半導体装置 | |
JPS56142657A (en) | Resin-sealed semiconductor device | |
JPH11204808A (ja) | 光半導体素子 | |
JPS58194382A (ja) | 発光装置用電極構体 | |
JPH01102947A (ja) | 樹脂封止型半導体デバイスおよびリードフレーム | |
JP3534561B2 (ja) | 光結合素子 | |
JP2981371B2 (ja) | 光結合装置 | |
JP2004063764A (ja) | 光結合半導体装置、およびその製造方法 | |
JPS5998565A (ja) | 光結合素子 | |
JP3489979B2 (ja) | Mos−fet出力光結合素子及びその製造方法 | |
JPS59143348A (ja) | 電子部品 | |
JPH02198178A (ja) | 発光ダイオード装置 | |
JPS62247575A (ja) | 光結合素子の製造方法 | |
JPS6312181A (ja) | 樹脂封止型半導体光結合装置 | |
JP2005093495A (ja) | 受光素子、これを用いた光結合半導体装置、及びその製造方法 | |
JPH0645636A (ja) | 受発光素子およびこれを利用した受発光装置 | |
JP3015245B2 (ja) | 面実装型半導体素子および光結合素子 | |
CN118899351A (zh) | 一种光电耦合器的封装结构及光电耦合器 |