JPS59117225A - フエイスダウンボンダ - Google Patents

フエイスダウンボンダ

Info

Publication number
JPS59117225A
JPS59117225A JP22632182A JP22632182A JPS59117225A JP S59117225 A JPS59117225 A JP S59117225A JP 22632182 A JP22632182 A JP 22632182A JP 22632182 A JP22632182 A JP 22632182A JP S59117225 A JPS59117225 A JP S59117225A
Authority
JP
Japan
Prior art keywords
positioning
mark
picture
lines
automation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22632182A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0380346B2 (enrdf_load_stackoverflow
Inventor
Takahiro Furuhashi
古橋　隆宏
Osamu Tachibana
立花　修
Takashi Asayama
朝山　隆史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Hitachi High Tech Corp
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Hitachi Ome Electronic Co Ltd
Hitachi Electronics Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd, Hitachi Ome Electronic Co Ltd, Hitachi Electronics Engineering Co Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP22632182A priority Critical patent/JPS59117225A/ja
Publication of JPS59117225A publication Critical patent/JPS59117225A/ja
Publication of JPH0380346B2 publication Critical patent/JPH0380346B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75753—Means for optical alignment, e.g. sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP22632182A 1982-12-24 1982-12-24 フエイスダウンボンダ Granted JPS59117225A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22632182A JPS59117225A (ja) 1982-12-24 1982-12-24 フエイスダウンボンダ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22632182A JPS59117225A (ja) 1982-12-24 1982-12-24 フエイスダウンボンダ

Publications (2)

Publication Number Publication Date
JPS59117225A true JPS59117225A (ja) 1984-07-06
JPH0380346B2 JPH0380346B2 (enrdf_load_stackoverflow) 1991-12-24

Family

ID=16843355

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22632182A Granted JPS59117225A (ja) 1982-12-24 1982-12-24 フエイスダウンボンダ

Country Status (1)

Country Link
JP (1) JPS59117225A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007503111A (ja) * 2003-08-21 2007-02-15 ヘッセ・ウント・クナイプス・ゲーエムベーハー ボンディングヘッドエレメントのカメラを補助に用いた調節

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS574131A (en) * 1980-06-10 1982-01-09 Nippon Abionikusu Kk Device for mounting of semiconductor chips

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS574131A (en) * 1980-06-10 1982-01-09 Nippon Abionikusu Kk Device for mounting of semiconductor chips

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007503111A (ja) * 2003-08-21 2007-02-15 ヘッセ・ウント・クナイプス・ゲーエムベーハー ボンディングヘッドエレメントのカメラを補助に用いた調節
JP2011040780A (ja) * 2003-08-21 2011-02-24 Hesse & Knipps Gmbh ボンディングヘッドエレメントの位置合わせ方法及び超音波ボンダー

Also Published As

Publication number Publication date
JPH0380346B2 (enrdf_load_stackoverflow) 1991-12-24

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