JPH0380346B2 - - Google Patents

Info

Publication number
JPH0380346B2
JPH0380346B2 JP57226321A JP22632182A JPH0380346B2 JP H0380346 B2 JPH0380346 B2 JP H0380346B2 JP 57226321 A JP57226321 A JP 57226321A JP 22632182 A JP22632182 A JP 22632182A JP H0380346 B2 JPH0380346 B2 JP H0380346B2
Authority
JP
Japan
Prior art keywords
patterns
chip
pattern
face
alignment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57226321A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59117225A (ja
Inventor
Takahiro Furuhashi
Osamu Tachibana
Takashi Asayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Hitachi High Tech Corp
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Hitachi Electronics Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd, Hitachi Electronics Engineering Co Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP22632182A priority Critical patent/JPS59117225A/ja
Publication of JPS59117225A publication Critical patent/JPS59117225A/ja
Publication of JPH0380346B2 publication Critical patent/JPH0380346B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75753—Means for optical alignment, e.g. sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP22632182A 1982-12-24 1982-12-24 フエイスダウンボンダ Granted JPS59117225A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22632182A JPS59117225A (ja) 1982-12-24 1982-12-24 フエイスダウンボンダ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22632182A JPS59117225A (ja) 1982-12-24 1982-12-24 フエイスダウンボンダ

Publications (2)

Publication Number Publication Date
JPS59117225A JPS59117225A (ja) 1984-07-06
JPH0380346B2 true JPH0380346B2 (enrdf_load_stackoverflow) 1991-12-24

Family

ID=16843355

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22632182A Granted JPS59117225A (ja) 1982-12-24 1982-12-24 フエイスダウンボンダ

Country Status (1)

Country Link
JP (1) JPS59117225A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10338809B4 (de) * 2003-08-21 2008-05-21 Hesse & Knipps Gmbh Verfahren und Vorrichtung zur Justage von Bondkopfelementen

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS574131A (en) * 1980-06-10 1982-01-09 Nippon Abionikusu Kk Device for mounting of semiconductor chips

Also Published As

Publication number Publication date
JPS59117225A (ja) 1984-07-06

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