JPS6257098B2 - - Google Patents

Info

Publication number
JPS6257098B2
JPS6257098B2 JP7721780A JP7721780A JPS6257098B2 JP S6257098 B2 JPS6257098 B2 JP S6257098B2 JP 7721780 A JP7721780 A JP 7721780A JP 7721780 A JP7721780 A JP 7721780A JP S6257098 B2 JPS6257098 B2 JP S6257098B2
Authority
JP
Japan
Prior art keywords
substrate
semiconductor chip
camera
positioning device
tray
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7721780A
Other languages
English (en)
Japanese (ja)
Other versions
JPS574131A (en
Inventor
Kimio Koike
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Avionics Co Ltd
Original Assignee
Nippon Avionics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Avionics Co Ltd filed Critical Nippon Avionics Co Ltd
Priority to JP7721780A priority Critical patent/JPS574131A/ja
Publication of JPS574131A publication Critical patent/JPS574131A/ja
Publication of JPS6257098B2 publication Critical patent/JPS6257098B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Wire Bonding (AREA)
JP7721780A 1980-06-10 1980-06-10 Device for mounting of semiconductor chips Granted JPS574131A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7721780A JPS574131A (en) 1980-06-10 1980-06-10 Device for mounting of semiconductor chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7721780A JPS574131A (en) 1980-06-10 1980-06-10 Device for mounting of semiconductor chips

Publications (2)

Publication Number Publication Date
JPS574131A JPS574131A (en) 1982-01-09
JPS6257098B2 true JPS6257098B2 (enrdf_load_stackoverflow) 1987-11-30

Family

ID=13627670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7721780A Granted JPS574131A (en) 1980-06-10 1980-06-10 Device for mounting of semiconductor chips

Country Status (1)

Country Link
JP (1) JPS574131A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5972145A (ja) * 1982-10-19 1984-04-24 Shinkawa Ltd フリップチップボンディング装置及び方法
JPS59117225A (ja) * 1982-12-24 1984-07-06 Hitachi Tokyo Electronics Co Ltd フエイスダウンボンダ
JPS601900A (ja) * 1983-06-17 1985-01-08 松下電器産業株式会社 認識付電子部品実装装置

Also Published As

Publication number Publication date
JPS574131A (en) 1982-01-09

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