JPS5911647A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS5911647A JPS5911647A JP12090382A JP12090382A JPS5911647A JP S5911647 A JPS5911647 A JP S5911647A JP 12090382 A JP12090382 A JP 12090382A JP 12090382 A JP12090382 A JP 12090382A JP S5911647 A JPS5911647 A JP S5911647A
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- wiring
- photo resist
- steep
- metal wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000011229 interlayer Substances 0.000 claims abstract description 30
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 28
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 22
- 230000000873 masking effect Effects 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 9
- 239000010410 layer Substances 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 4
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 238000005530 etching Methods 0.000 abstract description 2
- 230000001429 stepping effect Effects 0.000 abstract 3
- 239000010408 film Substances 0.000 description 22
- 238000007747 plating Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 241000209507 Camellia Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 235000018597 common camellia Nutrition 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12090382A JPS5911647A (ja) | 1982-07-12 | 1982-07-12 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12090382A JPS5911647A (ja) | 1982-07-12 | 1982-07-12 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5911647A true JPS5911647A (ja) | 1984-01-21 |
| JPS6362104B2 JPS6362104B2 (enrdf_load_stackoverflow) | 1988-12-01 |
Family
ID=14797844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12090382A Granted JPS5911647A (ja) | 1982-07-12 | 1982-07-12 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5911647A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62146224A (ja) * | 1985-12-20 | 1987-06-30 | Kobe Steel Ltd | 強度のばらつきの少ない高靭性高張力高炭素鋼線材の製造方法 |
| JPH03116852A (ja) * | 1989-09-29 | 1991-05-17 | Nec Corp | 半導体装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57100748A (en) * | 1980-12-15 | 1982-06-23 | Toshiba Corp | Manufacture of semiconductor device |
-
1982
- 1982-07-12 JP JP12090382A patent/JPS5911647A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57100748A (en) * | 1980-12-15 | 1982-06-23 | Toshiba Corp | Manufacture of semiconductor device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62146224A (ja) * | 1985-12-20 | 1987-06-30 | Kobe Steel Ltd | 強度のばらつきの少ない高靭性高張力高炭素鋼線材の製造方法 |
| JPH03116852A (ja) * | 1989-09-29 | 1991-05-17 | Nec Corp | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6362104B2 (enrdf_load_stackoverflow) | 1988-12-01 |
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